| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/19/2005 | US6882050 WCSP (Wafer level Chip Size Package) structure; bump electrodes; sealing resin film comprised of a low-elastic resin layer and a high-elastic resin layer |
| 04/19/2005 | US6882049 Support ring for use with a contact pad and semiconductor device components including the same |
| 04/19/2005 | US6882048 Lead frame and semiconductor package having a groove formed in the respective terminals for limiting a plating area |
| 04/19/2005 | US6882047 Semiconductor package including a plurality of semiconductor chips therein |
| 04/19/2005 | US6882046 Single package containing multiple integrated circuit devices |
| 04/19/2005 | US6882043 Electronic assembly having an indium thermal couple |
| 04/19/2005 | US6882042 Thermally and electrically enhanced ball grid array packaging |
| 04/19/2005 | US6882041 Thermally enhanced metal capped BGA package |
| 04/19/2005 | US6882040 Semiconductor device |
| 04/19/2005 | US6882039 Semiconductor device |
| 04/19/2005 | US6882038 Plating tail design for IC packages |
| 04/19/2005 | US6882037 Die paddle for receiving an integrated circuit die in a plastic substrate |
| 04/19/2005 | US6882036 Apparatuses for forming thin microelectronic dies |
| 04/19/2005 | US6882035 Die package |
| 04/19/2005 | US6882034 Routing element for use in multi-chip modules, multi-chip modules including the routing element, and methods |
| 04/19/2005 | US6882033 High density direct connect LOC assembly |
| 04/19/2005 | US6882032 Technique for attaching die to leads |
| 04/19/2005 | US6882031 Ammonia gas passivation on nitride encapsulated devices |
| 04/19/2005 | US6882030 Integrated circuit structures with a conductor formed in a through hole in a semiconductor substrate and protruding from a surface of the substrate |
| 04/19/2005 | US6882027 Methods and apparatus for providing an antifuse function |
| 04/19/2005 | US6882020 Camera module |
| 04/19/2005 | US6882017 Field effect transistors and integrated circuitry |
| 04/19/2005 | US6882011 ESD protection device having reduced trigger voltage |
| 04/19/2005 | US6882008 Semiconductor integrated circuit device |
| 04/19/2005 | US6882004 Semiconductor component, trench structure transistor, trench MOSFET, IGBT, and field-plate transistor |
| 04/19/2005 | US6881998 Semiconductor device and method for producing the same |
| 04/19/2005 | US6881996 Metal-insulator-metal (MIM) capacitor structure in copper-CMOS circuits using a pad protect layer |
| 04/19/2005 | US6881896 Semiconductor device package |
| 04/19/2005 | US6881812 Latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are |
| 04/19/2005 | US6881811 Improved heat resistance and low relative permittivity; insulating films for electronic devices/multilayerd wiring boards |
| 04/19/2005 | US6881807 Improved storage stability and adhesion to substrate |
| 04/19/2005 | US6881799 Curing agent for epoxy resins and epoxy resin composition |
| 04/19/2005 | US6881683 Insulation film on semiconductor substrate and method for forming same |
| 04/19/2005 | US6881669 Process for making electronic devices having a monolayer diffusion barrier |
| 04/19/2005 | US6881668 Control of air gap position in a dielectric layer |
| 04/19/2005 | US6881660 Method for forming wiring structure |
| 04/19/2005 | US6881654 Solder bump structure and laser repair process for memory device |
| 04/19/2005 | US6881621 Method of fabricating SOI substrate having an etch stop layer, and method of fabricating SOI integrated circuit using the same |
| 04/19/2005 | US6881614 Shared contact for high-density memory cell design |
| 04/19/2005 | US6881613 Electronic component package |
| 04/19/2005 | US6881612 Method of bonding a semiconductor element to a substrate |
| 04/19/2005 | US6881611 Method and mold for manufacturing semiconductor device, semiconductor device and method for mounting the device |
| 04/19/2005 | US6881610 Method and apparatus for preparing a plurality of dice in wafers |
| 04/19/2005 | US6881609 Component connections using bumps and wells |
| 04/19/2005 | US6881607 Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography |
| 04/19/2005 | US6881606 Method for forming a protective layer for use in packaging a semiconductor die |
| 04/19/2005 | US6881599 Transferring semiconductor crystal from a substrate to a resin |
| 04/19/2005 | US6881597 Method of manufacturing a semiconductor device to provide a plurality of test element groups (TEGs) in a scribe region |
| 04/19/2005 | US6881593 Semiconductor die adapter and method of using |
| 04/19/2005 | US6881592 Method and device for minimizing multi-layer microscopic and macroscopic alignment errors |
