Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2005
05/19/2005US20050104175 Semiconductor device
05/19/2005US20050104174 Method of fabricating lead frame and method of fabricating semiconductor device using the same, and semiconductor device and portable apparatus and electronic apparatus comprising the same
05/19/2005US20050104173 Semiconductor device and manufacturing method thereof
05/19/2005US20050104172 Integrated circuit carrier apparatus method and system
05/19/2005US20050104171 Microelectronic devices having conductive complementary structures and methods of manufacturing microelectronic devices having conductive complementary structures
05/19/2005US20050104170 Resin encapsulating body that seals the die pad section, and the first and second semiconductor chips; suppress deterioration of semiconductor chips due to stress
05/19/2005US20050104169 Stress-free lead frame
05/19/2005US20050104168 Molded leadless package having improved reliability and high thermal transferability, and sawing type molded leadless package and method of manufacturing the same
05/19/2005US20050104167 Flip-chip type quad flat package and leadframe
05/19/2005US20050104166 Semiconductor device and manufacturing method thereof
05/19/2005US20050104165 Semiconductor element, semiconductor device, and method for manufacturing semiconductor element
05/19/2005US20050104164 EMI shielded integrated circuit packaging apparatus method and system
05/19/2005US20050104161 Semiconductor wafer
05/19/2005US20050104158 Compact, high q inductor for integrated circuit
05/19/2005US20050104157 Tri-metal and dual-metal stacked inductors
05/19/2005US20050104155 Diode structure and integral power switching arrangement
05/19/2005US20050104149 Semiconductor component and sensor component for data transmission devices
05/19/2005US20050104134 Semiconductor device and method for manufacturing semiconductor device
05/19/2005US20050104114 Method for forming polysilicon local interconnects
05/19/2005US20050104099 Radiation-hardened transistor fabricated by modified CMOS process
05/19/2005US20050104070 Lower substrate, display apparatus having the same and method of manufacturing the same
05/19/2005US20050104063 Shallow trench isolation void detecting method and structure for the same
05/19/2005US20050104062 Sub-nanoscale electronic devices and processes
05/19/2005US20050104056 Electronic device using carbon element linear structure and production method thereof
05/19/2005US20050104046 Thick film conductor case compositions for LTCC tape
05/19/2005US20050104029 A silica matrix incorporated into polymers selected from silicones, polyurethanes and polyester; embedding paraffinc phase change material; for cooling electronic and electrical components
05/19/2005US20050103774 Chip bonding heater with differential heat transfer
05/19/2005US20050103636 Forming a titanium-tungsten (TiW) layer over a passivation layer on a semiconductor substrate, the TiW layer further extending into an opening formed in the passivation layer for exposing the I/O pad, such that the TiW layer covers sidewalls of the opening and a top surface of the I/O pad
05/19/2005US20050103523 Apparatus and method for routing electrical signals
05/19/2005US20050103516 Flip-chip mounting circuit board, manufacturing method thereof and integrated circuit device
05/19/2005US20050103480 Enhanced heat exchanger
05/19/2005US20050103476 Heat dissipating assembly with heat pipes
05/19/2005US20050103475 Integrated liquid cooling system for electrical components
05/19/2005US20050103474 Heat dissipation device
05/19/2005US20050103473 Heat pipe fin stack with extruded base
05/19/2005US20050103472 Cold plate
05/19/2005US20050103471 Heat sink
05/19/2005US20050103470 Process for joining members of a heat transfer assembly and assembly formed thereby
05/19/2005US20050102827 Frame attaching process
05/19/2005DE202005001559U1 Chip structure for stress-prone chips especially for sensor chips mounted on wiring carrier, provides mechanical or acoustic coupling of chip for bonding process
05/19/2005DE19944306B4 Integrierte Halbleiterschaltung mit integrierter Spule und Verfahren zu deren Herstellung A semiconductor integrated circuit with integrated coil and processes for their preparation
05/19/2005DE19651109B4 Halbleitervorrichtung Semiconductor device
05/19/2005DE10358985B3 Semiconductor element e.g. power semiconductor switch, with pn-junction and passivation layer at surface of semiconductor body acting as screening layer for edge structure limitation
05/19/2005DE10347320A1 Chip substrate for producing a chip package to be constructed on the substrate has a bond between substrate and chip extending almost completely across a chip side
05/19/2005DE10346474A1 Halbleiterbauteil und Sensorbauteil mit Datenübertragungsvorrichtungen Semiconductor device and sensor component with data transmission devices
05/19/2005DE10346460A1 Fuse/anti-fuse protection on chips, comprises a pacifying layer, a dielectric that covers it, and a redistribution layer
