Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2014
03/25/2014US8680683 Wafer level package with embedded passive components and method of manufacturing
03/25/2014US8680682 Barrier for through-silicon via
03/25/2014US8680681 Bond pad configurations for controlling semiconductor chip package interactions
03/25/2014US8680680 Semiconductor devices including porous insulators
03/25/2014US8680678 Formulations for improved electrodes for electronic devices
03/25/2014US8680677 Carbon nanotube-based conductive connections for integrated circuit devices
03/25/2014US8680676 Semiconductor package with under bump metallization routing
03/25/2014US8680674 Methods and structures for reducing heat exposure of thermally sensitive semiconductor devices
03/25/2014US8680673 Integrated heat pillar for hot region cooling in an integrated circuit
03/25/2014US8680672 Semiconductor package with sleeve member and fan wheel for heat dissipation
03/25/2014US8680670 Multi-chip module system with removable socketed modules
03/25/2014US8680669 Electronic component, electronic module, and method for manufacturing the same
03/25/2014US8680668 Device including a semiconductor chip and metal foils
03/25/2014US8680667 Semiconductor devices, package substrates, semiconductor packages, package stack structures, and electronic systems having functionally asymmetric conductive elements
03/25/2014US8680666 Bond wireless power module with double-sided single device cooling and immersion bath cooling
03/25/2014US8680665 Encapsulation, MEMS and encapsulation method
03/25/2014US8680663 Methods and apparatus for package on package devices with reduced strain
03/25/2014US8680662 Wafer level edge stacking
03/25/2014US8680661 Direct contact package for power transistors
03/25/2014US8680660 Brace for bond wire
03/25/2014US8680659 Semiconductor device
03/25/2014US8680658 Conductive clip for semiconductor device package
03/25/2014US8680657 Lead frame, semiconductor apparatus using this lead frame, intermediate product thereof and manufacturing method thereof
03/25/2014US8680656 Leadframe structure for concentrated photovoltaic receiver package
03/25/2014US8680654 Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods
03/25/2014US8680652 Stack package
03/25/2014US8680648 Compact metal connect and/or disconnect structures
03/25/2014US8680647 Packages with passive devices and methods of forming the same
03/25/2014US8680636 Package-type solid-state imaging apparatus with exhausting means
03/25/2014US8680621 Integrated circuit, electronic device and ESD protection therefor
03/25/2014US8680620 Bi-directional blocking voltage protection devices and methods of forming the same
03/25/2014US8680619 Method of fabricating hybrid impact-ionization semiconductor device
03/25/2014US8680572 Microdisplay packaging system
03/25/2014US8680546 Light-emitting apparatus, surface light source, and method for manufacturing package for light-emitting apparatus
03/25/2014US8680533 Light-emitting device having light-emitting elements with a shared electrode
03/25/2014US8680523 Sensor for semiconductor degradation monitoring and modeling
03/25/2014US8680441 Heating plate with planar heater zones for semiconductor processing
03/25/2014US8679970 Structure and process for conductive contact integration
03/25/2014US8679963 Fan-out chip scale package
03/25/2014US8679908 Use of silicide block process to camouflage a false transistor
03/25/2014US8678075 Heat exchangers and related methods
03/20/2014WO2014043680A1 Low thermal stress package for large area semiconductor dies
03/20/2014WO2014043566A1 Anti-fuse device
03/20/2014WO2014043545A1 Semiconductor chip mounting
03/20/2014WO2014043390A1 Tunable composite interposer
03/20/2014WO2014043233A1 Dual row quad flat no-lead semiconductor package
03/20/2014WO2014042991A1 Display apparatus incorporating vertically oriented electrical interconnects
03/20/2014WO2014042328A1 Photocurable composition, barrier layer comprising same, and encapsulated apparatus comprising same
03/20/2014WO2014042234A1 Semiconductor device
03/20/2014WO2014042165A1 Semiconductor device and method for manufacturing semiconductor device
