Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2005
05/04/2005CN1612354A Multi finger-like transistor
05/04/2005CN1612346A Multi-chip package type memory system
05/04/2005CN1612343A Inductors having interconnect and inductor portions providing combined magnetic fields
05/04/2005CN1612342A 半导体芯片 Semiconductor chip
05/04/2005CN1612340A Multi-chip packages having a plurality of flip chips and methods of manufacturing the same
05/04/2005CN1612339A Programmable resistance element and programming and forming method thereof
05/04/2005CN1612338A 静电放电保护电路 Electrostatic discharge protection circuit
05/04/2005CN1612337A 存储器系统和存储器模块 Memory systems and memory modules
05/04/2005CN1612336A Semiconductor apparatus and method of fabricating the same
05/04/2005CN1612335A Improved semiconductor lead carriage
05/04/2005CN1612334A Chip-grade package with saw-edge protection chip
05/04/2005CN1612333A 连接垫结构 Connection pad structure
05/04/2005CN1612332A 液体冷却系统 Liquid cooling system
05/04/2005CN1612331A Semiconductor device having metal plates and semiconductor chip
05/04/2005CN1612330A Substrate-based integrated circuit package
05/04/2005CN1612329A Circuit-component carrying substrate
05/04/2005CN1612328A A method for fabricating a medium window of a buried capacitor
05/04/2005CN1612323A Method for wiring design of semiconductor integrated circuit and semiconductor integrated circuit
05/04/2005CN1612318A Method for making semiconductor device
05/04/2005CN1612317A Method for making semiconductor device
05/04/2005CN1612310A Manufacturing method of semiconductor device and semiconductor device
05/04/2005CN1612309A Semiconductor device and method and apparatus for making same
05/04/2005CN1612084A Solute-dissolving, temperature-reducing and cooling device for reducing computer chip temperature
05/04/2005CN1611929A Method and apparatus for improving defective solder joint detection using x-ray inspection of printed assemblies
05/04/2005CN1611889A Heating sensing system for electric refrigerator via internet and its working method
05/04/2005CN1611888A Radiating system for electric refrigerator via Internet and its working method
05/04/2005CN1200600C Cooling apparatus for electronic machine
05/04/2005CN1200597C Manufacturing method for multilayer ceramic substrate
05/04/2005CN1200465C Packaged structure of display element and its packaging method
05/04/2005CN1200461C Semiconductor device and its mfg. method
05/04/2005CN1200460C Chip holder for chip module and method for producing said chip module
05/04/2005CN1200459C Electronic equipment
05/04/2005CN1200458C Substrate structure for preventing crack generation on weld shielding layer at device position
05/04/2005CN1200012C Organic antireflecting coating and its preparation
05/03/2005US6889155 High frequency module board device
05/03/2005US6888725 Electronics device unit
05/03/2005US6888722 Thermal design for minimizing interface in a multi-site thermal contact condition
05/03/2005US6888721 Electrohydrodynamic (EHD) thin film evaporator with splayed electrodes
05/03/2005US6888720 Distributed graphitic foam heat exchanger system
05/03/2005US6888719 For use in computers
05/03/2005US6888716 On-die de-coupling capacitor using bumps or bars
05/03/2005US6888432 Laminated substrate, method of producing the same, nonreciprocal circuit element, and communication device
05/03/2005US6888428 High frequency semiconductor integrated circuit capable of switching between characteristics
05/03/2005US6888398 Externally programmable antifuse
05/03/2005US6888395 Semiconductor integrated circuit device
05/03/2005US6888365 Semiconductor wafer testing system
05/03/2005US6888362 Test head assembly for electronic components with plurality of contoured microelectronic spring contacts
05/03/2005US6888332 Computer system and method of controlling rotation speed of cooling fan
05/03/2005US6888261 Alignment mark and exposure alignment system and method using the same
05/03/2005US6888260 Alignment or overlay marks for semiconductor processing
05/03/2005US6888259 Adhesion between a protective layer, which covers a wiring layer, and potting material, which covers a microchip
