| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/03/2015 | US8969120 Two-stage packaging method of image sensors |
| 03/03/2015 | US8969104 Circuit technique to electrically characterize block mask shifts |
| 03/03/2015 | US8968864 Sealed porous materials, methods for making them, and semiconductor devices comprising them |
| 03/03/2015 | US8968606 Components having voltage switchable dielectric materials |
| 03/03/2015 | US8967827 Lead frame, wiring board, light emitting unit, and illuminating apparatus |
| 03/03/2015 | US8967586 Heat dissipating device supporting apparatus |
| 03/03/2015 | US8967484 RFID tag, wireless charging antenna part, method of manufacturing the same, and mold |
| 03/03/2015 | US8966750 Method of manufacturing a multilayered printed wiring board |
| 03/03/2015 | US8966749 Manufacturing method for protection circuit module of secondary battery |
| 03/03/2015 | US8966731 Method for manufacturing a switching element |
| 02/26/2015 | WO2015027230A1 High-power electronic devices containing metal nanoparticle-based thermal interface materials and related methods |
| 02/26/2015 | WO2015027025A1 Layout construction for addressing electromigration |
| 02/26/2015 | WO2015027022A1 Layout construction for addressing electromigration |
| 02/26/2015 | WO2015026704A1 Mechanically isolated thermal link |
| 02/26/2015 | WO2015026517A1 Microelectromechanical systems comprising differential inductors and methods for making the same |
| 02/26/2015 | WO2015026344A1 Bumpless die-package interface for bumpless build-up layer (bbul) |
| 02/26/2015 | WO2015026288A1 Connection pads for a fingerprint sensing device |
| 02/26/2015 | WO2015026034A1 Semiconductor device |
| 02/26/2015 | WO2015025723A1 Solid-state imaging element and electronic device |
| 02/26/2015 | WO2015025661A1 Sheet for sealing and method for manufacturing semiconductor device |
| 02/26/2015 | WO2015025637A1 Photoelectric conversion device and method for manufacturing same |
| 02/26/2015 | WO2015025618A1 Surface acoustic wave device and manufacturing method therefor |
| 02/26/2015 | WO2015025617A1 Addition-cured silicone resin composition, curing product of addition-cured silicone resin, and optical semiconductor element sealing body |
| 02/26/2015 | WO2015025577A1 Condensation-curable silicone resin composition, cured product of condensation-curable silicone resin, and optical semiconductor element sealing body |
| 02/26/2015 | WO2015025447A1 Semiconductor devices |
| 02/26/2015 | WO2015025347A1 Electronic circuit board, semiconductor device using same, and manufacturing method for same |
| 02/26/2015 | WO2015024597A1 Method for wire bonding and device produced thereby |
| 02/26/2015 | WO2015024337A1 Array substrate, manufacturing method of same, and display device |
| 02/26/2015 | WO2015024325A1 Thin film transistor, array substrate and manufacturing method thereof, and display device |
| 02/26/2015 | US20150056807 Semiconductor device and manufacturing method thereof |
| 02/26/2015 | US20150056804 Bottom-up plating of through-substrate vias |
| 02/26/2015 | US20150056799 Integrated circuit including wire structure and related method |
| 02/26/2015 | US20150056785 Substrate dividing method |
| 02/26/2015 | US20150056778 Semiconductor device and manufacturing method therefor |
| 02/26/2015 | US20150056777 Device isolation with improved thermal conductivity |
| 02/26/2015 | US20150056763 Selective deposition of diamond in thermal vias |
| 02/26/2015 | US20150056756 Encapsulant materials and a method of making thereof |
| 02/26/2015 | US20150056755 Electronic device packages having bumps and methods of manufacturing the same |
| 02/26/2015 | US20150056754 Vacuum molding apparatus, substrate processing system having the same and substrate processing method using the same |
| 02/26/2015 | US20150056753 Semiconductor Die Having Fine Pitch Electrical Interconnects |
| 02/26/2015 | US20150056752 Substrateless power device packages |
| 02/26/2015 | US20150056751 Die edge sealing structures and related fabrication methods |
| 02/26/2015 | US20150056726 Chip positioning in multi-chip package |
| 02/26/2015 | US20150055315 Electronic package structure and method for making the same |
| 02/26/2015 | US20150055309 Electronic component embedded substrate and method of manufacturing electronic component embedded substrate |
| 02/26/2015 | US20150055280 Microchip with faraday cages and internal flexibility sipes |
| 02/26/2015 | US20150054592 On-chip vertical three dimensional microstrip line with characteristic impedance tuning technique and design structures |
| 02/26/2015 | US20150054484 Dc voltage conversion module, semiconductor module, and method of making semiconductor module |
| 02/26/2015 | US20150054180 Resin composition for encapsulation and electronic device using the same |
| 02/26/2015 | US20150054179 Arc residue-free etching |
