| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/14/2005 | US20050079642 Manufacturing method of nitride semiconductor device |
| 04/14/2005 | US20050079355 Heat spreader for emissive display device |
| 04/14/2005 | US20050079349 Producing large quantities of a high quality, dense aerosol for spray pyrolysis operations; multi-phase particles for use in manufacturing electrically-conductive metallic films for electronic products |
| 04/14/2005 | US20050079329 Metal/ceramic bonding substrate and method for producing same |
| 04/14/2005 | US20050079304 Heat spreader for emissive display device |
| 04/14/2005 | US20050078890 Easy-to-unseal packaging bag |
| 04/14/2005 | US20050078500 Backside of chip implementation of redundancy fuses and contact pads |
| 04/14/2005 | US20050078456 Flip chip heat sink package and method |
| 04/14/2005 | US20050078455 Appartus including circuit board and heat sink and method of making the apparatus |
| 04/14/2005 | US20050078453 Thermal spreader using thermal conduits |
| 04/14/2005 | US20050078452 Blindmate heat sink assembly |
| 04/14/2005 | US20050078450 Electronic apparatus |
| 04/14/2005 | US20050078447 Method and apparatus for improving power efficiencies of computer systems |
| 04/14/2005 | US20050078434 Substrate for a semiconductor device |
| 04/14/2005 | US20050078433 Ceramic substrate for thin-film electronic components, method for producing the substrate, and thin-film electronic component employing the substrate |
| 04/14/2005 | US20050078376 Optical assemblies for transmitting and manipulating optical beams |
| 04/14/2005 | US20050078289 Process independent alignment marks |
| 04/14/2005 | US20050078233 Thin film transistor array substrate and fabricating method thereof, liquid crystal display using the same and fabricating method thereof, and method of inspecting liquid crystal display |
| 04/14/2005 | US20050077992 Symmetric planar inductor |
| 04/14/2005 | US20050077849 Motor speed detecting device for use between motor and system |
| 04/14/2005 | US20050077634 Optimization of routing layers and board space requirements for a ball grid array package |
| 04/14/2005 | US20050077632 Method for producing a multichip module and multichip module |
| 04/14/2005 | US20050077630 Methods of plating via interconnects |
| 04/14/2005 | US20050077629 Photoresist ash process with reduced inter-level dielectric ( ILD) damage |
| 04/14/2005 | US20050077628 Dual damascene structure and method |
| 04/14/2005 | US20050077627 Copper wiring with high temperature superconductor (HTS) layer |
| 04/14/2005 | US20050077626 Forming of the last metallization level of an integrated circuit |
| 04/14/2005 | US20050077625 Optimization of routing layers and board space requirements for a ball grid array land pattern |
| 04/14/2005 | US20050077624 Pillar structures |
| 04/14/2005 | US20050077623 Semiconductor radiation emitter package |
| 04/14/2005 | US20050077622 Active phase cancellation for power delivery |
| 04/14/2005 | US20050077620 Miniaturized small memory card structure |
| 04/14/2005 | US20050077619 Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same |
| 04/14/2005 | US20050077618 Flexible heat sink |
| 04/14/2005 | US20050077617 Semiconductor device having heat radiation plate and bonding member |
| 04/14/2005 | US20050077616 High power light emitting diode device |
| 04/14/2005 | US20050077615 Heat sinks |
| 04/14/2005 | US20050077614 Semiconductor device heat sink package and method |
| 04/14/2005 | US20050077613 Integrated circuit package |
| 04/14/2005 | US20050077612 Bond ring for micro-electromechanical system |
| 04/14/2005 | US20050077611 Package carrier having multiple individual ceramic substrates |
| 04/14/2005 | US20050077610 Ball grid array package with external leads |
| 04/14/2005 | US20050077609 Circuit package and method of plating the same |
| 04/14/2005 | US20050077608 Semiconductor device and its manufacturing method |
| 04/14/2005 | US20050077607 Small memory card |
| 04/14/2005 | US20050077605 Method and structure for a wafer level packaging |
| 04/14/2005 | US20050077604 Integrated circuit package with laminated power cell having coplanar electrode |
| 04/14/2005 | US20050077603 Method and structure for a wafer level packaging |
| 04/14/2005 | US20050077602 Functionality based package design |
| 04/14/2005 | US20050077601 Organic electronic devices with low thermal resistance and processes for forming and using the same |
| 04/14/2005 | US20050077600 Semiconductor device |
| 04/14/2005 | US20050077599 Package type semiconductor device |
| 04/14/2005 | US20050077598 Leadframe for use in a semiconductor package |
| 04/14/2005 | US20050077597 Method and system for treating a dielectric film |
| 04/14/2005 | US20050077596 Semiconductor component with electromagnetic shielding device |
| 04/14/2005 | US20050077595 An improved method, structure and process flow to reduce line-line capacitance with low-K material |
| 04/14/2005 | US20050077594 Semiconductor device with polysilicon fuse and method for trimming the same |
| 04/14/2005 | US20050077593 Wiring protection element for laser deleted tungsten fuse |
| 04/14/2005 | US20050077592 Embedded MIM capacitor and zigzag inductor scheme |
| 04/14/2005 | US20050077581 Metal-over-metal devices and the method for manufacturing same |
| 04/14/2005 | US20050077578 Arrangement for reducing current density in transistor in an IC |
| 04/14/2005 | US20050077577 Novel ESD protection device |
| 04/14/2005 | US20050077561 Methods of fabricating integrated circuit ferroelectric memory devices including plate lines directly on ferroelectric capacitors |
