Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2005
05/06/2005WO2005040067A1 Carbon nanotube-dispersed composite material, method for producing same and article same is applied to
05/06/2005WO2005040066A1 Carbon nanotube-dispersed composite material, method for producing same and article same is applied to
05/06/2005WO2005040065A1 Method for producing carbon nanotube-dispersed composite material
05/06/2005WO2005010990A3 Memory stack using flexible circuit and low-profile contacts
05/06/2005WO2004109763A3 High impedance radio frequency power plastic package
05/06/2005WO2004109759A3 Integrated heat spreader lid
05/06/2005WO2004097896A3 A packaged integrated circuit having a heat spreader and method therefor
05/06/2005WO2004072998A3 Protecting resin-encapsulated components
05/06/2005WO2003090245A8 Thermionic vacuum diode device with adjustable electrodes
05/05/2005US20050097379 Method for controlling power change for a semiconductor module
05/05/2005US20050097264 Memory module with registers
05/05/2005US20050096779 Tunable alignment geometry
05/05/2005US20050095875 Fabrication method of semiconductor package with heat sink
05/05/2005US20050095862 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same
05/05/2005US20050095857 Methods of forming contact plugs including polysilicon doped with an impurity having a lesser diffusion coefficient than phosphorus and related structures
05/05/2005US20050095849 Integrated circuits with openings that allow electrical contact to conductive features having self-aligned edges
05/05/2005US20050095848 Method of fabricating a stacked local interconnect structure
05/05/2005US20050095847 Semiconductor device and manufacturing method thereof
05/05/2005US20050095844 Semiconductor integrated circuit device
05/05/2005US20050095843 Method for improving reliability of copper interconnects
05/05/2005US20050095842 Semiconductor device and manufacturing method thereof
05/05/2005US20050095837 Structure and method for forming a dielectric chamber and electronic device including the dielectric chamber
05/05/2005US20050095836 Bond pad scheme for Cu process
05/05/2005US20050095835 Structure and method of making capped chips having vertical interconnects
05/05/2005US20050095824 Method for manufacturing semiconductor device
05/05/2005US20050095812 Process for strengthening semiconductor substrates following thinning
05/05/2005US20050095802 Alignment mark structure
05/05/2005US20050095781 Capacitor integration at top-metal level with a protection layer for the copper surface
05/05/2005US20050095752 Method for manufacturing ball grid array package
05/05/2005US20050095751 Method of making a semiconductor device that has copper damascene interconnects with enhanced electromigration reliability
05/05/2005US20050095750 Wafer level transparent packaging
05/05/2005US20050095747 Method of RFIC die-package configuration
05/05/2005US20050095746 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
05/05/2005US20050095729 Method for evaluating solution for coating film for semiconductor
05/05/2005US20050095727 Test region layout for shallow trench isolation
05/05/2005US20050095443 Plasma enhanced ALD of tantalum nitride and bilayer
05/05/2005US20050095439 Optical targets
05/05/2005US20050095438 Coating glass on metal layer; heat treatment; plating; supporting electronic part in cavity; laminated ceramic sheets
05/05/2005US20050095410 Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating
05/05/2005US20050095366 Jetting viscous liquid onto substrate; applying drops; valves; accuracy zones and edges; soldering
05/05/2005US20050094951 Method and apparatus for hermetic sealing of assembled die
05/05/2005US20050094944 Optical fiber terminator package
05/05/2005US20050094708 Integrated thermal sensor for microwave transistors
05/05/2005US20050094433 Stacked semiconductor device including improved lead frame arrangement
05/05/2005US20050094383 Substrate for use in forming electronic package
05/05/2005US20050094381 Substrate includes an amorphous glass phase having a positive coefficient of thermal expansion, a crystal phase including microcrystallites having a negative coefficient of thermal expansion, mean size < than 4 lambda R.,after surface treatment, has high spatial frequency roughness < than lamda R/30 rms
05/05/2005US20050094379 Heat dissipation device assembly incorporating retention member
05/05/2005US20050094377 Heat sink assembly incorporating spring clip
05/05/2005US20050094375 Integrated heat dissipating device with curved fins