05/19/2005DE10346423A1 Modular heat exchanger for e.g. hot water boiler, electronic assemblies has heat conducting rods embedded within a metal foam structure
05/19/2005DE10345247A1 Semiconductor component used in power technology comprises a semiconductor body having a semiconductor base surface, a pressing composition for sealing the body and a claw structure
05/19/2005DE10345157A1 Wärmeleitende Verpackung von elektronischen Schaltungseinheiten Thermally conductive packaging electronic circuit units
05/19/2005DE10344389A1 Verfahren zur Herstellung einer multifunktionellen Dielektrikumschicht auf einem Substrat A process for producing a multifunctional dielectric layer on a substrate
05/19/2005DE10343578A1 Umverdrahtungssubstratstreifen mit mehreren Halbleiterbauteilpositionen Rewiring substrate having a plurality of semiconductor component positions
05/19/2005DE102004042538A1 Manufacture of electronic device, e.g. acceleration sensor device, by plating lid of package, removing burrs on lid surface by chemical polishing, inserting electronic component in package body, and attaching lid to package body
05/19/2005DE10160872B3 Module with power semiconductor component on substrate with three terminals has at least two terminals coupled by flip-chip contacting to contact unit
05/18/2005EP1531657A1 Multi-layer substrates having at least two dissimilar polyimide layers and a conductive layer, useful for electronics-type applications, and compositions relating thereto
05/18/2005EP1531494A2 Double-sided multi-chip circuit component
05/18/2005EP1531492A2 Semiconductor device and its manufacturing method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate
05/18/2005EP1531360A2 Stencil mask and method of producing the same
05/18/2005EP1530802A2 Integrated circuit with id code and method of manufacturing same
05/18/2005EP1530801A1 Semiconductor component having a chip scale package (csp) housing
05/18/2005CN2701074Y Liquid cooling type heat sink
05/18/2005CN2701073Y A heat sink for driving semiconductor
05/18/2005CN2701072Y Heat sink
05/18/2005CN2701071Y Heat sink for field effect transistor
05/18/2005CN2701070Y A plastic packaged electronic component
05/18/2005CN2700943Y Radiator fastener
05/18/2005CN1618128A Semiconductor device and method for producing high contrast identifying mark
05/18/2005CN1618126A Wire bond-less electronic component for use with an external circuit and method of manufacture
05/18/2005CN1617445A Acoustic wave device and method of fabricating the same
05/18/2005CN1617351A 半导体显示器件 The semiconductor display device
05/18/2005CN1617341A Semiconductor device having fuse and capacitor at the same level and method of fabricating the same
05/18/2005CN1617339A Semiconductor device
05/18/2005CN1617335A Repair fuse box of semiconductor device
05/18/2005CN1617334A Semiconductor device and electronic apparatus equipped with the semiconductor device
05/18/2005CN1617333A Leg correcting tool for chip transfer plate
05/18/2005CN1617332A Adhesive thin sheet for producing semiconductor device, semiconductor device and its producing method
05/18/2005CN1617331A Wafer package structure and its base plate
05/18/2005CN1617330A Press in sealed electronic part and its producing method
05/18/2005CN1617325A Method for forming insulation film of semiconductor device and semiconductor device
05/18/2005CN1617324A Method of forming metal line in semiconductor device
05/18/2005CN1617318A Test region layout for shallow trench isolation
05/18/2005CN1617315A Semiconductor package piece
05/18/2005CN1617312A Semiconductor device and method for fabricating the same
05/18/2005CN1617295A Circuit board transferring apparatus and method and solder ball mounting method
05/18/2005CN1617244A Heat source , optical pickup assembly employing the heat source and method of reducing temperature therein
05/18/2005CN1617065A Vacuum packaging method for heat radiator
05/18/2005CN1617034A 液晶显示器 LCD Monitor
05/18/2005CN1616579A Resin composition for encapsulating semiconductor device
05/18/2005CN1616223A Flexible metal stacked body
05/18/2005CN1202696C Method for mfg. printed circuit board
05/18/2005CN1202574C Protecting circuit for memory array
05/18/2005CN1202573C Semiconductor component package module unit and programming method thereof
05/18/2005CN1202572C Radiating method and its structure
05/18/2005CN1202565C 半导体装置 Semiconductor device
05/18/2005CN1202559C Folded vernier pattern and measurement method for measuring alignment accuracy rating between overlapped multiple layers
05/18/2005CN1202455C Hot-fin heat exchanger
05/18/2005CN1202448C Anti-tamper integrated circuit
05/18/2005CN1202174C Resin composition, molded article therefrom, and utilization thereof
05/17/2005US6895538 Method for testing a device and a test configuration including a device with a test memory
05/17/2005US6895509 Tamper detection system for securing data
05/17/2005US6895026 Heat sink and semiconductor laser apparatus and semiconductor laser stack apparatus using the same
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