| 02/26/2015 | US20150054178 Electronic device |
| 02/26/2015 | US20150054177 Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging |
| 02/26/2015 | US20150054175 Semiconductor Device and Method for Making Same |
| 02/26/2015 | US20150054174 Interconnection Structure with Confinement Layer |
| 02/26/2015 | US20150054173 Semiconductor package, method of manufacturing semiconductor package and stack type semiconductor package |
| 02/26/2015 | US20150054172 Semiconductor device and method of manufacturing the same |
| 02/26/2015 | US20150054171 Semiconductor device and method of manufacturing the same |
| 02/26/2015 | US20150054170 Semiconductor Devices and Methods of Manufacture Thereof |
| 02/26/2015 | US20150054168 Single Spacer Process for Multiplying Pitch by a Factor Greater Than Two and Related Intermediate IC Structures |
| 02/26/2015 | US20150054167 Semiconductor Device and Method of Forming Pad Layout for Flipchip Semiconductor Die |
| 02/26/2015 | US20150054166 Semiconductor Arrangement, Method for Producing a Number of Chip Assemblies and Method for Producing a Semiconductor Arrangement |
| 02/26/2015 | US20150054164 Semiconductor Constructions |
| 02/26/2015 | US20150054163 Systems and Methods to Enhance Passivation Integrity |
| 02/26/2015 | US20150054162 Method of manufacturing chip package substrate and method of manufacturing chip package |
| 02/26/2015 | US20150054161 Semiconductor Bonding Structure and Process |
| 02/26/2015 | US20150054160 Semiconductor Constructions and Methods of Forming Electrically Conductive Contacts |
| 02/26/2015 | US20150054159 Semiconductor Module and a Method for Fabrication Thereof By Extended Embedding Technologies |
| 02/26/2015 | US20150054158 Functional material |
| 02/26/2015 | US20150054157 Electronic circuit unit and method of manufacturing electronic circuit unit |
| 02/26/2015 | US20150054156 Semiconductor structures and fabrication method thereof |
| 02/26/2015 | US20150054155 Semiconductor package |
| 02/26/2015 | US20150054154 Method and encapsulant for flip-chip assembly |
| 02/26/2015 | US20150054153 Flip chip interconnection with double post |
| 02/26/2015 | US20150054152 Multilayer pillar for reduced stress interconnect and method of making same |
| 02/26/2015 | US20150054151 Semiconductor Device and Method of Forming Interconnect Structure Over Seed Layer on Contact Pad of Semiconductor Die Without Undercutting Seed Layer Beneath Interconnect Structure |
| 02/26/2015 | US20150054150 Semiconductor package and fabrication method thereof |
| 02/26/2015 | US20150054149 Novel 3D Integration Method Using SOI Substrates And Structures Produced Thereby |
| 02/26/2015 | US20150054148 Semiconductor packages including heat exhaust part |
| 02/26/2015 | US20150054147 Lead frame having a perimeter recess within periphery of component terminal |
| 02/26/2015 | US20150054146 Semiconductor device |
| 02/26/2015 | US20150054145 Integrated circuit package with die attach paddle having at least one recessed portion |
| 02/26/2015 | US20150054144 Semiconductor package including multiple chips and separate groups of leads |
| 02/26/2015 | US20150054143 Passivation structure and method of making the same |
| 02/26/2015 | US20150054142 Wafer Surface Conditioning for Stability in Fab Environment |
| 02/26/2015 | US20150054140 Stack of semiconductor structures and corresponding manufacturing method |
| 02/26/2015 | US20150054139 Through-silicon via with sidewall air gap |
| 02/26/2015 | US20150054138 Semiconductor device having stacked substrates with protruding and recessed electrode connection |
| 02/26/2015 | US20150054137 Semiconductor device and method for manufacturing the same |
| 02/26/2015 | US20150054136 Method of providing a via hole and routing structure |
| 02/26/2015 | US20150054131 Phase changing on-chip thermal heat sink |
| 02/26/2015 | US20150054129 Semiconductor device with pads of enhanced moisture blocking ability |
| 02/26/2015 | US20150054124 Inductor structure and manufacturing method thereof |
| 02/26/2015 | US20150054122 Method for forming self-aligned airgap interconnect structures |
| 02/26/2015 | US20150054102 Method for Applying Magnetic Shielding Layer, Method for Manufacturing a Die, Die and System |
| 02/26/2015 | US20150054092 Local interconnects by metal-iii-v alloy wiring in semi-insulating iii-v substrates |
| 02/26/2015 | US20150054082 Semiconductor structure with deep trench thermal conduction |
| 02/26/2015 | US20150054057 3d memory array with improved ssl and bl contact layout |
| 02/26/2015 | US20150054046 3D Non-Volatile Memory With Metal Silicide Interconnect |
| 02/26/2015 | US20150054036 Gallium Arsenide Based Device Having Non-Gold Ohmic Contacts |
| 02/26/2015 | US20150054020 High-power electronic devices containing metal nanoparticle-based thermal interface materials and related methods |