| 04/14/2005 | US20050077547 Method of fabricating a metal oxide semiconductor field effect transistor and a metal oxide semiconductor field effect transistor |
| 04/14/2005 | US20050077546 Structure and method for forming a capacitively coupled chip-to-chip signaling interface |
| 04/14/2005 | US20050077545 Ball grid array package with patterned stiffener surface and method of assembling the same |
| 04/14/2005 | US20050077542 Anisotropic conductive film, production method thereof and method of use thereof |
| 04/14/2005 | US20050077540 Integrated circuit arrangement |
| 04/14/2005 | US20050077533 Semiconductor package |
| 04/14/2005 | US20050077514 Test pattern of semiconductor device |
| 04/14/2005 | US20050077081 Robust high density substrate design for thermal cycling reliability |
| 04/14/2005 | US20050077077 Chip package with degassing holes |
| 04/14/2005 | US20050077031 Cooling system |
| 04/14/2005 | US20050077030 Transport line with grooved microchannels for two-phase heat dissipation on devices |
| 04/14/2005 | US20050077028 Liquid cooling jacket |
| 04/14/2005 | US20050077027 Cooler with blower comprising heat-exchanging elements |
| 04/14/2005 | US20050076967 Lead forming for a semiconductor device |
| 04/14/2005 | DE202004016243U1 Heat distributor, to spread the exhaust heat at central computer units and electronic appliances, has ribs supported on heat conductive tubes in grooves at the seat by concave units at their bottom edges |
| 04/14/2005 | DE19736090B4 Bauelement mit Schutzschicht und Verfahren zur Herstellung einer Schutzschicht für ein Bauelement Component with a protective coating and method of manufacturing a protective layer for a component |
| 04/14/2005 | DE10392451T5 Wärmesenke (Kühlkörper) und Verfahren zur Abführung der Wärme von elektronischen Leistungskomponenten Heat sink (heat sink) and method for removing the heat from electronic power components |
| 04/14/2005 | DE10355256A1 Semiconductor surface structure examination method, whereby the surface is illuminated with electromagnetic radiation and a characteristic parameter determined from the reflected radiation and compared with a reference value |
| 04/14/2005 | DE10343180A1 Verfahren zur Herstellung einer hochtemperaturfesten Golddrahtverbindung A process for producing a high temperature resistant gold connecting wire |
| 04/14/2005 | DE10343083A1 Transistor type semiconductor module for power semiconductor components with several semiconductor functional elements, with several insulated gates is semiconductor structure |
| 04/14/2005 | DE10342305A1 Protection against electrostatic discharge (ESD) for electronic circuits, with numerous series-connected diodes for limiting voltage heterodyned onto useful voltage |
| 04/14/2005 | DE10342295A1 Anordnung eines elektrischen Bauelements mit einer elektrischen Isolationsfolie auf einem Substrat und Verfahren zum Herstellen der Anordnung Arrangement of an electrical component with an electrical insulation film on a substrate and method of manufacturing the arrangement |
| 04/14/2005 | DE10341206A1 Appliance for improving reliability of BGA (ball grid array) solder connections between BGA component substrate, whose contact pads are fitted with solder balls or bumps |
| 04/14/2005 | DE10341059A1 Integrierte Schaltungsanordnung mit Kondensator und Herstellungsverfahren Integrated circuit arrangement having a capacitor and manufacturing method |
| 04/14/2005 | DE10340129A1 Electronic module with plug contacts, containing semiconductor chip, whose rear and sides are embedded in plastics, with active chip top side forming, with plastics |
| 04/14/2005 | DE10339939A1 Intergierte Schalltungsanordnung und Verfahren zur Herstellung derselben Inter-alloy Tung Sound System and method for making same |
| 04/14/2005 | DE10339559A1 Component support with magnetic and/or high frequency (HF) interfering marking, which contains permanent magnetic, paramagnetic, hall-magnetic or sensor-magnetic material |
| 04/14/2005 | DE10297665T5 Substrat für eine Halbleitervorrichtung A substrate for a semiconductor device |
| 04/14/2005 | DE10252818B4 Halbleitervorrichtung mit Kondensator A semiconductor device having capacitor |
| 04/14/2005 | DE102004044978A1 Semiconductor component e.g. X-ray detector, identifying device, has identification unit with component information identifying component through packages using acoustic and scanning signals that are sent to readout device |
| 04/14/2005 | DE102004014864A1 Schutzkreis zum Schutz vor elektrostatischen Entladungen und Verfahren zur Herstellung von Licht emittierenden Dioden Protection circuit to protect against electrostatic discharges and method for the production of light-emitting diodes |
| 04/14/2005 | DE102004001892A1 Wafer level package type film bulk acoustic resonator device for wireless communication device, has internal electrodes provided on substrate as external electrodes without separately processing external electrodes |
| 04/14/2005 | DE10120402B4 Leistungshalbleitermodul-Gehäuse Power semiconductor module housing |
| 04/14/2005 | DE10065857B4 Wärmeübertragungsanordnung für ein Kuststoffgehäuse elektronischer Baugruppen Heat transfer assembly for a Kuststoffgehäuse electronic assemblies |
| 04/14/2005 | CA2540359A1 Testing apparatus and method for determining an etch bias associated with a semiconductor-processing step |
| 04/14/2005 | CA2536154A1 Light emitting diode with porous sic substrate and method for fabricating |
| 04/13/2005 | EP1523229A2 Assembly of an electronic component with spring packaging |