| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/09/2005 | US20050121711 Chip and wafer integration process using vertical connections |
| 06/09/2005 | US20050121702 Modulated trigger device |
| 06/09/2005 | US20050121701 Semiconductor device |
| 06/09/2005 | US20050121665 Comprising one or more base oligomer/polymers, one or more multifunctional acrylate monomers, and one or more thixotropic agents; for electronic components for use in glob top and/or dam and fill applications |
| 06/09/2005 | US20050121421 Method of manufacturing circuits |
| 06/09/2005 | US20050121413 Method of manufacturing an electronic device |
| 06/09/2005 | US20050121331 Depositing a tin-bismuth alloy skin layer on surfaces of a body, placing a solid tin metal and a solid bismuth metal in plating solution, electroconnecting anode; electrochemically alloying; increase in plating cycles, manufactured at a low cost, mounting reliability of a semiconductor |
| 06/09/2005 | US20050121322 Analyte monitoring device and methods of use |
| 06/09/2005 | US20050121310 Method and substrate to control flow of underfill |
| 06/09/2005 | US20050121228 Wiring layout auxiliary wiring package and printed circuit wiring board |
| 06/09/2005 | US20050121180 Use of graphite foam materials in pumped liquid, two phase cooling, cold plates |
| 06/09/2005 | US20050121177 Radiation tube structure |
| 06/09/2005 | US20050121175 Structurally sealed heat sink |
| 06/09/2005 | US20050121173 Stacked type cooler |
| 06/09/2005 | US20050121172 Composite heatsink for cooling of heat-generating element |
| 06/09/2005 | US20050121064 Cooling and electricity generation apparatus, a portable terminal adopting the same, and a method of operating the portable terminal |
| 06/09/2005 | US20050120553 Method for forming MEMS grid array connector |
| 06/09/2005 | DE202005004277U1 Circuit board, with densely packed semiconductor components, has recesses to take them at least partially with contact thermal couplings and cooling elements to dissipate their heat |
| 06/09/2005 | DE202004019985U1 Capillary structure to reduce heat transfer resistance between two connected metal surfaces as in semiconductor elements fills capillary tubes with solder during production |
| 06/09/2005 | DE10392391T5 Unterstützende Steuergateverbindung auf einem Paket unter Verwendung zusätzlicher Anschlusshügel Supporting control gate connection on a packet using additional connection Hill |
| 06/09/2005 | DE10352002A1 Sensormodul Sensor module |
| 06/09/2005 | DE10351120A1 Lötstopbarriere Lötstopbarriere |
| 06/09/2005 | DE10351028A1 Halbleiter-Bauteil sowie dafür geeignetes Herstellungs-/Montageverfahren Semiconductor device and care for your manufacturing / assembly process |
| 06/09/2005 | DE10351014A1 Diodenstruktur und integrale Leistungsschaltanordnung mit Low-Leakage-Diode Diode structure and integral power switching device with low leakage diode |
| 06/09/2005 | DE10350752A1 Verfahren zum Ausbilden eines Dielektrikums auf einer kupferhaltigen Metallisierung und Kondensatoranordnung A method for forming a dielectric on a copper-containing metallization and capacitor assembly |
| 06/09/2005 | DE10350702A1 Capacitive component for power semiconductors and eeprom memory cells has two electrodes sandwiching a dielectric layer with a resistive layer between dielectric and one electrode |
| 06/09/2005 | DE10339787A1 Speichermodul und Verfahren zum Betreiben eines Speichermoduls Memory module and method of operating a memory module |
| 06/09/2005 | DE102004054295A1 Verfahren zum Verbessern der Adhäsion von Epoxidharz an Goldflächen A method for improving the adhesion of epoxy resin to gold surfaces |
| 06/09/2005 | DE102004046995A1 Lichtemittierende Diode A light-emitting diode |
| 06/09/2005 | DE102004046994A1 Lichtemittierende Diode A light-emitting diode |
| 06/08/2005 | EP1538884A2 Liquid cooling system for use in an electronic apparatus |
| 06/08/2005 | EP1538681A2 Process for producing optical semiconductor device |
| 06/08/2005 | EP1538672A1 Semiconductor device |
| 06/08/2005 | EP1538670A2 Semiconductor module |
| 06/08/2005 | EP1538669A2 Thin package for stacking integrated circuits |
| 06/08/2005 | EP1538667A2 Electronic apparatus with electrically isolated metallic heat transfer body |
| 06/08/2005 | EP1538666A1 Semiconductor integrated circuit device |
| 06/08/2005 | EP1538640A2 Capacitor and method for manufacturing the same |
| 06/08/2005 | EP1538182A1 Method for producing epoxy resin composition for semiconductor encapsulation and epoxy resin composition for semiconductor encapsulation and semiconductor device obtained thereby |
| 06/08/2005 | EP1538170A1 UV curable protective encapsulant |
| 06/08/2005 | EP1537187A2 Organic species that facilitate charge transfer to or from nanostructures |
| 06/08/2005 | EP1379978A4 Extraction method of defect density and size distributions |
| 06/08/2005 | EP1125330A4 Method of creating an electrical interconnect device bearing an array of electrical contact pads |
| 06/08/2005 | EP0944685B1 Die attach adhesive compositions |
| 06/08/2005 | EP0809861B1 Method of manufacturing a semiconductor device for surface mounting suitable for comparatively high voltages, and such a semiconductor device |
| 06/08/2005 | CN2704117Y Concealed chip conducting wire holder unit structure |
