Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2005
04/28/2005US20050090027 System and apparatus for using test structures inside of a chip during the fabrication of the chip
04/28/2005US20050090026 Method of manufacturing a semiconductor device
04/28/2005US20050090025 Method of manufacturing a semiconductor device
04/28/2005US20050089776 Resist reflow measurement key and method of forming a fine pattern of a semiconductor device using the same
04/28/2005US20050089775 Fortified, compensated and uncompensated process-sensitive scatterometry targets
04/28/2005US20050089773 System and method for measuring overlay errors
04/28/2005US20050089771 Halftone mask to make photoresist regions of different film thicknesses as a resist pattern
04/28/2005US20050089700 Laminating a plurality of unit layers, consisting of Zn, Bi or Sn single metal layer or alloy layer, by vapor deposition, plating; solder junction connects a semiconductor device; lead-free, uniformity as melting point, thickness
04/28/2005US20050089280 Optoelectronic components with multi-layer feedthrough structure
04/28/2005US20050088833 Semiconductor device mounting board, method of manufacturing the same, method of inspecting the same, and semiconductor package
04/28/2005US20050088832 ESD protection structure and device utilizing the same
04/28/2005US20050088827 Electrical card having heatsink device
04/28/2005US20050088824 Heat sink with integrated electronics
04/28/2005US20050088823 Variable density graphite foam heat sink
04/28/2005US20050088822 Power electronic system with passive cooling
04/28/2005US20050088821 Heat dissipation device
04/28/2005US20050088820 Liquid cooling system
04/28/2005US20050088819 Heat dissipating device with fan holder
04/28/2005US20050088806 Circuit device
04/28/2005US20050088801 Decoupling capacitor
04/28/2005US20050088800 Capacitor and method of producing same
04/28/2005US20050088798 Complimentary metal oxide semiconductor capacitor and method for making same
04/28/2005US20050088591 Reflection type liquid crystal display device and method of manufacturing the same
04/28/2005US20050088565 Solid-state imaging device
04/28/2005US20050088564 Image sensor module of camera apparatus and assembling method thereof
04/28/2005US20050088551 Structure of a CMOS image sensor and method for fabricating the same
04/28/2005US20050088269 Semiconductor device
04/28/2005US20050088260 Electronic component module and manufacturing method thereof
04/28/2005US20050088241 Use of an internal on-chip inductor for electrostatic discharge protection of circuits which use bond wire inductance as their load
04/28/2005US20050088216 Circuit arrangement having a load transistor and a voltage limiting circuit and method for driving a load transistor
04/28/2005US20050088191 Probe testing structure
04/28/2005US20050088060 Compact electronic component including piezo-electric resonator mounted by face-down bonding with improved reliability
04/28/2005US20050087891 No-flow underfill composition and method
04/28/2005US20050087890 Resin molded type semiconductor device and a method of manufacturing the same
04/28/2005US20050087889 Electronic component and panel and method for the production thereof
04/28/2005US20050087888 Method for reduced input output area
04/28/2005US20050087887 RF circuit electrostatic discharge protection
04/28/2005US20050087886 Method and apparatus for improving defective solder joint detection using x-ray inspection of printed assemblies
04/28/2005US20050087885 Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof
04/28/2005US20050087884 Flip-chip light emitting diode
04/28/2005US20050087881 Electronic device
04/28/2005US20050087879 Logic device having vertically extending metal-insulator-metal capacitor between interconnect layers and method of fabricating the same
04/28/2005US20050087878 Semiconductor device
04/28/2005US20050087876 Interconnect structures incorporating low-k dielectric barrier films
04/28/2005US20050087875 Method of forming gas dielectric with support structure
04/28/2005US20050087874 Semiconductor device and method of manufacturing the same
04/28/2005US20050087872 Wiring structure of semiconductor device and method of manufacturing the same
04/28/2005US20050087871 Wiring structure of semiconductor device and production method of the device
04/28/2005US20050087870 Semiconductor device and method of forming the same
04/28/2005US20050087868 Depopulation of a ball grid array to allow via placement