05/05/2005US20050094374 Power conditioning module
05/05/2005US20050094373 Method and apparatus for cooling heat-generating structure
05/05/2005US20050094372 Electronic device and module structure thereof
05/05/2005US20050094302 Magnetic thin film, magnetic component that uses this magnetic thin film, manufacturing methods for the same, and a power conversion device
05/05/2005US20050093790 Matching circuits on optoelectronic devices
05/05/2005US20050093668 Coil on a semiconductor substrate and method for its production
05/05/2005US20050093667 Three-dimensional inductive micro components
05/05/2005US20050093640 Apparatus and method for reducing propagation delay in a conductor
05/05/2005US20050093458 Method of processing a substrate
05/05/2005US20050093181 Heat sinkable package
05/05/2005US20050093180 Chip scale packaged semiconductor device
05/05/2005US20050093179 Semiconductor device
05/05/2005US20050093178 Package structure with a retarding structure and method of making same
05/05/2005US20050093177 Semiconductor package, method for manufacturing the same and lead frame for use in the same
05/05/2005US20050093176 Bonding pad structure
05/05/2005US20050093175 Arrangement for improving the reliability of semiconductor modules
05/05/2005US20050093174 Reduced footprint packaged microelectronic components and methods for manufacturing such microelectronic components
05/05/2005US20050093173 Semiconductor package having dicrete non-active electrical components incorporated into the package
05/05/2005US20050093172 Electronic circuit device, and method and apparatus for manufacturing the same
05/05/2005US20050093171 Surface acoustic wave apparatus
05/05/2005US20050093170 Integrated interconnect package
05/05/2005US20050093169 Semiconductor device and method of manufacturing semiconductor device
05/05/2005US20050093167 Semiconductor chip and semiconductor device
05/05/2005US20050093166 Semiconductor device and method of manufacturing the same
05/05/2005US20050093165 Semiconductor device and method of manufacturing the same
05/05/2005US20050093164 Filler and electroconductive binder particles; stencil printing
05/05/2005US20050093163 Multiple copper vias for integrated circuit metallization
05/05/2005US20050093162 Adhesion layer of 11-trichlorosilylundecyl thioacetate coupled to a copper layer formed over a dielectric layer via the thioacetate group and a silicon dioxide layer via the trichlorosilyl group
05/05/2005US20050093161 Semiconductor device
05/05/2005US20050093160 Semiconductor device and method for fabricating the same
05/05/2005US20050093159 Stress-relief layer for semiconductor applications
05/05/2005US20050093158 Eliminates overlying exposure mask of photoresist
05/05/2005US20050093156 Semiconductor apparatus and method of fabricating the same
05/05/2005US20050093155 Superior wettabilitiy and coverage; high throughput; high performance devices; chemical vaporization and sputtering application
05/05/2005US20050093153 BGA package with component protection on bottom
05/05/2005US20050093152 Multi-surface contact IC packaging structures and assemblies
05/05/2005US20050093151 Semiconductor circuit with multiple contact sizes
05/05/2005US20050093150 Semiconductor device and method of manufacturing the same
05/05/2005US20050093149 Semiconductor device and method of manufacturing the same
05/05/2005US20050093148 Interconnection element for BGA housings and method for producing the same
05/05/2005US20050093147 Structure for reducing leakage currents and high contact resistance for embedded memory and method for making same
05/05/2005US20050093146 Support body for semiconductor element, method for manufacturing the same and semiconductor device
05/05/2005US20050093145 Asic-embedded switchable antenna arrays
05/05/2005US20050093144 Multi-chip module
05/05/2005US20050093143 Semiconductor package for memory chips
05/05/2005US20050093142 Passive element chip and manufacturing method thereof, and highly integrated module and manufacturing method thereof
05/05/2005US20050093141 Micro-electromechanical system and method for production thereof
05/05/2005US20050093140 Heat spreader, heat sink, heat exchanger and PDP chassis base
05/05/2005US20050093139 Semiconductor package with lid heat spreader
05/05/2005US20050093138 Using external radiators with electroosmotic pumps for cooling integrated circuits
05/05/2005US20050093137 Semiconductor apparatus
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