Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2005
05/03/2005US6887783 Bilayer HDP CVD/PE CVD cap in advance BEOL interconnect structures and method thereof
05/03/2005US6887780 Concentration graded carbon doped oxide
05/03/2005US6887779 Integrated circuit structure
05/03/2005US6887778 Semiconductor device and manufacturing method
05/03/2005US6887777 Method for connecting an integrated circuit to a substrate and corresponding circuit arrangement
05/03/2005US6887769 Dielectric recess for wafer-to-wafer and die-to-die metal bonding and method of fabricating the same
05/03/2005US6887766 Semiconductor device and method of fabricating the same
05/03/2005US6887753 Methods of forming semiconductor circuitry, and semiconductor circuit constructions
05/03/2005US6887744 Method of forming a thin film transistor substrate with a interconnection electrode
05/03/2005US6887741 Method for making an enhanced die-up ball grid array package with two substrates
05/03/2005US6887740 Method for making an integrated circuit package having reduced bow
05/03/2005US6887739 Method of manufacturing semiconductor package including forming a resin sealing member
05/03/2005US6887738 Method of making semiconductor device with flip chip mounting
05/03/2005US6887737 Epoxidized acetals and thioacetals, episulfidized acetals and thioacetals, and reworkable thermosetting resin compositions formulated therefrom
05/03/2005US6887724 Test element group, method of manufacturing a test element group, method of testing a semiconductor device, and semiconductor device
05/03/2005US6887723 Method for processing an integrated circuit including placing dice into a carrier and testing
05/03/2005US6887580 Adhesive polyimide resin and adhesive laminate
05/03/2005US6887512 Method for fabricating printed-wiring substrate
05/03/2005US6887353 Tailored barrier layer which provides improved copper interconnect electromigration resistance
05/03/2005US6887330 Machine for punching out electronic circuitry parts, method for replacing tape supply reels, and method for producing electronic circuitry parts from tape
05/03/2005US6887085 Terminal for spiral contactor and spiral contactor
05/03/2005US6886735 Method of thermosonic wire bonding process for copper connection in a chip
05/03/2005US6886627 Radial heat sink with helical shaped fins
05/03/2005US6886249 Method for making finned heat sink assemblies
05/03/2005US6886248 Conductive material and method for filling via-hole
05/03/2005US6886247 Circuit board singulation methods
05/03/2005US6886246 Method for making an article having an embedded electronic device
05/03/2005CA2230009C Anti-tamper integrated circuit
04/2005
04/28/2005WO2005039262A1 Method of producing module with embedded component and module with embedded component
04/28/2005WO2005039261A2 Solder structures for out of plane connections and related methods
04/28/2005WO2005039260A1 Electronic device and method of manufacturing thereof
04/28/2005WO2005038995A2 Memory link processing with picosecond lasers
04/28/2005WO2005038994A2 Laser-based system for memory link processing with picosecond lasers
04/28/2005WO2005038989A2 Fretting and whisker resistant coating system and method
04/28/2005WO2005038986A2 Electrical circuit apparatus and methods for assembling same
04/28/2005WO2005038926A1 Semiconductor device and method of manufacturing such a semiconductor device
04/28/2005WO2005038919A1 Power semiconductor module, and power converter and mobile unit using the same
04/28/2005WO2005038918A1 Power semiconductor module, power converter employing it and mobile unit
04/28/2005WO2005038917A1 Package structure and packaging method of semiconductor device
04/28/2005WO2005038916A2 Inductor coil for an ic chip
04/28/2005WO2005038915A1 Method for providing double-sided cooling of leadframe-based wire-bonded electronic packages and device produced thereby
04/28/2005WO2005038914A1 Heat sink clip mechanism
04/28/2005WO2005038913A1 Thermal interface material
04/28/2005WO2005038912A1 Carbonaceous heat spreader and associated methods
04/28/2005WO2005038911A1 Device, system and electric element
04/28/2005WO2005038909A2 Integrated package design for a radiation sensing device and manufacturing method
04/28/2005WO2005038908A1 Electronic device and manufacturing method thereof
04/28/2005WO2005038907A2 Heat-conducting coating of electronic circuit assemblies
04/28/2005WO2005038904A1 Semiconductor device
04/28/2005WO2005038882A2 Electronic device and method of manufacturing thereof
