Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2014
03/26/2014CN103681628A 半导体装置 Semiconductor device
03/26/2014CN103681627A Radio-frequency device package and method for fabricating same
03/26/2014CN103681626A Semiconductor device
03/26/2014CN103681625A Electronic module and manufacturing method thereof
03/26/2014CN103681624A Overlay mark and method of forming the same
03/26/2014CN103681623A Semiconductor apparatus and test method thereof
03/26/2014CN103681622A Enhanced FINFET process overlay mark
03/26/2014CN103681621A Semiconductor detection structure and formation method
03/26/2014CN103681620A Interconnection electromigration test structure
03/26/2014CN103681619A Silicon substrate air-impermeability sealing structure and manufacturing method thereof
03/26/2014CN103681618A Functional glass handler wafer with through vias
03/26/2014CN103681617A Semiconductor device, communication device, and semiconductor package
03/26/2014CN103681616A Semiconductor device and method of manufacturing the same
03/26/2014CN103681615A Interconnection structure and method of forming same
03/26/2014CN103681614A Bump structure and method of forming same
03/26/2014CN103681613A Semiconductor device with discrete blocks
03/26/2014CN103681612A Seed layer structure and method
03/26/2014CN103681611A Post passivation interconnect structure and method for forming the same
03/26/2014CN103681610A Chip laminated structure and manufacture method thereof
03/26/2014CN103681609A An integrated circuit, a chip package and a method for manufacturing an integrated circuit
03/26/2014CN103681608A Aluminum interconnection apparatus
03/26/2014CN103681607A Semiconductor device and method of manufacturing semiconductor device
03/26/2014CN103681606A Three dimensional (3D) fan-out packaging mechanisms
03/26/2014CN103681605A A packaging structure of a low-k chip and a manufacturing method thereof
03/26/2014CN103681604A Semi-conductor device with self-aligning contact holes and manufacture method of semi-conductor device
03/26/2014CN103681603A Metal-via fuse
03/26/2014CN103681602A Semiconductor devices using air spaces to separate conductive structures and methods of manufacturing the same
03/26/2014CN103681601A 半导体器件 Semiconductor devices
03/26/2014CN103681600A Integrated circuit device, semiconductor device, and method of manufacturing integrated circuit device and semiconductor device
03/26/2014CN103681599A Semiconductor device having buried bit lines and method for fabricating the same
03/26/2014CN103681598A 集成层积磁性器件及其制造方法 Magnetic plot device and manufacturing method integration layer
03/26/2014CN103681597A Interconnect structure and method
03/26/2014CN103681596A Semiconductor structure and manufacture method thereof
03/26/2014CN103681595A Semiconductor integrated circuit device
03/26/2014CN103681594A Structure for achieving perpendicular interconnection among three-dimensional layers by utilization of flexible substrate and manufacturing method thereof
03/26/2014CN103681593A Leadless ceramic chip carrier packaging structure and process for manufacturing same
03/26/2014CN103681592A Lateral element isolation device
03/26/2014CN103681591A Semiconductor device
03/26/2014CN103681590A Metal bump and method of manufacturing same
03/26/2014CN103681589A Semiconductor device, method for manufacturing semiconductor device, and electronic device
03/26/2014CN103681588A Package substrate and method of fabricating the same
03/26/2014CN103681587A Stress reduction apparatus
03/26/2014CN103681586A Coreless package substrate and manufacturing method thereof
03/26/2014CN103681585A Lead frame, QFN (Quad Flat No Lead) packaging body, and method for forming QFN packaging body
03/26/2014CN103681584A Semiconductor device having a clip contact
03/26/2014CN103681583A One-time eroding-before-plating metal frame subtraction embedded chip normally-arranged flat foot structure and technological method
03/26/2014CN103681582A One-time eroding-before-plating metal frame subtraction embedded chip normally-arranged salient point structure and technological method
03/26/2014CN103681581A One-time etched-before-plated metal frame subtraction embedded chip inverted flat pin structure and technological method thereof
03/26/2014CN103681580A One-time eroding-before-plating metal frame subtraction embedded chip inversely-arranged salient point structure and technological method
03/26/2014CN103681579A Secondary first-corrosion-then-plating metal frame subtraction burying chip obverse-mounting flat foot structure and technology method
