Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2005
04/27/2005EP1526568A1 Sealing method for electronic devices formed on a common semiconductor substrate and corresponding circuit structure
04/27/2005EP1526567A2 Bonded semiconductor device having alignment mark and fabrication method for the same
04/27/2005EP1525623A1 Semiconductor structure for imaging detectors
04/27/2005EP1525619A1 Surface-mounted semiconductor component and method for the production thereof
04/27/2005EP1525618A2 Semiconductor device with a cooling element
04/27/2005EP1525617A2 Thermal management system having porous fluid transfer element
04/27/2005EP1525616A1 Microstructural component, especially microstructured high-frequency component
04/27/2005EP1525615A2 Oxigen getter and method for forming it
04/27/2005EP1525586A2 Sublithographic nanoscale memory architecture
04/27/2005EP1525585A2 Stochastic assembly of sublithographic nanoscale interfaces
04/27/2005EP1525427A1 Heat-exchanging device
04/27/2005EP1483722A4 Memory module assembly using partially defective chips
04/27/2005EP1290928B1 Heatsink and heatsink device using the heatsink
04/27/2005EP1228535A4 Face-to-face chips
04/27/2005CN2696284Y High density power source module packaging structure
04/27/2005CN2696127Y Structure of joint pad
04/27/2005CN2696126Y IGBT labyrinth water-cooled heat sink
04/27/2005CN2696125Y Plate heat sink
04/27/2005CN2696124Y Heat sink
04/27/2005CN2696123Y Heat sink
04/27/2005CN2696122Y Heat sink
04/27/2005CN2696121Y Stacking fin type heat sink
04/27/2005CN2696031Y Heat sink assembly
04/27/2005CN1611002A Encapsulated component which is small in terms of height and method for producing the same
04/27/2005CN1610971A Electronic assembly with vertically connected capacitors and manufacturing method
04/27/2005CN1610970A Arrangement of vias in a substrate to support a ball grid array
04/27/2005CN1610969A Process for forming metalized contacts to periphery transistors
04/27/2005CN1610725A Chain extension for thermal materials
04/27/2005CN1610455A Water-capturing agent and organic EL device
04/27/2005CN1610386A Image sensor module of camera apparatus and assembling method thereof
04/27/2005CN1610255A 电子器件 Electronic devices
04/27/2005CN1610139A Micro refrigerator and producing method thereof
04/27/2005CN1610133A Optical semiconductor device
04/27/2005CN1610112A 半导体器件 Semiconductor devices
04/27/2005CN1610109A Stacked semiconductor device and semiconductor chip control method
04/27/2005CN1610108A Semiconductor device and semiconductor assembly
04/27/2005CN1610107A Semiconductor device and producing method thereof
04/27/2005CN1610106A Micron level chip packing structure
04/27/2005CN1610105A Temperature controll type heat pipe radiating apparatus
04/27/2005CN1610104A Cooling structure of electronic element
04/27/2005CN1610103A Electric insulated resin pulp used for chip carrying and packaging
04/27/2005CN1610102A Solid-state imaging device and method for manufacturing the same
04/27/2005CN1610101A Solid-state imaging device
04/27/2005CN1610092A 半导体装置 Semiconductor device
04/27/2005CN1610091A Semiconductor multi-layer wiring plate and forming method thereof
04/27/2005CN1610086A Test sample for bridging and continuous testing
04/27/2005CN1610084A Manufacturing method of tape carrier for TAB
04/27/2005CN1610083A Method for producing semiconductor and semiconductor device
04/27/2005CN1610082A Forced radiating packaging structure and forming method thereof
04/27/2005CN1610067A Method and device for cutting wire formed on semiconductor substrate
04/27/2005CN1610064A Semiconductor device
04/27/2005CN1610009A Cooling device and electronic apparatus building in the same
04/27/2005CN1609751A Cooling apparatus
04/27/2005CN1199545C Electromagnetic interference rejection body of low electromagnetic penetrability and reflectivity and its electronic device
04/27/2005CN1199536C Multilayer printed wiring board and method of producing multilayer printed wiring board
04/27/2005CN1199532C Process for forming metallic contact electronic circuit
04/27/2005CN1199531C Protecting circuit device using metal oxide semiconductor field effect transistor and its manufacturing method
04/27/2005CN1199328C Combined resistor-capacitor elements for decoupling in electronic packages
04/27/2005CN1199286C 半导体器件 Semiconductor devices
04/27/2005CN1199273C Semiconductor and its design method and design device
04/27/2005CN1199270C Stacked semiconductor device
04/27/2005CN1199269C Semiconductor device, method and device for producing same
04/27/2005CN1199268C 半导体装置及其制造方法 Semiconductor device and manufacturing method
04/27/2005CN1199267C Electric fuse with close space length and its production method in semiconductor
04/27/2005CN1199266C Semiconductor device and its manufacture method
04/27/2005CN1199265C 半导体器件 Semiconductor devices
04/27/2005CN1199264C Interposer and method of making same
04/27/2005CN1199263C Wafer integrating rigid supporting ring
04/27/2005CN1199262C Lead frame and copper alloy for lead frame
04/27/2005CN1199254C Component and method for the production thereof
04/27/2005CN1199253C Resin hermetically sealed type semiconductor devcie and liquid crystal display assembly
04/27/2005CN1199252C Housing assembly for electronic component
04/27/2005CN1199250C Device and method for aligning pipe core and hole mask layer on flexible substrate
04/27/2005CN1199092C Circuit arrangement and method for detecting undesired attack on integrated circuit
04/26/2005US6886142 Semiconductor device having embedded array
04/26/2005US6885814 Carbon wire heating object sealing heater and fluid heating apparatus using the same heater
04/26/2005US6885563 Power delivery and other systems for integrated circuits
04/26/2005US6885562 Circuit package and method for making the same
04/26/2005US6885561 Multiple chip module with integrated RF capabilities
04/26/2005US6885557 Heatsink assembly
04/26/2005US6885556 Electronic apparatus
04/26/2005US6885555 Cooling system for electronic devices
04/26/2005US6885553 Bus bar assembly for use with a compact power conversion assembly
04/26/2005US6885543 Fringing capacitor structure
04/26/2005US6885541 Capacitor, and capacitor manufacturing process
04/26/2005US6885540 Multi-layered unit including electrode and dielectric layer
04/26/2005US6885529 CDM ESD protection design using deep N-well structure
04/26/2005US6885522 Head assembly having integrated circuit chip covered by layer which prevents foreign particle generation
04/26/2005US6885278 Microconverter and laminated magnetic-core inductor
04/26/2005US6885275 Multi-track integrated spiral inductor
04/26/2005US6885232 Semiconductor integrated circuit having a function determination circuit
04/26/2005US6885208 Semiconductor device and test device for same
04/26/2005US6885109 Comprises exposed chips; packaging
04/26/2005US6885108 Protective layers formed on semiconductor device components so as to reduce or eliminate the occurrence of delamination thereof and cracking therein
04/26/2005US6885107 Flip-chip image sensor packages and methods of fabrication
04/26/2005US6885106 Stacked microelectronic assemblies and methods of making same
04/26/2005US6885105 Semiconductor device with copper wirings
04/26/2005US6885104 Semiconductor copper bond pad surface protection
04/26/2005US6885102 Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts
04/26/2005US6885101 Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
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