| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/08/2005 | CN1205664C Semiconductor device and mfg. method therefor |
| 06/08/2005 | CN1205662C Module with built-in electronic elements and method of manufacture thereof |
| 06/08/2005 | CN1205660C Encapsulation for electrical component and method for producing the same |
| 06/08/2005 | CN1205524C Buckle capable of being detached without using tool and heat sink |
| 06/08/2005 | CN1205504C Substrate wth embedded structure, display device comprising same, method for mfg. said substrate and method for mfg. display device |
| 06/08/2005 | CN1205503C Substrate device, electrooptic device and its producing method and electronic instrument |
| 06/08/2005 | CN1205193C Crystalline form of 4-[5-methyl-3-phenylisoxazol)-4-yl] benzenesulfonamide |
| 06/07/2005 | US6903992 Repair fuse box of semiconductor device |
| 06/07/2005 | US6903941 Printed circuit board assembly employing a press fit electrical connector |
| 06/07/2005 | US6903935 Memory card with a static electricity conducting board |
| 06/07/2005 | US6903932 Covering element for subassemblies |
| 06/07/2005 | US6903931 Cold plate assembly |
| 06/07/2005 | US6903930 Parallel heat exchanger for a component in a mobile system |
| 06/07/2005 | US6903929 Two-phase cooling utilizing microchannel heat exchangers and channeled heat sink |
| 06/07/2005 | US6903928 Integrated crossflow cooler for electronic components |
| 06/07/2005 | US6903913 ESD protection circuit for mixed-voltage I/O ports using substrated triggering |
| 06/07/2005 | US6903646 Inductor device and electronic circuit device that can achieve further integration while maintaining a high inductance |
| 06/07/2005 | US6903644 Inductor device having improved quality factor |
| 06/07/2005 | US6903620 Circuit configuration for setting the input resistance and the input capacitance of an integrated semiconductor circuit chip |
| 06/07/2005 | US6903617 Method and apparatus for synthesizing high-frequency signals for wireless communications |
| 06/07/2005 | US6903465 Packaging of semiconductor dice to facilitate vertical mounting on a printed circuit board |
| 06/07/2005 | US6903464 Semiconductor die package |
| 06/07/2005 | US6903460 Semiconductor equipment |
| 06/07/2005 | US6903459 High frequency semiconductor device |
| 06/07/2005 | US6903458 Carrier for integrated chip is embedded into substrate so that stresses due to thermal expansion are uniformly distributed over interface between substrate and carrier |
| 06/07/2005 | US6903457 Power semiconductor device |
| 06/07/2005 | US6903456 Package carrier having multiple individual ceramic substrates |
| 06/07/2005 | US6903455 Side braze packages |
| 06/07/2005 | US6903451 Chip scale packages manufactured at wafer level |
| 06/07/2005 | US6903450 Semiconductor device and method of manufacturing the same |
| 06/07/2005 | US6903449 Semiconductor component having chip on board leadframe |
| 06/07/2005 | US6903448 High performance leadframe in electronic package |
| 06/07/2005 | US6903447 Apparatus, methods and articles of manufacture for packaging an integrated circuit with internal matching |
| 06/07/2005 | US6903446 Pattern for improved visual inspection of semiconductor devices |
| 06/07/2005 | US6903445 Semiconductor device having low-K insulating film |
| 06/07/2005 | US6903444 High permeability thin films and patterned thin films to reduce noise in high speed interconnections |
| 06/07/2005 | US6903443 Semiconductor component and interconnect having conductive members and contacts on opposing sides |
| 06/07/2005 | US6903442 Semiconductor component having backside pin contacts |
| 06/07/2005 | US6903441 Packaging method for packaging semiconductor chip with enhanced wire routability for non-grounding wires to make the overall packaging process more simplified to implement |
| 06/07/2005 | US6903440 For circuit board mounting, which has a predetermined number of terminals mainly represented by a semiconductor active device such as an integrated circuit; particularly comprising a function for attenuating a high frequency current |
| 06/07/2005 | US6903438 Low-impedance decoupling device |
| 06/07/2005 | US6903437 Semiconductor devices, capacitor antifuses, dynamic random access memories, and cell plate bias connection methods |
| 06/07/2005 | US6903436 Multiple-time programmable electrical fuse utilizing MOS oxide breakdown |
| 06/07/2005 | US6903431 Substrate method and apparatus |
| 06/07/2005 | US6903428 Semiconductor device capable of preventing a pattern collapse |
| 06/07/2005 | US6903421 Isolated high-voltage LDMOS transistor having a split well structure |
| 06/07/2005 | US6903404 Semiconductor memory device and method for manufacturing the same |
| 06/07/2005 | US6903402 Interdigital capacitor having a cutting target portion |