05/03/2005US6888258 Adhesion between a pad area and a wire; simplification
05/03/2005US6888257 Useful for integrated circuit packages enabling conducting heat generated by the die
05/03/2005US6888256 Compliant relief wafer level packaging
05/03/2005US6888255 Built-up bump pad structure and method for same
05/03/2005US6888254 Semiconductor device
05/03/2005US6888253 Inexpensive wafer level MMIC chip packaging
05/03/2005US6888252 Method of forming a conductive contact
05/03/2005US6888250 Semiconductor device, method for manufacturing the same, method for generating mask data, mask and computer readable recording medium
05/03/2005US6888248 Extended length metal line for improved ESD performance
05/03/2005US6888246 Semiconductor power device with shear stress compensation
05/03/2005US6888245 Semiconductor device
05/03/2005US6888244 Interconnect arrangement and method for fabricating an interconnect arrangement
05/03/2005US6888243 Semiconductor device
05/03/2005US6888242 Color contacts for a semiconductor package
05/03/2005US6888240 High performance, low cost microelectronic circuit package with interposer
05/03/2005US6888239 Ceramic package sealing structure and ceramic package having said sealing structure
05/03/2005US6888238 Low warpage flip chip package solution-channel heat spreader
05/03/2005US6888236 For a hot plate, an electrostatic chuck, a wafer prober
05/03/2005US6888235 Power delivery system for integrated circuits utilizing discrete capacitors
05/03/2005US6888234 Semiconductor device and manufacturing method for the same
05/03/2005US6888232 Semiconductor package having a heat-activated source of releasable hydrogen
05/03/2005US6888231 Surface mounting semiconductor device
05/03/2005US6888230 Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device
05/03/2005US6888229 Connection components with frangible leads and bus
05/03/2005US6888228 Lead frame chip scale package
05/03/2005US6888227 Apparatus for routing signals
05/03/2005US6888225 Process of final passivation of an integrated circuit device
05/03/2005US6888224 Methods and systems for fabricating electrical connections to semiconductor structures incorporating low-k dielectric materials
05/03/2005US6888222 Semiconductor device
05/03/2005US6888220 Semiconductor device having a buried wiring lead structure
05/03/2005US6888218 Embedded capacitor multi-chip modules
05/03/2005US6888215 Dual damascene anti-fuse with via before wire
05/03/2005US6888210 Lateral DMOS transistor having reduced surface field
05/03/2005US6888209 Semiconductor package and method of fabricating the same
05/03/2005US6888201 Bipolar ESD protection structure
05/03/2005US6888183 Manufacture method for semiconductor device with small variation in MOS threshold voltage
05/03/2005US6888174 Opto-electronic semiconductor component
05/03/2005US6888159 Substrate mapping
05/03/2005US6888158 Bare chip carrier and method for manufacturing semiconductor device using the bare chip carrier
05/03/2005US6888157 N-Gate/N-Substrate or P-Gate/P-Substrate capacitor to characterize polysilicon gate depletion evaluation
05/03/2005US6888072 Fixture, circuit board with fixture, and electronic-component mounted body and method of manufacturing the same
05/03/2005US6888063 Device and method for providing shielding in radio frequency integrated circuits to reduce noise coupling
05/03/2005US6887804 Passivation processing over a memory link
05/03/2005US6887803 Gas-assisted rapid thermal processing
05/03/2005US6887792 Embossed mask lithography
05/03/2005US6887791 Optimization methods for on-chip interconnect geometries suitable for ultra deep sub-micron processes
05/03/2005US6887790 Method of forming dummy copper plug to improve low k structure mechanical strength and plug fill uniformity
05/03/2005US6887787 Method for fabricating semiconductor components with conductors having wire bondable metalization layers
05/03/2005US6887784 Self aligned metal interconnection and method of making the same
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