03/20/2014WO2014042125A1 Semiconductor device and method for manufacturing same
03/20/2014WO2014042057A1 Medical device and high-voltage x-ray device
03/20/2014WO2014041936A1 Semiconductor device, method for attaching heat dissipating member to semiconductor device, and method for manufacturing semiconductor device
03/20/2014WO2014041722A1 Semiconductor device
03/20/2014WO2014041107A1 Cap for a chip device having a groove, device provided with said cap, assembly consisting of the device and a wire element, and manufacturing method thereof
03/20/2014WO2014040364A1 Led lamp
03/20/2014WO2014040230A1 Electronic device and manufacturing method thereof
03/20/2014WO2014015172A3 Apparatus and method for harvesting energy in an electronic device
03/20/2014WO2013153518A4 Hot side management of thermoelectric cooling module
03/20/2014WO2013031554A9 Etching liquid composition and etching method
03/20/2014US20140082345 Semiconductor device
03/20/2014US20140080264 Method for fabricating leadframe-based semiconductor package
03/20/2014US20140080262 Method for producing the same
03/20/2014US20140080261 Method for fabricating a chip having a water-repellent obverse surface and a hydrophilic reverse surface
03/20/2014US20140080258 Compliant printed circuit semiconductor package
03/20/2014US20140080257 Method for non-planar chip assembly
03/20/2014US20140080255 Ultra-low power swnt interconnects for sub-threshold circuits
03/20/2014US20140079954 Palladium precursor composition
03/20/2014US20140079947 Base Film and Pressure-Sensitive Adhesive Sheet Provided Therewith
03/20/2014US20140078709 Semiconductor device
03/20/2014US20140078433 Array substrate and manufacturing method thereof and display device
03/20/2014US20140077395 Integrated circuit device
03/20/2014US20140077394 Wafer Level Embedded Heat Spreader
03/20/2014US20140077393 Apparatus and method for high density multi-chip structures
03/20/2014US20140077392 Semiconductor device and method for fabricating the same
03/20/2014US20140077391 Semiconductor device
03/20/2014US20140077390 Electronic apparatus
03/20/2014US20140077389 Semiconductor Device and Method of Using Substrate Having Base and Conductive Posts to Form Vertical Interconnect Structure in Embedded Die Package
03/20/2014US20140077388 Semiconductor device and method of manufacturing the same
03/20/2014US20140077387 Semiconductor package and fabrication method thereof
03/20/2014US20140077386 3D IC and 3D CIS Structure
03/20/2014US20140077385 Semiconductor package device having passive energy components
03/20/2014US20140077384 Bit cell with triple patterned metal layer structures
03/20/2014US20140077383 Structure and method of making an offset-trench crackstop that forms an air gap adjacent to a passivated metal crackstop
03/20/2014US20140077382 Semiconductor packages having warpage compensation
03/20/2014US20140077381 Semiconductor Device and Method of Forming FO-WLCSP with Multiple Encapsulants
03/20/2014US20140077379 Semiconductor structure and method for making same
03/20/2014US20140077378 Low thermal stress package for large area semiconductor dies
03/20/2014US20140077377 Semiconductor device and manufacturing method of semiconductor device
03/20/2014US20140077376 Semiconductor chip, method for producing a semiconductor chip and method for soldering a semiconductor chip to a carrier
03/20/2014US20140077375 Substrate structure, method of mounting semiconductor chip, and solid state relay
03/20/2014US20140077374 Through Via Structure and Method
03/20/2014US20140077373 Semiconductor device and method for manufacturing semiconductor device
03/20/2014US20140077372 Semiconductor device and method for manufacturing the same
03/20/2014US20140077370 Semiconductor device and method for manufacturing the same
03/20/2014US20140077369 Packaging Devices and Methods
03/20/2014US20140077368 Repairing anomalous stiff pillar bumps
03/20/2014US20140077367 Solder interconnect with non-wettable sidewall pillars and methods of manufacture
03/20/2014US20140077366 Wafer Level Fan-Out Package With a Fiducial Die
03/20/2014US20140077365 Metal Bump and Method of Manufacturing Same
1 ... 120 121 122 123 124 125 126 127 128 129 130 131 132 133 134 135 136 137 138 139 140 ... 2262