| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/21/2005 | DE202004016245U1 Method for fitting cooling vanes onto heat tubes has the ribs provided with additional holes for thrust bars to crimp the vanes onto the heat tubes |
| 04/21/2005 | DE19825994B4 Thermoplastisches Material zum Abdichten eines Halbleiterelementes, mit diesem Material abgedichtete Halbleitervorrichtung und Verfahren zu ihrer Herstellung Thermoplastic material for sealing a semiconductor element sealed with this material semiconductor device and process for their preparation |
| 04/21/2005 | DE19755954B4 Leiterrahmenstruktur, diese verwendende Halbleiterbaugruppe und Herstellungsverfahren hierfür Leadframe structure, employing the same semiconductor device and manufacturing method thereof |
| 04/21/2005 | DE10392365T5 Halbleitervorrichtung mit einem Halbleiterchip A semiconductor device comprising a semiconductor chip |
| 04/21/2005 | DE10314601B4 Halbleiterschaltung mit einer Schutzschaltung gegen Verpolung bzw. Über- oder Unterspannung am Ausgang Semiconductor circuit with a protection circuit against reverse polarity and over or under voltage at the output |
| 04/20/2005 | EP1524893A1 Electronic control unit, in particular for motor vehicles, with improved heat dissipation system |
| 04/20/2005 | EP1524888A2 Cooling device and electronic apparatus building in the same |
| 04/20/2005 | EP1524694A1 Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame |
| 04/20/2005 | EP1524693A1 Leadframe being protected against corrosion |
| 04/20/2005 | EP1524692A2 Liquid cooled jacket for an electronic device |
| 04/20/2005 | EP1524691A2 Power unit comprising a heat sink, and assembly method |
| 04/20/2005 | EP1524690A1 Semiconductor package with heat spreader |
| 04/20/2005 | EP1524689A1 Semiconductor device |
| 04/20/2005 | EP1524538A1 Optical connector, optical element holding structure, and structure of a mount section of an optical connector |
| 04/20/2005 | EP1524306A1 Sprayable adhesive material for laser marking semiconductor wafers, dies and devices |
| 04/20/2005 | EP1524285A1 Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same |
| 04/20/2005 | EP1523870A1 Method for heat dissipation in mobile radio devices and a corresponding mobile radio device |
| 04/20/2005 | EP1523799A1 Cooling body and rectifier module for an electrical machine |
| 04/20/2005 | EP1523784A2 Integrated circuit and method for manufacturing same |
| 04/20/2005 | EP1523769A1 Assembly comprising a semiconductor chip and support therefor, in addition to method for a bonded wiring connection |
| 04/20/2005 | EP1523762A2 Method for making an anisotropic conductive polymer film on a semiconductor wafer |
| 04/20/2005 | EP1523684A1 Fiducial alignment marks on microelectronic spring contacts |
| 04/20/2005 | EP1423876A4 Semiconductor device and voltage regulator |
| 04/20/2005 | EP1334416B1 Circuit arrangement and a method for detecting an undesired attack on an integrated circuit |
| 04/20/2005 | EP1183719A4 Scalable lead zirconium titanate (pzt) thin film material and deposition method, and ferroelectric memory device structures comprising such thin film material |
| 04/20/2005 | CN2694494Y Securing apparatus of water-cooled radiator |
| 04/20/2005 | CN2694493Y Heat pipe type heat radiator |
| 04/20/2005 | CN2694492Y Heat pipe type heat radiator |
| 04/20/2005 | CN2694491Y Heat radiator and heat radiation module |
| 04/20/2005 | CN2694490Y Radiator |
| 04/20/2005 | CN2694489Y Improved heat radiator |
| 04/20/2005 | CN2694488Y Heat radiator |
| 04/20/2005 | CN2694487Y Heating radiator linking apparatus |
| 04/20/2005 | CN2694486Y Heat radiator |
| 04/20/2005 | CN2694485Y High specific surface radiating fin |
| 04/20/2005 | CN2694484Y Heat radiation fan wire fixing device combination |
| 04/20/2005 | CN2694483Y Heat radiation and air exhaust arrangement |
| 04/20/2005 | CN2694482Y Wafer structure for micro sensing device |
| 04/20/2005 | CN2694358Y Fastener of heat sink |
| 04/20/2005 | CN2694210Y Phase-change heat sink |
| 04/20/2005 | CN2694096Y LED light string structure |
| 04/20/2005 | CN1608400A Chip scale stacking system and method |
| 04/20/2005 | CN1608399A Connection substrate, multilayer wiring board using the connection substrate, substrate for semiconductor package, semiconductor package, and methods for manufacturing them |
| 04/20/2005 | CN1608345A Method for the hermetic encapsulation of a component |
| 04/20/2005 | CN1608334A Contact assembly for land grid array interposer or electrical connector |
| 04/20/2005 | CN1608321A Memory device packaging including stacked passive devices and method for making the same |
| 04/20/2005 | CN1608320A Package for a non-volatile memory device including integrated passive devices and method for making the same |
| 04/20/2005 | CN1608319A Optimized liners for dual damascene metal wiring |