| 06/07/2005 | US6903390 Single metal programmability in a customizable integrated circuit device |
| 06/07/2005 | US6903375 Solid-state image device, camera using the same, and method of manufacturing the same |
| 06/07/2005 | US6903366 Chemically synthesized and assembled electronic devices |
| 06/07/2005 | US6903365 Electronic device using carbon element linear structure and production method thereof |
| 06/07/2005 | US6903278 Arrangements to provide mechanical stiffening elements to a thin-core or coreless substrate |
| 06/07/2005 | US6903271 Electronic assembly with thermally separated support |
| 06/07/2005 | US6903270 Method and structure for securing a mold compound to a printed circuit board |
| 06/07/2005 | US6903027 Method of forming dielectric film and dielectric film |
| 06/07/2005 | US6903017 Integrated circuit metallization using a titanium/aluminum alloy |
| 06/07/2005 | US6903016 Combined conformal/non-conformal seed layers for metallic interconnects |
| 06/07/2005 | US6903014 Low temperature reflow method for filling high aspect ratio contacts |
| 06/07/2005 | US6903013 Method to fill a trench and tunnel by using ALD seed layer and electroless plating |
| 06/07/2005 | US6903012 Sloped via contacts |
| 06/07/2005 | US6903009 Methods for fabricating a contact for an integrated circuit |
| 06/07/2005 | US6903008 Method for forming an interconnection in a semiconductor element |
| 06/07/2005 | US6903007 Process for forming bottom anti-reflection coating for semiconductor fabrication photolithography which inhibits photoresist footing |
| 06/07/2005 | US6903006 Mechanical strength, thermal resistance, and adhesion to a substrate |
| 06/07/2005 | US6903005 Method for the formation of RuSixOy-containing barrier layers for high-k dielectrics |
| 06/07/2005 | US6903004 Method of making a semiconductor device having a low K dielectric |
| 06/07/2005 | US6903003 High permeability composite films to reduce noise in high speed interconnects |
| 06/07/2005 | US6903001 Techniques to create low K ILD for BEOL |
| 06/07/2005 | US6902997 Process of forming bonding columns |
| 06/07/2005 | US6902995 Ring positionable about a periphery of a contact pad, semiconductor device components including same, and methods for positioning the ring around a contact pad |
| 06/07/2005 | US6902986 Method for defining alignment marks in a semiconductor wafer |
| 06/07/2005 | US6902972 High-density metal capacitor using dual-damascene copper interconnect |
| 06/07/2005 | US6902959 Semiconductor device having junction diode and fabricating method therefor |
| 06/07/2005 | US6902958 Method for making MOSFET anti-fuse structure |
| 06/07/2005 | US6902956 Method and structure for manufacturing improved yield semiconductor packaged devices |
| 06/07/2005 | US6902955 Method of manufacturing a semiconductor device having a flexible wiring substrate |
| 06/07/2005 | US6902952 Multi-part lead frame with dissimilar materials and method of manufacturing |
| 06/07/2005 | US6902951 Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic device |
| 06/07/2005 | US6902950 Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed thereby |
| 06/07/2005 | US6902949 Multi-layer wiring circuit board and method for producing the same |
| 06/07/2005 | US6902942 Device and method for detecting alignment of deep trench capacitors and word lines in DRAM devices |
| 06/07/2005 | US6902872 Microelectronics having circuit on multilayers including electrconductive laminates forming connection structures; print heads |
| 06/07/2005 | US6902811 Epoxy resin composition excellent in weather resistance and fiber-reinforced composite materials |
| 06/07/2005 | US6902407 Contacting structure of a card connector |
| 06/07/2005 | US6902098 Solder pads and method of making a solder pad |
| 06/07/2005 | US6902097 Electrically conductive wire |
| 06/07/2005 | US6901997 Thermal interface wafer and method of making and using the same |
| 06/07/2005 | US6901993 Heat sink assembly having combined fins |
| 06/02/2005 | WO2005051065A2 Pumped liquid cooling for computer systems using liquid metal coolant |
| 06/02/2005 | WO2005051059A1 Rough contacts |
| 06/02/2005 | WO2005050777A2 Receiver electronics proximate antenna |
| 06/02/2005 | WO2005050751A2 Encapsulation assembly for electronic devices |
| 06/02/2005 | WO2005050747A1 Device for cooling an electrical component and production method thereof |
| 06/02/2005 | WO2005050739A1 Contacting without external power |
| 06/02/2005 | WO2005050738A1 Cooling device for an electric component |
| 06/02/2005 | WO2005050737A1 Micropin heat exchanger |
| 06/02/2005 | WO2005050736A1 A method for adhering getter material to a surface for use in electronic devices |
| 06/02/2005 | WO2005050735A1 Land grid array package |
| 06/02/2005 | WO2005050727A1 Zeolite - carbon doped oxide composite low k dielectric |