Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2005
05/10/2005US6891276 Having terminals that protrude downwardly from bottom surface of insulative housing and leads that protrude laterally from side surfaces; terminals and leads are connected together and to chip pads in one-to-one relation; simplified testing
05/10/2005US6891275 Method for accommodating small minimum die in wire bonded area array packages
05/10/2005US6891274 Under-ball-metallurgy layer including adhesion layer, barrier layer fabricated using nickel-vanadium alloy, and wettable layer fabricated using copper and having specified thickness; improved bonding strength
05/10/2005US6891273 Semiconductor package and fabrication method thereof
05/10/2005US6891272 Multi-path via interconnection structures and methods for manufacturing the same
05/10/2005US6891270 Semiconductor device and method of manufacturing the same
05/10/2005US6891269 Having barrier layer and metal growth promoting layer of titanium nitride containing oxygen at lower concentration than barrier layer jointly as ground layer; reduces incubation time for forming embedded copper interconnection layer
05/10/2005US6891267 Semiconductor switching circuit device
05/10/2005US6891266 RF transition for an area array package
05/10/2005US6891265 Semiconductor device having radiation structure
05/10/2005US6891263 Ceramic substrate for a semiconductor production/inspection device
05/10/2005US6891261 Semiconductor device and method of manufacturing the same
05/10/2005US6891260 Integrated circuit package substrate with high density routing mechanism
05/10/2005US6891259 Semiconductor package having dam and method for fabricating the same
05/10/2005US6891258 Interposer providing low-inductance decoupling capacitance for a packaged integrated circuit
05/10/2005US6891257 Packaging system for die-up connection of a die-down oriented integrated circuit
05/10/2005US6891256 Vertical power semiconductor die package; improved heat dissipation properties
05/10/2005US6891255 Microelectronic packages having an array of resilient leads
05/10/2005US6891254 Semiconductor device with protrusions
05/10/2005US6891253 Semiconductor integrated circuit device and method of manufacturing the same
05/10/2005US6891252 Electronic component with a semiconductor chip and method of producing an electronic component
05/10/2005US6891248 Semiconductor component with on board capacitor
05/10/2005US6891247 Semiconductor device including semiconductor bare chip mounted by flip-chip bonding, and board member with thin-film structure capacitor for semiconductor bare chip mounted by flip-chip bonding
05/10/2005US6891246 Nonvolatile semiconductor memory and manufacturing method thereof
05/10/2005US6891244 Plug structure having low contact resistance and method of manufacturing
05/10/2005US6891230 Bipolar ESD protection structure
05/10/2005US6891218 Semiconductor device and method of manufacturing same
05/10/2005US6891216 Test structure of DRAM
05/10/2005US6891198 Film carrier tape for mounting an electronic part
05/10/2005US6891110 Circuit chip connector and method of connecting a circuit chip
05/10/2005US6890970 Thermal conductive material and method for producing the same
05/10/2005US6890869 Low-dielectric silicon nitride film and method of forming the same, semiconductor device and fabrication process thereof
05/10/2005US6890864 Semiconductor device fabricating method and treating liquid
05/10/2005US6890857 Semiconductor device having a multilayer wiring structure and pad electrodes protected from corrosion, and method for fabricating the same
05/10/2005US6890852 Semiconductor device and manufacturing method of the same
05/10/2005US6890850 Method of depositing dielectric materials in damascene applications
05/10/2005US6890849 Interconnect, interconnect forming method, thin film transistor, and display device
05/10/2005US6890848 Fabrication process of a semiconductor device
05/10/2005US6890847 Polynorbornene foam insulation for integrated circuits
05/10/2005US6890846 Method for manufacturing semiconductor integrated circuit device
05/10/2005US6890845 Chip scale surface mounted device and process of manufacture
05/10/2005US6890837 Method of manufacturing semiconductor device including steps of forming both insulating film and epitaxial semiconductor on substrate
05/10/2005US6890836 Scribe street width reduction by deep trench and shallow saw cut
05/10/2005US6890834 Electronic device and method for manufacturing the same
05/10/2005US6890830 Semiconductor device and method for fabricating the same
05/10/2005US6890829 Fabrication of on-package and on-chip structure using build-up layer process
05/10/2005US6890828 Method for supporting a bond pad in a multilevel interconnect structure and support structure formed thereby
05/10/2005US6890814 Methods for use in forming a capacitor and structures resulting from same
05/10/2005US6890801 Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages
05/10/2005US6890800 Method of manufacturing semiconductor device with ceramic multilayer board
05/10/2005US6890799 Device for sealing and cooling multi-chip modules
05/10/2005US6890798 Stacked chip packaging
