Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2005
04/21/2005US20050084989 Semiconductor device manufacturing method
04/21/2005US20050084704 Metal/ceramic bonding substrate and method for producing same
04/21/2005US20050084691 Organopolysiloxane endcapped with alkenyl groups, organohydrogenpolysiloxane containing at least 2 hydrogen atoms, a gallium alloy, a heat conductive filler, a platinum catalyst, an addition reaction control agent, an alkoxysilane, a trimethyoxysilyl endcapped dimethylpolysiloxane
04/21/2005US20050084684 Release film
04/21/2005US20050084661 immersion of conductors in lead-free liquid containing metals, group 1B and acyclic oxy acid and salts, then precipitating the metals on the surfaces and coating in electroless plating solutions; supports for semiconductors, capacitors or resistors
04/21/2005US20050083742 Packaging structure of a driving circuit for a liquid crystal display device and packaging method of a driving circuit for a liquid crystal display device
04/21/2005US20050083661 Mounting device for heat sink
04/21/2005US20050083659 Latch means for socket connector assembly
04/21/2005US20050083658 Heat dissipating module of an integrated circuit of a portable computer
04/21/2005US20050083655 Dielectric thermal stack for the cooling of high power electronics
04/21/2005US20050083652 Liquid cooled semiconductor device
04/21/2005US20050083648 Methods and apparatuses for transferring heat from microelectronic device modules
04/21/2005US20050083641 Central processing unit
04/21/2005US20050083622 Circuit arrangement for protection against electrostatic discharge and voltage regulating device having a circuit arrangement
04/21/2005US20050083620 Esd protection circuit with a stack-coupling device
04/21/2005US20050083118 Rf amplifier
04/21/2005US20050083078 Test key for bridge and continuity testing
04/21/2005US20050082718 Mold with compensating base
04/21/2005US20050082693 Image processing alignment method and method of manufacturing semiconductor device
04/21/2005US20050082692 Rectifier diode device
04/21/2005US20050082691 Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same
04/21/2005US20050082690 Method for producing semiconductor device and semiconductor device
04/21/2005US20050082689 Resin-sealed semiconductor device
04/21/2005US20050082688 Semiconductor element with improved adhesion characteristics of the non-metallic surfaces
04/21/2005US20050082687 High-speed signaling interface and method for communicating across across an interface
04/21/2005US20050082686 Circuitized substrate for fixing solder beads on pads
04/21/2005US20050082685 Direct bumping on integrated circuit contacts enabled by metal-to-insulator adhesion
04/21/2005US20050082684 Semiconductor device and method for manufacturing the same
04/21/2005US20050082683 Semiconductor device and a method of manufacturing the same
04/21/2005US20050082682 Prevention of contamination on bonding pads of wafer during SMT
04/21/2005US20050082681 Semiconductor device and method of enveloping an intergrated circuit
04/21/2005US20050082680 Substrate with mesh
04/21/2005US20050082679 Semiconductor component and production method suitable therefor
04/21/2005US20050082678 Method to form selective cap layers on metal features with narrow spaces
04/21/2005US20050082677 Interconnect structure for integrated circuits
04/21/2005US20050082676 contains lead, magnesium, niobium, zirconium, titanium, nickel -based oxide solid solution; attached via electrode; improved vibration transmission
04/21/2005US20050082675 Integrated circuit with copper interconnect and top level bonding/interconnect layer
04/21/2005US20050082673 Semiconductor apparatus, led head, and image forming apparatus
04/21/2005US20050082672 Circuit barrier structure of semiconductor packaging substrate and method for fabricating the same
04/21/2005US20050082670 Method for preapplying a viscous material to strengthen solder connections in microelectronic packaging and microelectronic packages formed thereby
04/21/2005US20050082668 Radio card
04/21/2005US20050082667 Rewiring substrate strip with a number of semiconductor component positions
04/21/2005US20050082666 Liquid cooling device
04/21/2005US20050082665 Semiconductor assembly and spring member therefor
04/21/2005US20050082664 Stacked semiconductor device and semiconductor chip control method
04/21/2005US20050082663 Semiconductor device and semiconductor module
04/21/2005US20050082662 Structure and method of manufacturing the same
