Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2014
03/26/2014CN103681528A Semiconductor package, method of fabricating the semiconductor package, and interposer structure of the semiconductor package
03/26/2014CN103681527A Semiconductor device and manufacturing method of semiconductor device
03/26/2014CN103681526A Circuit board incorporating semiconductor ic and manufacturing method thereof
03/26/2014CN103681525A Pre-sintered semiconductor die structure
03/26/2014CN103681524A Semiconductor package and fabrication method thereof
03/26/2014CN103681523A Mounting structure for power tube of sealed power supply product with integral heat radiating function
03/26/2014CN103681522A 半导体装置 Semiconductor device
03/26/2014CN103681521A Semiconductor housing for smart cards
03/26/2014CN103681520A Blade type rotation rectification element
03/26/2014CN103681519A Method of manufacturing electronic device, electronic apparatus, and mobile apparatus
03/26/2014CN103681518A Packaging structure of chips and support plates
03/26/2014CN103681517A Thermal interface material for use in chip stacks
03/26/2014CN103681485A System and method for integrated circuit having transistor segments
03/26/2014CN103681478A Copper-connection structure and manufacturing method of copper-connection structure
03/26/2014CN103681474A Semiconductor structure and method for manufacturing same, hardware description language design structure
03/26/2014CN103681473A Microelectronic packages having trench vias and methods for the manufacture thereof
03/26/2014CN103681472A Bit cell with triple patterned metal layer structures
03/26/2014CN103681471A Bit cell with double patterned metal layer structures
03/26/2014CN103681470A Semiconductor device and method of manufacturing the same
03/26/2014CN103681469A Semiconductor device and method for forming the same
03/26/2014CN103681468A Semiconductor device and method of forming dual-sided interconnect structures in Fo-WLCSP
03/26/2014CN103681397A Semiconductor device and method of forming build-up interconnect structures over carrier for testing at interim stages
03/26/2014CN103681388A Method of manufacturing semiconductor device
03/26/2014CN103681386A Semiconductor structure and method of manufacturing the same
03/26/2014CN103681385A Semiconductor device and making method thereof
03/26/2014CN103681384A Chip sealing base plate as well as structure and manufacturing method thereof
03/26/2014CN103681383A Semiconductor device and assembly method thereof
03/26/2014CN103681382A Semiconductor device and manufacture method thereof
03/26/2014CN103681381A Circuit board system and manufacture method thereof
03/26/2014CN103681379A Manufacturing method of semiconductor device and semiconductor device
03/26/2014CN103681378A Method for production of sealed body, frame-shaped spacer for production of sealed body, sealed body and electronic instrument
03/26/2014CN103681377A Semiconductor device with bottom metal base and preparing method thereof
03/26/2014CN103681376A Semiconductor module manufacturing method and semiconductor module
03/26/2014CN103681375A Square planar no-guide-pin semiconductor packaging member and preparing method thereof
03/26/2014CN103681371A Silica-based wafer level fan-out encapsulation method and silica-based wafer level fan-out encapsulation structure
03/26/2014CN103681369A Semiconductor device and method of manufacturing the same
03/26/2014CN103681368A Semiconductor device and method of forming wire studs as vertical interconnect in FO-WLP
03/26/2014CN103681366A Semiconductor packaging member and preparing method thereof
03/26/2014CN103681365A Package-on-package (POP) structure and manufacturing method for POP structure
03/26/2014CN103681362A Semiconductor device and method of forming dual-sided interconnect structures in Fo-WLCSP
03/26/2014CN103681360A Packaging Devices and Methods
03/26/2014CN103681359A Stack package structure and manufacturing method thereof
03/26/2014CN103681358A Chip package substrate and chip package structure and manufacturing methods thereof
03/26/2014CN103681286A Method for manufacturing a layer arrangement, and a layer arrangement
03/26/2014CN103681240A Epitaxial temperature testing and monitoring structure and forming method
03/26/2014CN103681147A Unbalanced parallel circuit protection fuse device
03/26/2014CN103677180A Electronic apparatus and cooling module mounted in that electronic apparatus
03/26/2014CN103676374A Array substrate, liquid crystal display panel and display device
03/26/2014CN103676373A Array substrate and production method thereof and display device comprising same
