Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2005
05/05/2005US20050093136 Thermal dissipating element of a chip
05/05/2005US20050093135 Thermal dissipating element of a chip
05/05/2005US20050093134 Device packages with low stress assembly process
05/05/2005US20050093133 High density microvia substrate with high wireability
05/05/2005US20050093132 RFIC die-package configuration
05/05/2005US20050093131 Semiconductor device having metal plates and semiconductor chip
05/05/2005US20050093130 Antenna-incorporated semiconductor device
05/05/2005US20050093129 Semiconductor device and manufacturing method thereof
05/05/2005US20050093128 Semiconductor device, process of producing semiconductor device, and ink jet recording head
05/05/2005US20050093127 Multi-surface IC packaging structures and methods for their manufacture
05/05/2005US20050093125 Semiconductor device, electronic card and pad rearrangement substrate
05/05/2005US20050093124 Semiconductor device, electronic card and pad rearrangement substrate
05/05/2005US20050093123 Power semiconductor device and power semiconductor module
05/05/2005US20050093121 Chip package and substrate
05/05/2005US20050093120 Detachable on package voltage regulation module
05/05/2005US20050093119 Window type case for memory card
05/05/2005US20050093118 Semiconductor device
05/05/2005US20050093117 thickness and cost reduction
05/05/2005US20050093116 Surface mount package for a high power light emitting diode
05/05/2005US20050093115 Method of mounting a circuit component and joint structure therefor
05/05/2005US20050093114 Tape circuit substrate and semiconductor apparatus employing the same
05/05/2005US20050093113 Thin film semiconductor package and method of fabrication
05/05/2005US20050093112 Semiconductor package capable of absorbing electromagnetic wave
05/05/2005US20050093111 System and method for using film deposition techniques to provide an antenna within an integrated circuit package
05/05/2005US20050093110 Semiconductor device for reducing photovolatic current
05/05/2005US20050093108 Insulating layer having decreased dielectric constant and increased hardness
05/05/2005US20050093107 Thin dielectric layers on substrates, and methods of making the same
05/05/2005US20050093102 Mixed lvr and hvr reticle set design for the processing of gate arrays, embedded arrays and rapid chip products
05/05/2005US20050093095 Semiconductor device and method of fabricating the same
05/05/2005US20050093093 Capacitor integration at top-metal level with a protective cladding for copper surface protection
05/05/2005US20050093091 Structure and programming of laser fuse
05/05/2005US20050093090 Semiconductor device and manufacturing method thereof
05/05/2005US20050093073 Low voltage NMOS-based electrostatic discharge lamp
05/05/2005US20050093071 Substrate based ESD network protection for a flip chip
05/05/2005US20050093070 Fully silicided NMOS device for electrostatic discharge protection
05/05/2005US20050093069 Lateral high-voltage junction device
05/05/2005US20050093064 Semiconductor integrated circuit device
05/05/2005US20050093056 Nonvolatile memory device and method for manufacturing the same
05/05/2005US20050093051 Semiconductor device
05/05/2005US20050093050 One mask high density capacitor for integrated circuits
05/05/2005US20050093012 System, method and apparatus for self-cleaning dry etch
05/05/2005US20050093010 Ic package with stacked sheet metal substrate
05/05/2005US20050093005 Optoelectronic component and method for producing it
05/05/2005US20050092989 Technique for attaching die to leads
05/05/2005US20050092988 Mounting member of semiconductor device, mounting configuration of semiconductor device, and drive unit of semiconductor device
05/05/2005US20050092986 Method for monitoring production of pixel detectors and detectors produced thereby
05/05/2005US20050092985 Single and double-gate pseudo-fet devices for semiconductor materials evaluation
05/05/2005US20050092848 Integrated circuit having an active shield
05/05/2005US20050092720 Laser-based method and system for memory link processing with picosecond lasers
05/05/2005US20050092521 Microvia structure and fabrication
05/05/2005US20050092508 Circuit device
05/05/2005US20050092478 Metal foam heat sink
05/05/2005US20050092468 Water tray of liquid based cooling device
05/05/2005US20050092466 Heat-transport device, method for manufacturing the same, and electronic device
05/05/2005US20050092465 Dual-layer heat dissipating structure
05/05/2005US20050092464 Heat sink with carbon nanotubes and method for manufacturing same
05/05/2005US20050092463 Multi-heatsink integrated cooler
05/05/2005US20050092399 Self-encapsulated silver alloys for interconnects
05/05/2005US20050092007 Cooling of surface temperature of a device
05/05/2005US20050091989 Cooling system for an electronic component
05/05/2005US20050091931 Method to increase electromigration resistance of copper using self-assembled organic thiolate monolayers
05/05/2005US20050091863 Calibration wafer and kit
05/05/2005US20050091844 Solderless electronics packaging and methods of manufacture
05/05/2005US20050091842 Manufacturing method of lead frame for optical coupling device as well as optical coupling device using this lead frame
05/04/2005EP1528850A1 Power electronic system with passive cooling
05/04/2005EP1528849A1 Liquid cooling system
05/04/2005EP1528847A1 Heat dissipating insert, circuit comprising said insert and production method
05/04/2005EP1528642A2 Production method of anisotropic conductive film
05/04/2005EP1528619A2 Method and apparatus for cooling heat-generating structure
05/04/2005EP1528602A1 Semiconductor device using semiconductor chip
05/04/2005EP1528596A1 Holder for at least one stack of semiconductor as well as electric system provided with the same
05/04/2005EP1528595A1 Lead frame, wire-bonding stage and method for fabricating a semiconductor apparatus
05/04/2005EP1528593A1 Semiconductor device and method for manufacturing the same
05/04/2005EP1527480A2 Semiconductor device and method of manufacturing the same
05/04/2005EP1527479A1 Method for the production of an electrically-conducting frame, method for production of a surface mounting semiconductor component and conductor frame strips
05/04/2005EP1474959B1 Method for embedding a component in a base and forming a contact
05/04/2005EP1433370B1 Power delivery connector for integrated circuits with capacitor
05/04/2005DE202005002110U1 Lichtemittierende Vorrichtung A light emitting device
05/04/2005CN2698030Y Radiation structure for power source of module
05/04/2005CN2698020Y Fixator
05/04/2005CN2697858Y Electric connector
05/04/2005CN2697827Y Internal set type package structure
05/04/2005CN2697826Y Radiator with multiple flow way
05/04/2005CN2697825Y Improved air cooling radiator structure
05/04/2005CN2697824Y Heat sink structure for power semiconductor
05/04/2005CN2697823Y Heat sink
05/04/2005CN2697822Y Self-fastening heat sink
05/04/2005CN2697821Y Plane grating array connector
05/04/2005CN1613154A MEMS device having contact and standoff bumps and related methods
05/04/2005CN1613152A A thin film transistor array panel and a method for manufacturing the same
05/04/2005CN1613149A Chip module
05/04/2005CN1613148A Semiconductor device with co-packaged die
05/04/2005CN1613128A MEMS device having a trilayered beam and related methods
05/04/2005CN1613015A Method and apparatus for detecting bearing failure
05/04/2005CN1612684A Heat spreader for emissive display device
05/04/2005CN1612366A Low cost lighting circuits manufactured from conductive loaded resin-based materials
05/04/2005CN1612364A Efficient radiating support device for light-emitting diode
05/04/2005CN1612362A Manufacturing method of lead frame and optical coupling device using this lead frame
05/04/2005CN1612359A 半导体装置 Semiconductor device
05/04/2005CN1612355A Transistor structure with thermal protection function
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