| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/12/2005 | US6879030 Strengthened window-type semiconductor package |
| 04/12/2005 | US6879028 Multi-die semiconductor package |
| 04/12/2005 | US6879027 Semiconductor device having bumps |
| 04/12/2005 | US6879025 Semiconductor device incorporating a dicing technique for wafer separation and a method for manufacturing the same |
| 04/12/2005 | US6879024 Strobe light control circuit and IGBT device |
| 04/12/2005 | US6879023 Seal ring for integrated circuits |
| 04/12/2005 | US6879022 Inductance device formed on semiconductor substrate |
| 04/12/2005 | US6879021 Electronically programmable antifuse and circuits made therewith |
| 04/12/2005 | US6879020 Semiconductor device |
| 04/12/2005 | US6879019 Guard ring of a combination wafer or singulated die |
| 04/12/2005 | US6879018 Fuse for use in a semiconductor device, and semiconductor devices including the fuse |
| 04/12/2005 | US6879017 Self-planarizing |
| 04/12/2005 | US6879015 Semiconductor device with isolated intermetal dielectrics |
| 04/12/2005 | US6879011 Magnetically shielded circuit board |
| 04/12/2005 | US6879010 Ceramic biomolecule imaging chip |
| 04/12/2005 | US6879008 Integrated thermal difference sensor for power dissipating device |
| 04/12/2005 | US6879004 High voltage difference amplifier with spark gap ESD protection |
| 04/12/2005 | US6879003 Electrostatic discharge (ESD) protection MOS device and ESD circuitry thereof |
| 04/12/2005 | US6878999 Transistor with improved safe operating area |
| 04/12/2005 | US6878994 MOSgated device with accumulated channel region and Schottky contact |
| 04/12/2005 | US6878965 Test structure for determining a region of a deep trench outdiffusion in a memory cell array |
| 04/12/2005 | US6878964 Ground-signal-ground pad layout for device tester structure |
| 04/12/2005 | US6878963 Device for testing electrical characteristics of chips |
| 04/12/2005 | US6878875 Small form factor optical transceiver with extended transmission range |
| 04/12/2005 | US6878783 A curable blends comprising a cyclic polymer of epoxy resin, curing agent hexahydro-4-methylphthalic anhydride, boron compound halogen-free catalyst; use for packaging a chip, light emitting diode; resist to heat, oxidation, radiation |
| 04/12/2005 | US6878643 Electronic unit integrated into a flexible polymer body |
| 04/12/2005 | US6878637 Method for fabricating semiconductor device capable of improving process margin of self align contact |
| 04/12/2005 | US6878632 Semiconductor device having a conductive layer with a cobalt tungsten phosphorus coating and a manufacturing method thereof |
| 04/12/2005 | US6878625 Method for manufacturing semiconductor device |
| 04/12/2005 | US6878624 Pre-anneal of CoSi, to prevent formation of amorphous layer between Ti-O-N and CoSi |
| 04/12/2005 | US6878614 Methods of forming integrated circuit devices including fuse wires having reduced cross-sectional areas and related structures |
| 04/12/2005 | US6878587 Method and structure for reducing contact aspect ratios |
| 04/12/2005 | US6878573 Method of manufacturing a semiconductor device and semiconductor device |
| 04/12/2005 | US6878572 High capacitance package substrate |
| 04/12/2005 | US6878570 Thin stacked package and manufacturing method thereof |
| 04/12/2005 | US6878561 Mask-alignment detection circuit in X and Y directions |
| 04/12/2005 | US6878559 Measurement of lateral diffusion of diffused layers |
| 04/12/2005 | US6878506 Method for manufacturing semiconductor device |
| 04/12/2005 | US6878465 Under bump metallurgy for Lead-Tin bump over copper pad |
| 04/12/2005 | US6878464 Glass-ceramic composite material and multilayered circuit substrate |
| 04/12/2005 | US6878448 Curability, moldability and mass productivity, reliability |
| 04/12/2005 | US6878396 Micro C-4 semiconductor die and method for depositing connection sites thereon |
| 04/12/2005 | US6877993 Packaged device adapter assembly with alignment structure and methods regarding same |
| 04/12/2005 | US6877954 Eccentric heat dispensing fans |
| 04/12/2005 | US6877668 Marking method for semiconductor wafer |
| 04/12/2005 | CA2195493C Balanced integrated semiconductor device operating with a parallel resonator circuit |
| 04/12/2005 | CA2122278C Adhesive sheet for wafer and process for preparing semiconductor apparatus using the same |
| 04/07/2005 | WO2005032225A1 Ceramic circuit board, method for making the same, and power module |
| 04/07/2005 | WO2005031875A1 Structure of package for semiconductor image pickup device and fabrication method thereof |
| 04/07/2005 | WO2005031873A1 An electronic package of photo-sensing semiconductor devices, and the fabrication and assembly thereof |
| 04/07/2005 | WO2005031871A1 Semiconductor device |
| 04/07/2005 | WO2005031867A2 Conductor track connection structure and associated production method |