03/26/2014CN103681578A Frame based flat packaging part adopting pin optimization technology, and manufacturing process thereof
03/26/2014CN103681577A Resin-encapsulated semiconductor device and method of manufacturing the same
03/26/2014CN103681576A Semiconductor package device having passive energy components
03/26/2014CN103681575A Wireless multichip module and method for manufacturing integrated circuit to enable flip-chip to be assembled in multichip module
03/26/2014CN103681574A Leadframes, air-cavity packages, and electronic devices with offset vent holes, and methods of their manufacture
03/26/2014CN103681573A Integrated circuit devices including a via structure and methods of fabricating integrated circuit devices including a via structure
03/26/2014CN103681572A Multi-chip module power clip
03/26/2014CN103681571A Semiconductor memory card and method of manufacturing same
03/26/2014CN103681570A Bonding wire for packaging and preparing method of bonding wire
03/26/2014CN103681569A Lead-free tinned zinc alloy copper clad steel wire
03/26/2014CN103681568A Silver alloy wire for bonding applications
03/26/2014CN103681567A Sampling needle electrode and welded IGBT module unit
03/26/2014CN103681566A Package member, substrate, and memory card
03/26/2014CN103681565A Semiconductor package substrates having pillars and related methods
03/26/2014CN103681564A Electronic device and method of fabricating an electronic device
03/26/2014CN103681563A Metal pads with openings in integrated circuits
03/26/2014CN103681562A Ladder bump structures and methods of making same
03/26/2014CN103681561A Passive devices in package-on-package structures and methods for forming the same
03/26/2014CN103681560A A grooved IGBT module base plate and an IGBT module
03/26/2014CN103681559A Chip packaging basal plate and preparation method thereof
03/26/2014CN103681558A Interconnection structure for semiconductor package
03/26/2014CN103681557A Semiconductor device and assembly method thereof
03/26/2014CN103681556A Bump structures, electrical connection structures, and methods of forming the same
03/26/2014CN103681555A Structure to increase resistance to electromigration
03/26/2014CN103681554A Semiconductor structure
03/26/2014CN103681553A Wafer level chip scale package
03/26/2014CN103681552A Semiconductor power module and method for manufacturing the same
03/26/2014CN103681551A Semiconductor chip and semiconductor package having the same
03/26/2014CN103681550A Semiconductor device and fabricating method thereof
03/26/2014CN103681549A Through via structure and method
03/26/2014CN103681548A Semiconductor device
03/26/2014CN103681547A Flat package crimping type extraction electrode insulated gate bipolar transistor element
03/26/2014CN103681546A A positive pole heat-dissipating structure for diodes
03/26/2014CN103681545A Power module package
03/26/2014CN103681544A Hybrid thermal interface material for IC packages with integrated heat spreader
03/26/2014CN103681543A Matrix lid heatspreader for flip chip package
03/26/2014CN103681542A Chip package and a method for manufacturing a chip package
03/26/2014CN103681541A Wafer Level Embedded Heat Spreader
03/26/2014CN103681540A Power semiconductor device and method of manufacturing the same
03/26/2014CN103681539A Packaging structure and packaging method of integrated common mode choke
03/26/2014CN103681538A Semiconductor chip, method for producing semiconductor chip and method for soldering semiconductor chip to carrier
03/26/2014CN103681537A Chip package and method for forming the same
03/26/2014CN103681536A Semiconductor device and manufacturing method thereof
03/26/2014CN103681535A Wafer level packaging element with thick bottom pedestal and making method thereof
03/26/2014CN103681534A Wafer level package structure and manufacturing method of the same
03/26/2014CN103681533A Fan-out package comprising bulk metal
03/26/2014CN103681532A Semiconductor package and fabrication method thereof
03/26/2014CN103681531A Integrated circuits and method for manufacturing integrated circuit
03/26/2014CN103681530A Thermosetting resin sheet for sealing electronic component, resin-sealed type semiconductor device, and method for producing resin-sealed type semiconductor device
03/26/2014CN103681529A Semiconductor device and manufacturing method of semiconductor device
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