04/28/2005WO2005038880A2 Via density rules
04/28/2005WO2005038876A2 Wiring protection element for laser deleted tungsten fuse
04/28/2005WO2005038869A2 Electronically programmable antifuse and circuits made therewith
04/28/2005WO2005038865A2 Amorphous carbon layer to improve photoresist adhesion
04/28/2005WO2005038863A2 Method and system for treating a dielectric film
04/28/2005WO2005038861A2 High density integrated circuit package architecture
04/28/2005WO2005038859A2 Liquid cooling system
04/28/2005WO2005038761A2 Heat spreader for display device
04/28/2005WO2005038240A1 Flexible route structure of semiconductor chip
04/28/2005WO2005037913A2 Highly conductive macromolecular materials and improved methods for making same
04/28/2005WO2005037888A1 Epoxy resin composition and semiconductor device
04/28/2005WO2005019195A3 Nano-filled composite materials with exceptionally high glass transition temperature
04/28/2005WO2005017998A3 Bipolar transistor with a heterojunction with improved thermal transfer
04/28/2005WO2005013339A3 Methods of forming conductive structures including titanium-tungsten base layers and related structures
04/28/2005WO2005010967A3 Device and method for machining the rear side of semiconductor chips
04/28/2005WO2005006395A3 Heat transfer device and method of making same
04/28/2005WO2004114406A3 Structured semiconductor element for reducing charging effects
04/28/2005WO2004095517A3 Passivation layer for group iii-v semiconductor devices
04/28/2005WO2004093252A3 Electrical connector and method for making
04/28/2005WO2004081972A3 Housing body, optoelectronic component with a housing body of this type, and plastic housing material
04/28/2005WO2004043130A3 Mechanically enhanced package and method of making same
04/28/2005WO2004034432A3 Power mosfet
04/28/2005WO2004027866A8 Method for creating a link in an integrated metal substrate
04/28/2005WO2004025726A3 Method for selectively covering a micro machined surface
04/28/2005WO2004001904A3 Stabilized wire bonded electrical connections and method of making same
04/28/2005US20050091440 Memory system and memory module
04/28/2005US20050090923 Method for monitoring a batch system
04/28/2005US20050090922 Test circuit, semiconductor product wafer having the test circuit, and method of monitoring manufacturing process using the test circuit
04/28/2005US20050090916 Intra-chip power and test signal generation for use with test structures on wafers
04/28/2005US20050090598 Crosslinkable elastomer composition and molded article produced from same
04/28/2005US20050090223 Use of a down-bond as a controlled inductor in integrated circuit applications
04/28/2005US20050090125 Electronic assembly having a more dense arrangement of contacts that allows for routing of traces to the contacts
04/28/2005US20050090103 Method to increase electromigration resistance of copper using self-assembled organic thiolate monolayers
04/28/2005US20050090102 Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding
04/28/2005US20050090099 Thin film semiconductor package and method of fabrication
04/28/2005US20050090098 Method for making a semiconductor device having increased conductive material reliability
04/28/2005US20050090093 Stress free etch processing in combination with a dynamic liquid meniscus
04/28/2005US20050090090 Method of fabricating ultra thin flip-chip package
04/28/2005US20050090089 Method for forming solder bump structure
04/28/2005US20050090087 Nickel silicide - silicon nitride adhesion through surface passivation
04/28/2005US20050090083 Advanced barrier linear formation for vias
04/28/2005US20050090071 Fabricating semiconductor chips
04/28/2005US20050090044 Epoxy resin compositions and semiconductor devices
04/28/2005US20050090043 Manufacturing method of ball grid array package
04/28/2005US20050090042 Integrated circuit die and an electronic assembly having a three-dimensional interconnection scheme
04/28/2005US20050090041 Constructing of an electronic assembly having a decoupling capacitor
04/28/2005US20050090040 Via-in-pad with off-center geometry and methods of manufacture
04/28/2005US20050090039 Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding
04/28/2005US20050090037 Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding
04/28/2005US20050090035 Method for fabricating CMOS image sensor protecting low temperature oxide delamination
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