| 04/20/2005 | CN1608316A High density area array solder microjoining interconnect structure and fabrication method |
| 04/20/2005 | CN1607890A Printed circuit board without rough cutting edge |
| 04/20/2005 | CN1607875A Display device and method for manufacturing same |
| 04/20/2005 | CN1607682A Wafer-level packaging of optoelectronic devices |
| 04/20/2005 | CN1607679A Diode structure in series connection with deep N well portion and method for forming same |
| 04/20/2005 | CN1607665A 半导体装置及显示装置 The semiconductor device and display device |
| 04/20/2005 | CN1607664A Integrated circuit device with electrostatic discharge protection element |
| 04/20/2005 | CN1607663A Band type substrate and semiconductor package using the same |
| 04/20/2005 | CN1607662A Method and structure for self healing cracks in underfill material between an i/c chip and a substrate bonded together with solder balls |
| 04/20/2005 | CN1607661A Semiconductor device and package with high heat radiation effect |
| 04/20/2005 | CN1607660A Packaging structure of cubic flat pin-free type chips and packaging process thereof |
| 04/20/2005 | CN1607656A Method and apparatus for integrated noise decoupling |
| 04/20/2005 | CN1607654A Semiconductor device manufacturing method |
| 04/20/2005 | CN1607653A Spiral contactor and manufacturing method for this apparatus, and a semiconductor inspecting equipment and electronical parts using this apparatus |
| 04/20/2005 | CN1607649A Forming method of contact hole and manufacturing method of semiconductor device |
| 04/20/2005 | CN1607637A Method of manufacturing a semiconductor device |
| 04/20/2005 | CN1607488A Device and method for reducing internal environment temperature of computer |
| 04/20/2005 | CN1607444A Thin film transistor array substrate and fabricating method thereof, liquid crystal display using the same and fabricating method thereof, and method of inspecting liquid crystal display |
| 04/20/2005 | CN1198487C Module substrate and its manufacturing method |
| 04/20/2005 | CN1198486C Printed-wiring board with cavity for mounting electronic component |
| 04/20/2005 | CN1198337C Metal redistribution layer having solderable pads and wire bondable pads |
| 04/20/2005 | CN1198335C 半导体装置 Semiconductor device |
| 04/20/2005 | CN1198334C 半导体器件 Semiconductor devices |
| 04/20/2005 | CN1198333C Circuit board and its making method and high-output module |
| 04/20/2005 | CN1198332C Wiring beard, semiconductor device, and method of mfg. wiring board |
| 04/20/2005 | CN1198331C Forming method for wiring structure |
| 04/20/2005 | CN1198330C Wiring design method |
| 04/20/2005 | CN1198329C Method of severing electrically conductive links with ultravoilet laser output |
| 04/20/2005 | CN1198171C Pattern forming method and method for producing liquid crystal display using the method |
| 04/20/2005 | CN1197928C Conductive adhesion agent, assembling structure and method for making said assembling structure |
| 04/20/2005 | CN1197893C Thermosetting resin compositions useful as underfill sealants |
| 04/19/2005 | US6883159 Patterning semiconductor layers using phase shifting and assist features |
| 04/19/2005 | US6882738 Methods and tangible objects employing textured machine readable data |
| 04/19/2005 | US6882571 Low voltage non-volatile memory cell |
| 04/19/2005 | US6882546 Multiple die interconnect system |
| 04/19/2005 | US6882544 Thin type printed circuit board with an enclosed capacitor of a large capacitance; |
| 04/19/2005 | US6882543 Apparatus for conditioning power and managing thermal energy in an electronic device |
| 04/19/2005 | US6882536 Wrap-around cooling arrangement for printed circuit board |
| 04/19/2005 | US6882535 Integrated heat spreader with downset edge, and method of making same |
| 04/19/2005 | US6882534 Fastening device for heat slug |
| 04/19/2005 | US6882532 Double-winged radiator for central processing unit |
| 04/19/2005 | US6882266 Ball grid array resistor network having a ground plane |
| 04/19/2005 | US6882264 Electrothermal self-latching MEMS switch and method |
| 04/19/2005 | US6882214 Circuit and method for trimming locking of integrated circuits |
| 04/19/2005 | US6882210 Semiconductor switching device |
| 04/19/2005 | US6882069 Vehicle AC generator with rectifier diode package disposed between cooling plates |
| 04/19/2005 | US6882057 Quad flat no-lead chip carrier |
| 04/19/2005 | US6882055 Non-rectilinear polygonal vias |
| 04/19/2005 | US6882054 Semiconductor device and method of manufacturing the same |
| 04/19/2005 | US6882053 Buried power buss utilized as a ground strap for high current, high power semiconductor devices and a method for providing the same |
| 04/19/2005 | US6882052 Plasma enhanced liner |
| 04/19/2005 | US6882051 Nanowires, nanostructures and devices fabricated therefrom |