04/28/2005US20050087867 Ball grid array package and method thereof
04/28/2005US20050087866 Flip-chip light emitting diode package structure
04/28/2005US20050087865 Multi-chip press-connected type semiconductor device
04/28/2005US20050087864 Cavity-down semiconductor package with heat spreader
04/28/2005US20050087863 Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument
04/28/2005US20050087862 Electronic component package and method of manufacturing same
04/28/2005US20050087861 Back-face and edge interconnects for lidded package
04/28/2005US20050087860 Multilayered substrate for semiconductor device
04/28/2005US20050087859 Semiconductor chip package and method for manufacturing the same
04/28/2005US20050087858 Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts
04/28/2005US20050087857 Circuit device
04/28/2005US20050087856 Electromagnetic noise shielding in semiconductor packages using caged interconnect structures
04/28/2005US20050087855 Microelectronic component and assembly having leads with offset portions
04/28/2005US20050087854 Power module flip chip package
04/28/2005US20050087853 Semiconductor device and method of manufacturing the same
04/28/2005US20050087852 Chip package structure and process for fabricating the same
04/28/2005US20050087851 Electronic module having plug contacts and method for producing it
04/28/2005US20050087850 Wiring board and semiconductor device
04/28/2005US20050087848 Chip scale package and method of fabricating the same
04/28/2005US20050087847 Method for fabricating a semiconductor package with multi layered leadframe
04/28/2005US20050087844 Chip structure and process for forming the same
04/28/2005US20050087838 Method of forming metal-insulator-metal (MIM) capacitors at copper process
04/28/2005US20050087837 Semiconductor device and method of manufacturing the same
04/28/2005US20050087836 Electrically programmable polysilicon fuse with multiple level resistance and programming
04/28/2005US20050087808 Versatile system for electrostatic discharge protection utilizing silicon controlled rectifier
04/28/2005US20050087807 Integrated circuit bond pad structures and methods of making
04/28/2005US20050087806 Semiconductor device having active regions connected together by interconnect layer and method of manufacture thereof
04/28/2005US20050087784 Structure of a CMOS image sensor and method for fabricating the same
04/28/2005US20050087761 Versatile system for electrostatic discharge protection utilizing silicon controlled rectifier
04/28/2005US20050087759 System and method for surface reduction, passivation, corrosion prevention and activation of copper surface
04/28/2005US20050087756 Light transmissive cover, device provided with same and methods for manufacturing them
04/28/2005US20050087741 Semiconductor display device
04/28/2005US20050087739 Semiconductor device and fabrication method for the same
04/28/2005US20050087517 Adhesion between carbon doped oxide and etch stop layers
04/28/2005US20050087447 Addition of cyanine dye allows copper plating from trenches and vias having high aspect ratio which have been formed on surfaces of substrate; electromigration
04/28/2005US20050087364 Multilayer wiring board
04/28/2005US20050087356 Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing
04/28/2005US20050087329 Heat dissipation module with a pair of fans
04/28/2005US20050087327 Supporting structure for planar heat pipe
04/28/2005US20050087326 Heat sinks
04/28/2005US20050086797 Aluminum heat sink for a solid state relay having ultrasonically welded copper foil
04/28/2005DE20319086U1 Cooler for electronic components has heat sink with contact surface on base for component to be cooled and cavity with coolant liquid
04/27/2005EP1526579A2 Solid-state imaging device and method for manufacturing the same
04/27/2005EP1526578A2 Solid-state imaging device
04/27/2005EP1526577A2 Method for manufacturing solid-state imaging devices
04/27/2005EP1526573A2 Inverter device and method of manufacturing the device thereof, and electric automobile incorporating the inverter device thereof
04/27/2005EP1526572A2 Semiconductor package with bond wire inductors
04/27/2005EP1526571A2 Integrated circuit package with integral leadrame heat dissipator and manufacturing method therefor
04/27/2005EP1526570A2 Heat sinks
04/27/2005EP1526569A2 Metal/ceramic bonding substrate and method for producing same
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