Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2005
04/13/2005EP1523078A1 Optical semiconductor device
04/13/2005EP1523044A2 Imaging apparatus
04/13/2005EP1523043A2 Semiconductor device and method for manufacturing the same
04/13/2005EP1523040A2 Flip chip heat sink package and method
04/13/2005EP1523039A1 Chip card and fabrication method
04/13/2005EP1523038A2 Valveless micro air delivery device
04/13/2005EP1523037A2 Metal/ceramic bonding substrate and method for producing same
04/13/2005EP1523036A2 Semiconductor device heat sink package and method
04/13/2005EP1523035A2 Semiconductor package
04/13/2005EP1523034A2 Method of manufacturing silicon carbide film
04/13/2005EP1522100A1 Integrated circuit arrangement
04/13/2005EP1522099A1 Method and wafer for maintaining ultra clean bonding pads on a wafer
04/13/2005EP1414895B1 Flame retardant molding compositions
04/13/2005EP1350233A4 Process for the manufacture of novel, inexpensive radio frequency identification devices
04/13/2005EP1256262B1 Package for microwave components
04/13/2005EP0805614B1 Multilayered wiring board, prefabricated material for multilayered wiring board, process of manufacturing multilayered wiring board, electronic parts package, and method for forming conductive pillar
04/13/2005CN2692839Y Internal connection wire for improving covering uniformity of barrier layer
04/13/2005CN2692838Y Semiconductor device
04/13/2005CN2692837Y Heat radiating structure with water cooling, cooling effect
04/13/2005CN2692836Y Fixing structure for radiator
04/13/2005CN2692835Y Radiator with heat conducting tube
04/13/2005CN2692834Y Radiator fixer
04/13/2005CN2692833Y Strip for moulding packaging thin chip
04/13/2005CN2692832Y Chip packaging structural member
04/13/2005CN2692627Y Package for mounting on surface of chip
04/13/2005CN1606901A Multi-layer thermal interface and method for forming a thermal interface with low thermal resistance
04/13/2005CN1606805A Method for making a microcircuit card
04/13/2005CN1606804A Thin thermally enhanced flip chip in a leaded molded package
04/13/2005CN1606803A Method of manufacturing an electronic device
04/13/2005CN1606796A Apparatus incorporating small-feature-size and large-feature-size components and method for making same
04/13/2005CN1606403A Liquid cooling jacket
04/13/2005CN1606196A Connecting device using spiral contact
04/13/2005CN1606174A Semiconductor device and method for manufacturing the same
04/13/2005CN1606169A Semiconductor device and method for manufacturing the same
04/13/2005CN1606168A Metal-over-metal devices and the method for manufacturing same
04/13/2005CN1606160A Semiconductor device and method for making same, circuit base plate and electronic device
04/13/2005CN1606157A Semiconductor device with polysilicon fuse and method for trimming the same
04/13/2005CN1606156A Semiconductor device and method for making same
04/13/2005CN1606155A Pillar structures
04/13/2005CN1606154A Semiconductor device and method for making same
04/13/2005CN1606153A 液冷式电功率转换装置 Liquid-cooled power converter
04/13/2005CN1606152A Semiconductor device and method of fabricating the same
04/13/2005CN1606151A Method and structure for a wafer level packaging
04/13/2005CN1606143A Semiconductor element mounting method and mounting substrate
04/13/2005CN1606142A Electronic circuit device and its manufacturing method and device
04/13/2005CN1606141A Lead frame making method, semiconductor device making method and semiconductor device
04/13/2005CN1605902A LCD device
04/13/2005CN1197443C Assembly of an electronic component with spring packaging
04/13/2005CN1197442C 电子电路组件 Electronic circuit assembly
04/13/2005CN1197211C Ic插座 Ic Socket
04/13/2005CN1197178C Piezoelectric element and package thereof
04/13/2005CN1197166C Integrated circuit for high frequency application and method for manufacturing same
04/13/2005CN1197162C Integrated circuit possessing differential signal line balancing intorsion
04/13/2005CN1197156C 半导体设备 Semiconductor Equipment
04/13/2005CN1197154C High voltage shield
04/13/2005CN1197153C Semiconductor device
04/13/2005CN1197152C Surface electrode structure on ceramic multilayer substrate and its mfg. method
04/13/2005CN1197151C Semiconductor device
04/13/2005CN1197150C Semiconductor device, circuit board, method of mfg. circuit board, and electronic device
04/13/2005CN1197149C Turbolating plate with downward bent part
04/13/2005CN1197145C Convex formation method, semiconductor device and making method and semiconductor chip
04/13/2005CN1197144C Method for producing semiconductor device
04/13/2005CN1197137C Semiconductor device and method for manufacture semiconductor equipment
04/13/2005CN1197136C Lead wire frame and method for manufacturing lead wire frame
04/13/2005CN1197135C Semiconductor device manufacturing method
04/13/2005CN1197133C Method for mfg. semiconductor device
04/13/2005CN1197129C Method for forming semiconductor device
04/13/2005CN1197128C Method for forming copper layer on semiconductor chip
04/13/2005CN1197126C Method for forming vias in silicon carbide and resulting devices and circuit
04/13/2005CN1197124C Semiconductor device
04/13/2005CN1196658C Isolation ceramic, multi-layer ceramic substrate and laminated electronic component
04/12/2005US6880140 Method to selectively identify reliability risk die based on characteristics of local regions on the wafer
04/12/2005US6879924 Method and apparatus for monitoring integrated circuit fabrication
04/12/2005US6879816 Integrated switchless programmable attenuator and low noise amplifier
04/12/2005US6879605 Method and apparatus for performing pattern defect repair using Q-switched mode-locked pulse laser
04/12/2005US6879494 Circuit package for electronic systems
04/12/2005US6879493 Module component and method of manufacturing the same
04/12/2005US6879492 Hyperbga buildup laminate
04/12/2005US6879488 Radio frequency module
04/12/2005US6879487 Fan-securing device for use with a heat transfer device
04/12/2005US6879485 Method of controlling cooling system for a personal computer and personal computer
04/12/2005US6879476 Electrostatic discharge circuit and method therefor
04/12/2005US6879203 Whole chip ESD protection
04/12/2005US6879170 Flexible connecting device for interfacing with a wafer
04/12/2005US6879147 Package with environmental control material carrier
04/12/2005US6879050 Packaged microelectronic devices and methods for packaging microelectronic devices
04/12/2005US6879049 Damascene interconnection and semiconductor device
04/12/2005US6879047 Stacking structure for semiconductor devices using a folded over flexible substrate and method therefor
04/12/2005US6879046 Split barrier layer including nitrogen-containing portion and oxygen-containing portion
04/12/2005US6879045 Integrated circuit with modified metal features and method of fabrication therefor
04/12/2005US6879042 Semiconductor device and method and apparatus for manufacturing the same
04/12/2005US6879041 Semiconductor device with joint structure having lead-free solder layer over nickel layer
04/12/2005US6879040 Electrical connections in recesses to allow solder to connect device to surface
04/12/2005US6879039 Ball grid array package substrates and method of making the same
04/12/2005US6879038 Method and apparatus for hermetic sealing of assembled die
04/12/2005US6879037 Semiconductor device and a method of manufacturing the same
04/12/2005US6879036 Semiconductor memory device and method of manufacturing semiconductor device with chip on chip structure
04/12/2005US6879035 Vacuum package fabrication of integrated circuit components
04/12/2005US6879034 Semiconductor package including low temperature co-fired ceramic substrate
04/12/2005US6879033 Semiconductor device
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