| 04/07/2005 | WO2005031866A2 System for connection in integrated mos structures |
| 04/07/2005 | WO2005031865A1 Electronic package having a folded flexible substrate and method of manufacturing the same |
| 04/07/2005 | WO2005031864A1 Thermal interface material with aligned carbon nanotubes |
| 04/07/2005 | WO2005031863A1 Structure and method of making capped chips having vertical interconnects |
| 04/07/2005 | WO2005031862A1 Structure and method of making sealed capped chips |
| 04/07/2005 | WO2005031861A1 Structure and method of making capped chips including a flowable conductive medium |
| 04/07/2005 | WO2005031860A2 Electronic devices and methods for making same using nanotube regions to assist in thermal heat-sinking |
| 04/07/2005 | WO2005031854A1 Method for producing a multifunctional dielectric layer on a substrate |
| 04/07/2005 | WO2005031849A1 Semiconductor device |
| 04/07/2005 | WO2005031848A1 Designs and methods for conductive bumps |
| 04/07/2005 | WO2005031811A2 Process and integration scheme for fabricating conductive components through-vias and semiconductor components including conductive through-wafer vias |
| 04/07/2005 | WO2005031807A2 Wafer-level moat structures |
| 04/07/2005 | WO2005031805A2 Multi-surface ic packaging structures and methods for their manufacture |
| 04/07/2005 | WO2005031238A1 Flat plate heat transfer device |
| 04/07/2005 | WO2004053443A8 Thermal mismatch compensation technique for integrated circuit assemblies |
| 04/07/2005 | WO2004001844A8 Thermal interface materials and methods for their preparation and use |
| 04/07/2005 | WO2003105224A3 Method and apparatus for cooling a portable computer |
| 04/07/2005 | WO2003100859A9 Method for producing a component comprising a conductor structure that is suitable for use at high frequencies and corresponding component |
| 04/07/2005 | US20050075854 Simulation circuit pattern evaluation method, manufacturing method of semiconductor integrated circuit, test substrate, and test substrate group |
| 04/07/2005 | US20050075474 Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device |
| 04/07/2005 | US20050075080 Inter-chip and intra-chip wireless communications systems |
| 04/07/2005 | US20050074995 Card connector having a heat radiation member without inhibiting insertion and removal of a card |
| 04/07/2005 | US20050074976 Method for polishing copper layer and method for forming copper layer wiring using the same |
| 04/07/2005 | US20050074969 Contact structure of semiconductor device and method of forming the same |
| 04/07/2005 | US20050074966 Local multilayered metallization |
| 04/07/2005 | US20050074961 Methods for selective integration of airgaps and devices made by such methods |
| 04/07/2005 | US20050074960 Methods for selective integration of airgaps and devices made by such methods |
| 04/07/2005 | US20050074959 Novel integration of wire bond pad with Ni/Au metallization |
| 04/07/2005 | US20050074954 Method and apparatus for producing ultra-thin semiconductor chip and method and apparatus for producing ultra-thin back-illuminated solid-state image pickup device |
| 04/07/2005 | US20050074953 Integrated re-combiner for electroosmotic pumps using porous frits |
| 04/07/2005 | US20050074945 [overlay mark and method of fabricating the same] |
| 04/07/2005 | US20050074934 Electrodeposited layer |
| 04/07/2005 | US20050074924 Circuitized substrate, method of making same and information handling system using same |
| 04/07/2005 | US20050074923 Metallic dam and method of forming therefor |
| 04/07/2005 | US20050074922 Process for producing resin-sealed type electronic device |
| 04/07/2005 | US20050074920 Surface treatment for oxidation removal in integrated circuit package assemblies |
| 04/07/2005 | US20050074919 Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates |
| 04/07/2005 | US20050074918 Pad structure for stress relief |
| 04/07/2005 | US20050074912 Method for manufacturing solid-state imaging devices |
| 04/07/2005 | US20050074908 Test structures and models for estimating the yield impact of dishing and/or voids |
| 04/07/2005 | US20050074905 Inductors in semiconductor devices and methods of manufacturing the same |
| 04/07/2005 | US20050074662 Valveless micro air delivery device |
| 04/07/2005 | US20050074627 Ceramic substrate for thin film electronic component, production method for the same and thin film electronic component using the same |
| 04/07/2005 | US20050074578 Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereof |
| 04/07/2005 | US20050074243 Optical module |
| 04/07/2005 | US20050073816 Thermal interface assembly and method for forming a thermal interface between a microelectronic component package and heat sink |
| 04/07/2005 | US20050073815 Imaging apparatus |
| 04/07/2005 | US20050073814 Magnetically enhanced convection heat sink |