04/21/2005US20050082660 Integrated circuit package with integral leadframe convector and method therefor
04/21/2005US20050082659 Semiconductor device
04/21/2005US20050082658 Simplified stacked chip assemblies
04/21/2005US20050082657 Compact semiconductor device capable of mounting a plurality of semiconductor chips with high density and method of manufacturing the same
04/21/2005US20050082655 Semiconductor device and method for manufacturing the same
04/21/2005US20050082654 Structure and self-locating method of making capped chips
04/21/2005US20050082653 Structure and method of making sealed capped chips
04/21/2005US20050082652 Integrated circuit housing
04/21/2005US20050082651 Methods of coating and singulating wafers and chip-scale packages formed therefrom
04/21/2005US20050082650 Integrated circuit packaging system
04/21/2005US20050082649 Package for a semiconductor device
04/21/2005US20050082647 Tape circuit substrate and semiconductor chip package using the same
04/21/2005US20050082645 Chip package and electrical connection structure between chip and substrate
04/21/2005US20050082643 Semiconductor element, semiconductor device, method for manufacturing semiconductor element, method for manufacturing semiconductor device, and electronic apparatus
04/21/2005US20050082641 Flexible and elastic dielectric integrated circuit
04/21/2005US20050082638 Semiconductor device and method for fabricating the same
04/21/2005US20050082635 Semiconductor fuse box and method for fabricating the same
04/21/2005US20050082628 Semiconductor device and method of manufacturing the same
04/21/2005US20050082626 Membrane 3D IC fabrication
04/21/2005US20050082621 Substrate-biased I/O and power ESD protection circuits in deep-submicron twin-well process
04/21/2005US20050082620 Multi-finger transistor
04/21/2005US20050082619 Electrostatic discharge protection structure for deep sub-micron gate oxide
04/21/2005US20050082618 Low capacitance ESD protection device, and integrated circuit including the same
04/21/2005US20050082606 Low K dielectric integrated circuit interconnect structure
04/21/2005US20050082592 Compact capacitor structure having high unit capacitance
04/21/2005US20050082589 Semiconductor device and manufacturing method of the same
04/21/2005US20050082580 Structure of wafer level package with area bump
04/21/2005US20050082577 Semiconductor device using insulating film of low dielectric constant as interlayer insulating film
04/21/2005US20050082560 Optical semiconductor device
04/21/2005US20050082559 Mask and method for using the mask in lithographic processing
04/21/2005US20050082552 Large bumps for optical flip chips
04/21/2005US20050082551 Large bumps for optical flip chips
04/21/2005US20050082538 Interconnect, interconnect forming method, thin film transistor, and display device
04/21/2005US20050082523 Methods for forming patterns on a filled dielectric material on substrates
04/21/2005US20050082374 Portable electronic device
04/21/2005US20050082347 Self-locking wire bond structure and method of making the same
04/21/2005US20050082338 Sprayable adhesive material for laser marking semiconductor wafers, dies and devices
04/21/2005US20050082075 Device and method for providing shielding in radio frequency integrated circuits to reduce noise coupling
04/21/2005US20050082043 CTE-matched heat pipe
04/21/2005US20050082042 Heat-dissipating structure and method of manufacturing the same
04/21/2005US20050082041 Heat dissipation device
04/21/2005US20050082040 Integrated liquid cooling system for electrical components
04/21/2005US20050082037 Porous media cold plate
04/21/2005US20050082036 Cooling device of electronic apparatus
04/21/2005US20050082035 Heat dissipating apparatus
04/21/2005US20050082034 Radiator with airflow guiding structure
04/21/2005US20050081998 Chemical-mechanical planarization slurries and powders and methods for using same
04/21/2005US20050081534 Cooling device and electronic apparatus building in the same
04/21/2005US20050081532 Computer cooling apparatus
04/21/2005US20050081376 Robust interlocking via
04/21/2005US20050081375 Printed circuit board assembly and method
04/21/2005US20050081349 Embedded capacitor structure in circuit board and method for fabricating the same
04/21/2005DE202005001255U1 Mounting structure of photoelectric semiconductor wafer for manufacture of light-emitting diode, has electrically conductive material on front of wafer for establishing connection to photoelectric semiconductor
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