Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2005
06/02/2005WO2005050714A2 High temperature electronic devices
06/02/2005WO2005050699A2 Method of forming a semiconductor package and structure thereof
06/02/2005WO2005050407A2 Systems and methods for credit card charge validation over a network
06/02/2005WO2005050257A2 High temperature imaging device
06/02/2005WO2005049957A2 High temperature environment tool system and method
06/02/2005WO2005038882A3 Electronic device and method of manufacturing thereof
06/02/2005WO2005038861A9 High density integrated circuit package architecture
06/02/2005WO2005031811A3 Process and integration scheme for fabricating conductive components through-vias and semiconductor components including conductive through-wafer vias
06/02/2005WO2005022591A9 Reversible leadless package and methods of making and using same
06/02/2005WO2004097905A3 Dc-dc converter implemented in a land grid array package
06/02/2005WO2004082347A3 Solder on a sloped surface
06/02/2005WO2004070852A3 Peltier cooler integrated with electronic device(s)
06/02/2005WO2004001800A3 Chip package sealing method
06/02/2005US20050120322 Method and apparatus for performing power routing on a voltage island within an integrated circuit chip
06/02/2005US20050119394 Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts
06/02/2005US20050118868 Electronic device and circuit module device
06/02/2005US20050118845 Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices
06/02/2005US20050118838 Semiconductor device and method of manufacturing the same
06/02/2005US20050118833 Method for manufacturing semiconductor device
06/02/2005US20050118809 Manufacturing method of semiconductor device
06/02/2005US20050118807 Ald deposition of ruthenium
06/02/2005US20050118805 Method of fabricating semiconductor integrated circuit device
06/02/2005US20050118803 Building metal pillars in a chip for structure support
06/02/2005US20050118797 Semiconductor devices with capacitors of metal/insulator/metal structure and methods for forming the same
06/02/2005US20050118794 Remote plasma deposition of thin films
06/02/2005US20050118791 Method of manufacturing semiconductor device and system of manufacturing semiconductor device
06/02/2005US20050118785 Method for forming alignment pattern of semiconductor device
06/02/2005US20050118778 Metal-insulator-metal (mim) capacitor and fabrication method for making the same
06/02/2005US20050118747 Method for preparing gas-tight terminal
06/02/2005US20050118738 Pattern for improved visual inspection of semiconductor devices
06/02/2005US20050118736 Method for measuring withstand voltage of semiconductor epitaxial wafer and semiconductor epitaxial wafer
06/02/2005US20050118464 power source which includes a flexible thin layer open liquid state electrolytic cell, having electronic chips integrally formed on or within the cell
06/02/2005US20050118447 Stiffener, a method of manufacturing a stiffener, and a semiconductor device with a stiffener
06/02/2005US20050118017 [fan module]
06/02/2005US20050117835 Techniques for joining an opto-electronic module to a semiconductor package
06/02/2005US20050117351 Hybrid illuminator
06/02/2005US20050117315 Method of manufacturing an electronic device
06/02/2005US20050117307 Electronic apparatus
06/02/2005US20050117306 Heat dissipating device assembly
06/02/2005US20050117305 Integrated heat sink assembly
06/02/2005US20050117303 Heat radiation device for memory module
06/02/2005US20050117302 Module structure and module comprising it
06/02/2005US20050117301 Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling
06/02/2005US20050117300 Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling
06/02/2005US20050117299 Channeled heat sink and chassis with integrated heat rejecter for two-phase cooling
06/02/2005US20050117298 Cooling device and an electronic apparatus including the same
06/02/2005US20050117296 Ball grid array package with heat sink device
06/02/2005US20050117291 Electronic device
06/02/2005US20050117272 Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same
06/02/2005US20050117271 Electronic device and method of manufacturing same
06/02/2005US20050117267 IC package substrate with over voltage protection function
06/02/2005US20050116369 Aerosol method and apparatus, particulate products, and electronic devices made therefrom