| 04/19/2005 | US6881377 Printing a paste of ultrafine nickel powder to form an internal electrode layer on ceramic dielectric sheet layer; stacking second ceramic dielectric sheet layer; repeating to form multilayer body; pressing, cutting, sintering |
| 04/19/2005 | US6881265 Grease rework applicator |
| 04/19/2005 | US6881074 Electrical circuit assembly with micro-socket |
| 04/19/2005 | US6881071 Power semiconductor module with pressure contact means |
| 04/19/2005 | US6880624 Heat pipe |
| 04/19/2005 | US6880346 Two stage radiation thermoelectric cooling apparatus |
| 04/19/2005 | US6880345 Cooling system for an electronic component |
| 04/19/2005 | US6880244 Circuit board having simultaneously and unitarily formed wiring patterns and protrusions |
| 04/14/2005 | WO2005034597A1 Pad structure of wiring board and wiring board |
| 04/14/2005 | WO2005034592A1 Multilayer ceramic substrate and its manufacturing method |
| 04/14/2005 | WO2005034294A1 An electrical circuit assembly with micro-socket |
| 04/14/2005 | WO2005034239A2 Variable inductor for integrated circuit and printed circuit board |
| 04/14/2005 | WO2005034238A1 Electrical shielding in stacked dies by using conductive die attach adhesive |
| 04/14/2005 | WO2005034237A1 Pillar bumps for high power chip interconnection |
| 04/14/2005 | WO2005034236A1 Plastically deformable cooling body for electric and/or electronic components |
| 04/14/2005 | WO2005034235A2 Semiconductor module comprising a carrier device and method for producing a semiconductor module |
| 04/14/2005 | WO2005034234A1 Semiconductor device and method for manufacturing same |
| 04/14/2005 | WO2005034231A1 Electronic device and its manufacturing method |
| 04/14/2005 | WO2005034203A2 Method and apparatus for a dual substrate package |
| 04/14/2005 | WO2005034200A2 Adjustable self-aligned air gap dielectric for low capacitance wiring |
| 04/14/2005 | WO2005034179A2 Integrated circuit suitable for use in radio receivers |
| 04/14/2005 | WO2005034177A2 Lead frame with flag support structure |
| 04/14/2005 | WO2005033720A2 Testing apparatus and method for determining an etch bias associated with a semiconductor-processing step |
| 04/14/2005 | WO2005033235A2 Heat dissipating adhesive tape |
| 04/14/2005 | WO2005033207A1 Curable organopolysiloxane composition and semiconductor device |
| 04/14/2005 | WO2005033203A1 Potting compound, use thereof and components encapsulated in said potting compound |
| 04/14/2005 | WO2005022176A3 Temperature control system which sprays liquid coolant droplets against an ic-module at a sub-atmospheric pressure |
| 04/14/2005 | WO2005020319A3 Method for ltcc zero x-y shrinkage |
| 04/14/2005 | WO2005000568A3 Lead frame device with vented die flag |
| 04/14/2005 | WO2004105088A3 Circuit and method for trimming locking of integrated circuits |
| 04/14/2005 | WO2004086500A3 (opto-)electronic housing provided with an adjustable cellular bottom and heat dissipation by thermoelectric effect (peltier) and method for the production thereof |
| 04/14/2005 | WO2004074168A3 Packaged microchip with thermal stress relief |
| 04/14/2005 | WO2004066385A3 Semiconductor structure having a reduced connecting capacitance and method for producing the semiconductor structure |
| 04/14/2005 | WO2004061903A3 Method for fabrication of semiconductor device |
| 04/14/2005 | WO2004055918A3 Tamper-resistant packaging and approach |
| 04/14/2005 | WO2004055824A3 Method and device for protection of an mram device against tampering |
| 04/14/2005 | WO2004055823A3 Hardware security device for magnetic memory cells |
| 04/14/2005 | WO2004040357A3 Power management for spatial power combiners |
| 04/14/2005 | WO2004022714A3 Organic species that facilitate charge transfer to or from nanostructures |
| 04/14/2005 | US20050079851 Module integration integrated circuits |
| 04/14/2005 | US20050079719 Interconnect structures with engineered dielectrics with nanocolumnar porosity |
| 04/14/2005 | US20050079700 Strip conductor arrangement and method for producing a strip conductor arrangement |
| 04/14/2005 | US20050079698 Contact structure and manufacturing method thereof |
| 04/14/2005 | US20050079689 Semiconductor devices having alignment marks aligned with device features and methods for fabricating the same |
| 04/14/2005 | US20050079685 Deposition of diffusion barrier |
| 04/14/2005 | US20050079683 Method for improved alignment of magnetic tunnel junction elements |
| 04/14/2005 | US20050079654 Variable rotational assignment of interconnect levels in integrated circuit fabrication |
| 04/14/2005 | US20050079653 Methods for epoxy loc die attachment |
| 04/14/2005 | US20050079651 Wirebond structure and method to connect to a microelectronic die |
| 04/14/2005 | US20050079650 Device including an amorphous carbon layer for improved adhesion of organic layers and method of fabrication |