05/10/2005US6890797 Method of making a surface mountable semiconductor device using a flexible foil and a semiconductor device obtained by means of said method
05/10/2005US6890796 Method of manufacturing a semiconductor package having semiconductor decice mounted thereon and elongate opening through which electodes and patterns are connected
05/10/2005US6890794 Flip chip with novel power and ground arrangement
05/10/2005US6890793 Method for producing a semiconductor die package using leadframe with locating holes
05/10/2005US6890792 Method of formation of a capacitor with a solid electrolyte layer comprising an organic semiconductor, and method of production of circuit board
05/10/2005US6890783 Active matrix substrate plate and manufacturing method therefor
05/10/2005US6890782 Manufacturing method of electroluminescence display apparatus
05/10/2005US6890703 Providing synthetic polymer molecules having crosslinkable groups that are inert until activated; activating the crosslinkable groups under crosslinking conditions to obtain irreversible intramolecular crosslinked polymer
05/10/2005US6890639 Reacting a mixture comprising an oxidizable siloxane and an oxidizable compound with a tertiarybutyl, tertiarybutoxy, furfuryl, furfuryloxy, or neopentyl group that decomposes to gases that leave voids when the material is annealed
05/10/2005US6890618 Method and apparatus for retaining a thermally conductive pin in a thermal spreader plate
05/10/2005US6890617 Porous adhesive sheet, semiconductor wafer with porous adhesive sheet, and method of manufacture thereof
05/10/2005US6890384 Apparatus and method for modifying the configuration of an exposed surface of a viscous fluid
05/10/2005US6890186 Socket structure for grid array (GA) packages
05/10/2005US6890050 Method for the printing of homogeneous electronic material with a multi-ejector print head
05/10/2005US6889902 Descriptor for identifying a defective die site and methods of formation
05/10/2005US6889756 High efficiency isothermal heat sink
05/10/2005US6889755 Heat pipe having a wick structure containing phase change materials
05/10/2005US6889753 Capillary tube heat pipe and temperature controlling apparatus
05/10/2005US6889698 Apparatus for selective removal of material from wafer alignment marks
05/10/2005US6889568 Process condition sensing wafer and data analysis system
05/10/2005US6889515 Spray cooling system
05/10/2005US6889431 Manufacturing method of electronic circuit including multilayer circuit board
05/10/2005US6889430 Method of selectively adjusting surface tension of soldermask material
05/10/2005US6889429 Copper leads has a lower thermal resistance than packages using solder ball leads, which lowers the die temperature to further improve reliability
05/10/2005US6889428 Clamper covers the conductive foil to cover the exposed parts of the surface, and a plating liquid is injected into the interior of the clamper for forming the plated film on the surface of the masked conductive foil
05/10/2005CA2310504C Electronic component to be mounted on a circuit board having electronic circuit device sealed therein and method of manufacturing the same
05/06/2005WO2005041628A1 Circuit device
05/06/2005WO2005041627A2 Flow distributing unit and cooling unit having bypass flow
05/06/2005WO2005041299A1 System and method for preventing and alleviating short circuiting in a semiconductor device
05/06/2005WO2005041298A1 System and method for reducing or eliminating semiconductor device wire sweep
05/06/2005WO2005041297A1 Electroosmotic pumps using porous frits for cooling integrated circuit stacks
05/06/2005WO2005041296A1 Chip-mount wiring sheet, sheet-mounted chip, and sheet-mounted chip manufacturing method
05/06/2005WO2005041295A2 Semiconductor module provided with contacts extending through the housing
05/06/2005WO2005041294A2 Integrated circuit packaging
05/06/2005WO2005041293A1 Backside of chip implementation of redundancy fuses and contact pads
05/06/2005WO2005041291A2 Mask and method for using the mask in lithographic processing
05/06/2005WO2005041273A2 Method for reducing parasitic couplings in circuits
05/06/2005WO2005041272A2 Production method and device for improving the bonding between plastic and metal
05/06/2005WO2005041271A2 Method and device for fixing a chip in a housing
05/06/2005WO2005041268A2 Aluminum heat sink for a solid state relay having ultrasonically welded copper foil
05/06/2005WO2005041266A2 Semiconductor device package utilizing proud interconnect material
05/06/2005WO2005041265A2 Paste for forming an interconnect and interconnect formed from the paste
05/06/2005WO2005041256A2 An integrated circuit micro-cooler using self-assembled nano structures
05/06/2005WO2005041250A2 A package for microchips
05/06/2005WO2005041248A2 Integrated circuit with additional mini-pads connected by an under-bump metallisation and method for production therof
05/06/2005WO2005041121A2 Rfid device and method of making
05/06/2005WO2005040709A1 Flow distributing unit and cooling unit
05/06/2005WO2005040068A1 Method for producing carbon nanotube-dispersed composite material
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