06/02/2005US20050116359 Mercury vapor discharge lamp; cost reduction in lamp manufacture; fusion and processing properties, in particular a liquidus temperature
06/02/2005US20050116357 Method and structure to enhance temperature/humidity/bias performance of semiconductor devices by surface modification
06/02/2005US20050116356 Circuit layout structure
06/02/2005US20050116355 Packages for image sensitive electronic devices
06/02/2005US20050116354 Substrate for mounting semiconductor chip, mounting structure of semiconductor chip, and mounting method of semiconductor chip
06/02/2005US20050116353 Semiconductor device and fabrication method thereof
06/02/2005US20050116352 Acoustic wave device and method of fabricating the same
06/02/2005US20050116351 Semiconductor interconnect having conductive spring contacts
06/02/2005US20050116350 Titanium underlayer for lines in semiconductor devices
06/02/2005US20050116348 Semiconductor device and method of manufacturing the same
06/02/2005US20050116346 Low dielectric materials and methods for making same
06/02/2005US20050116345 Support structure for low-k dielectrics
06/02/2005US20050116344 Microelectronic element having trace formed after bond layer
06/02/2005US20050116342 Device interconnection
06/02/2005US20050116340 Semiconductor device and method of manufacturing the same
06/02/2005US20050116339 Semiconductor device and method of fabricating the same, electronic module, together with electronic instrument
06/02/2005US20050116338 Semiconductor device
06/02/2005US20050116337 Method of making multichip wafer level packages and computing systems incorporating same
06/02/2005US20050116336 Nano-composite materials for thermal management applications
06/02/2005US20050116335 Semiconductor package with heat spreader
06/02/2005US20050116333 Semiconductor device and semiconductor device manufacturing method
06/02/2005US20050116331 Stacked chip semiconductor device
06/02/2005US20050116330 Semiconductor module and method for mounting the same
06/02/2005US20050116328 Substrate and method of manufacture thereof
06/02/2005US20050116327 Method of manufacturing a semiconductor device
06/02/2005US20050116326 Formation of circuitry with modification of feature height
06/02/2005US20050116325 Switching media for chip carrier device
06/02/2005US20050116324 Semiconductor device and manufacturing method thereof
06/02/2005US20050116323 Having thinned element; preventing breakage in outer periphery portion
06/02/2005US20050116322 Efficient heat dissipation, reliable electrical connection; small conductive pattern interval; leads serving as terminals
06/02/2005US20050116321 Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP)
06/02/2005US20050116317 Inductor for a system-on-a-chip and method for manufacturing the same
06/02/2005US20050116316 Semiconductor device with fuse box and method for fabricating the same
06/02/2005US20050116315 Semiconductor device and blowout method of fuse
06/02/2005US20050116314 Semiconductor memory integrated circuit and layout method of the same
06/02/2005US20050116310 Semiconductor device and method for manufacturing the same
06/02/2005US20050116307 Method and arrangement for protecting a chip and checking its authenticity
06/02/2005US20050116276 Metal-insulator-metal (MIM) capacitor and fabrication method for making the same
06/02/2005US20050116257 Field effect transister structures
06/02/2005US20050116255 Magnetic memory device
06/02/2005US20050116231 Thin film transistor and method of manufacturing the same
06/02/2005US20050116224 Circuit board having test coupon and method for evaluating the circuit board
06/02/2005US20050116222 Memory device and method for burn-in test
06/02/2005US20050116145 Optical semiconductor element and electronic device using the optical semiconductor element
06/02/2005US20050116142 Solid-state imaging apparatus, wiring substrate and methods of manufacturing the same
06/02/2005US20050116051 Module for contactless chip cards or identification systems
06/02/2005US20050116013 Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers
06/02/2005US20050115937 Laser-based method and system for memory link processing with picosecond lasers
1 ... 1361 1362 1363 1364 1365 1366 1367 1368 1369 1370 1371 1372 1373 1374 1375 1376 1377 1378 1379 1380 1381 ... 2262