03/26/2014CN103676354A Electrode structure, preparation method of electrode structure, array substrate, preparation method of array substrate and display device
03/26/2014CN103676331A Electric conduction orientation layers, manufacturing method, display substrate and display device
03/26/2014CN103667775A Copper alloy semiconductor lead frame
03/26/2014CN103666297A Anisotropic conductive film and semiconductor device employing same
03/26/2014CN103663344A Improved through silicon via including multi-material fill
03/26/2014CN103658659A Near-net forming method of aluminum-silicon-carbide IGBT substrate with double faces coated with aluminum
03/26/2014CN103052667B Curing resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing material
03/26/2014CN102947871B Semiconductor device and process for production thereof
03/26/2014CN102870221B Thin film transistor substrate, liquid crystal display device provided with same, and thin film transistor substrate production method
03/26/2014CN102593107B MOM (Metal-Oxidation layer-Metal) capacitor and manufacturing method thereof
03/26/2014CN102456670B Chip package
03/26/2014CN102425968B Compact type loop heat pipe device
03/26/2014CN102420216B Noise decoupling structure with through-substrate vias
03/26/2014CN102420210B Device with through-silicon via (tsv) and method of forming the same
03/26/2014CN102385179B Fan-out line
03/26/2014CN102369229B Flame-retardant phosphorus-containing epoxy resin composition and cured product thereof
03/26/2014CN102299132B Package for semiconductor device, and method for manufacturing the same and semiconductor device
03/26/2014CN102299124B Resin sealing type electronic controlling means and producing method thereof
03/26/2014CN102299108B Overlapped trench-type grid semiconductor component and manufacturing method thereof
03/26/2014CN102282717B Fuel gauge circuit and battery pack
03/26/2014CN102280371B Pliable electronic component and manufacturing method thereof
03/26/2014CN102254877B Power module without metal baseplate
03/26/2014CN102201380B 半导体装置 Semiconductor device
03/26/2014CN102201349B Circuit component built-in module and manufacturing method therefor
03/26/2014CN102193604B Heat-radiation circuit of CPU (Central Processing Unit)
03/26/2014CN102169263B Array substrate, substrate module and display panel
03/26/2014CN102167924B Coating for a microelectronic device, treatment structure comprising same, and method of managing a thermal profile of a microelectronic die
03/26/2014CN102165585B Leadframe substrate and method for manufacturing same, and semiconductor device
03/26/2014CN102148562B Power conversion apparatus
03/26/2014CN102143986B Siloxane compound, curable resin composition, cured object obtained therefrom, and photosemiconductor element
03/26/2014CN102132404B Semiconductor package and method of manufacturing thereof
03/26/2014CN102131371B Heat-conducting device and electronic device using same
03/26/2014CN102117783B Heat-radiating device
03/26/2014CN102077700B Circuit module and method for manufacturing same
03/26/2014CN101993537B Alkali-soluble polymer, photosensitive resin composition comprising the same, and uses of the same
03/26/2014CN101925287B Radiating device
03/26/2014CN101893170B Unitized LED illumination lamp
03/25/2014US8681500 Integrated circuit nanotube-based subsrate
03/25/2014US8681499 Fastener and electronic assembly having the same
03/25/2014US8681133 Display driver integrated circuit which stores output mode of driving circuit control signal in non-volatile memory and method of outputting the driving circuit control signal
03/25/2014US8681030 Resonator schemes in RF continuous-time bandpass delta-sigma modulators
03/25/2014US8680883 Time dependent dielectric breakdown (TDDB) test structure of semiconductor device and method of performing TDDB test using the same
03/25/2014US8680693 OLED having stacked organic light-emitting units
03/25/2014US8680692 Carrier, semiconductor package and fabrication method thereof
03/25/2014US8680691 Semiconductor device having semiconductor member and mounting member
03/25/2014US8680690 Bond wire arrangement for efficient signal transmission
03/25/2014US8680688 Stack package having flexible conductors
03/25/2014US8680687 Electrical interconnect for die stacked in zig-zag configuration
03/25/2014US8680686 Method and system for thin multi chip stack package with film on wire and copper wire
03/25/2014US8680685 Semiconductor package and method for fabricating the same
03/25/2014US8680684 Stackable microelectronic package structures
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