| 06/08/2005 | CN2704116Y Chip-carried conducting wire holder |
| 06/08/2005 | CN2704115Y Water-cooled radiating device |
| 06/08/2005 | CN2704114Y Radiating device for electronic equipment |
| 06/08/2005 | CN2704113Y Multi heat source radiating device |
| 06/08/2005 | CN1625927A Method for embedding a component in a base and forming a contact |
| 06/08/2005 | CN1625926A Method for embedding a component in a base |
| 06/08/2005 | CN1625818A Semiconductor device having fuel cell and its manufacturing method |
| 06/08/2005 | CN1625807A Split-gate power module and method for suppressing oscillation therein |
| 06/08/2005 | CN1625806A Multi-layer ceramic substrate, and method and device for producing the same |
| 06/08/2005 | CN1625805A Board for mounting semiconductor chip and manufacturing method and semiconductor module |
| 06/08/2005 | CN1625804A Method for preparing gas-tight terminal and gas-tight terminal prepared by the method |
| 06/08/2005 | CN1625799A Deposition method of insulating layers having low dielectric constant of semiconductor device |
| 06/08/2005 | CN1625611A Method and apparatus for controlling deposition on predetermined portions of a workpiece |
| 06/08/2005 | CN1625607A Thermal interface materials; and compositions comprising indium and zinc |
| 06/08/2005 | CN1625590A An etchant for a wiring, a method for manufacturing the wiring using the etchant, a thin film transistor array panel including the wiring, and a method for manufacturing the same |
| 06/08/2005 | CN1625330A Electronic card unit and method for removing heat from a heat-generating component on a printed circuit board |
| 06/08/2005 | CN1625329A Cooling system and method for cooling multiple electronics subsystems |
| 06/08/2005 | CN1625327A Heat radiating system and method for a mobile communication terminal |
| 06/08/2005 | CN1625321A Substrate for mounting microwave chip integrated circuit and microwave communication generator and transceiver |
| 06/08/2005 | CN1625030A Semiconductor cooler |
| 06/08/2005 | CN1625012A Over-voltage protection in portable equipment |
| 06/08/2005 | CN1624945A Process for producing optical semiconductor device |
| 06/08/2005 | CN1624927A Semiconductor device and manufacturing method and static discharging protection circuit |
| 06/08/2005 | CN1624919A Wafer-level electronic modules with integral connector contacts and methods of fabricating the same |
| 06/08/2005 | CN1624917A Inductor device having improved quality factor |
| 06/08/2005 | CN1624916A Inductor for a system-on-a-chip and method for manufacturing the same |
| 06/08/2005 | CN1624915A LED luminous module |
| 06/08/2005 | CN1624913A Semiconductor integrated circuit device having an ESD protection unit |
| 06/08/2005 | CN1624912A Device package, a printed wiring board, and an electronic apparatus |
| 06/08/2005 | CN1624911A Pumped liquid cooling system using a phase change refrigerant |
| 06/08/2005 | CN1624910A Method for pressing heat conduit end with levelling surface used as active element and its structure |
| 06/08/2005 | CN1624909A Method and device of air exhausting guide of CPU heat sink |
| 06/08/2005 | CN1624908A High-efficient low-noise heat sink and improved design of common heat sink |
| 06/08/2005 | CN1624907A Method of connecting heat conduit and radiation fin |
| 06/08/2005 | CN1624906A Circuit board and method for manufacturing the same, semiconductor package, component built-in module |
| 06/08/2005 | CN1624905A Solid-state imaging apparatus, wiring substrate and methods of manufacturing the same |
| 06/08/2005 | CN1624900A Method for fabricating CMOS image sensor protecting low temperature oxide delamination |
| 06/08/2005 | CN1624896A Interconnection structure and method for forming the same |
| 06/08/2005 | CN1624889A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 06/08/2005 | CN1624888A Fan out type wafer level package structure and method of the same |
| 06/08/2005 | CN1624887A Semiconductor packing substrate for forming presoldering tin material and its preparation method |
| 06/08/2005 | CN1624884A Monitoring low-temp quick thermal annealing process by ion implanted chip |
| 06/08/2005 | CN1624879A Semiconductor device and its manufacturing method |
| 06/08/2005 | CN1624867A Semiconductor device and manufacturing process therefore |
| 06/08/2005 | CN1624823A Trimmer impedance component, semiconductor device and trimming method |
| 06/08/2005 | CN1624753A Electro-optical device, method for making the same, and electronic apparatus |
| 06/08/2005 | CN1624718A Module for contactless chip cards or identification systems |
| 06/08/2005 | CN1624553A Pattern forming method and method for producing liquid crystal display using the method |
| 06/08/2005 | CN1624407A Electronic apparatus |
| 06/08/2005 | CN1624045A Paste composition, and protective film and semiconductor device both obtained with the same |
| 06/08/2005 | CN1205743C Syste mand method for array processing surface acoustic wave device |
| 06/08/2005 | CN1205670C Semiconductor device and manufacture method thereof |
| 06/08/2005 | CN1205669C Circuit board and method for manufacturing the same, and electronic apparatus using it |
| 06/08/2005 | CN1205666C Semiconductor device and making method thereof |