Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2005
06/23/2005DE10352671A1 Leistungsmodul Power module
06/23/2005DE10352349A1 Halbleiterchip mit Flip-Chip-Kontakten und Verfahren zur Herstellung desselben Of the same semiconductor chip having flip chip contacts, and processes for preparing
06/23/2005DE10325029B4 Substratbasiertes Chip-Package Substrate based chip package
06/23/2005DE10324069B4 Schaltungsanordnung und Verfahren zur leitenden Verbindung von Kontaktflecken bei Halbleiterchips Circuit arrangement and method for conductive connection of contact pads of semiconductor chips
06/23/2005DE102004057486A1 Gate driver for driving high voltage switching transistor e.g. power MOSFET, has two sub-circuits, each one having signal path coupled to gate control signal generator` input, in which one path provides signal with reduced delay
06/23/2005DE102004052227A1 Speichersystem und Speichermodul Storage system, and storage modulus
06/23/2005DE102004043084A1 Einrichtung und Verfahren für die Montage oder Verdrahtung von Halbleiterchips Apparatus and method for the assembly or wiring of semiconductor chips
06/23/2005DE102004002205B3 Forming alignment mask for semiconductor memory unit, includes stages of electrode formation, dielectric deposition, selective filling, collar- and hollow formation
06/23/2005DE10055436B4 Kühlverguss für ein elektrisches Bauteil Kühlverguss for an electrical part
06/22/2005EP1545180A2 Thermal transfer mat for electrical or electronic apparatuses and process for producing it
06/22/2005EP1545179A1 Integrated heat dissipating assembly for computer systems
06/22/2005EP1545173A1 Wiring circuit board
06/22/2005EP1545172A1 Method for manufacturing a printed circuit board that mounts an integrated circuit device thereon and the printed circuit board
06/22/2005EP1545170A1 Wiring circuit board
06/22/2005EP1544924A2 LED package assembly
06/22/2005EP1544923A2 Radiation emitting semiconductor device and method of mounting a semiconductor chip on a leadframe
06/22/2005EP1544917A1 Integrated battery pack with lead frame connection
06/22/2005EP1544916A1 Raised solder pad and method using the same
06/22/2005EP1544915A2 Electronic module heat sink mounting arrangement
06/22/2005EP1544914A2 Semiconductor device and method of manufacturing thereof
06/22/2005EP1544913A2 Semiconductor device and method of manufacturing thereof
06/22/2005EP1544912A2 Package for mounting an optical element and a method of manufacturing the same
06/22/2005EP1544906A1 Method and device for laser beam processing of silicon substrate, and method and device for laser beam cutting of silicon wiring
06/22/2005EP1543588A2 Interconnection system
06/22/2005EP1543559A2 Crack resistant interconnect module
06/22/2005EP1543558A2 Radio frequency identificaton device and method
06/22/2005EP1543557A2 Method and apparatus for cooling a portable computer
06/22/2005EP1543556A2 Taped lead frames and methods of making and using the same in semiconductor packaging
06/22/2005EP1543555A1 Press pack power semiconductor module
06/22/2005EP1543338A1 Integrated test circuit arrangement and test method
06/22/2005EP1542862A1 Thermal interface materials
06/22/2005EP1393371B1 Electronic module and method for assembling same
06/22/2005EP1311190A4 Apparatus and method for collecting data useful for determining the parameters of an alert window for timing delivery of etc signals to a heart under varying cardiac conditions
06/22/2005EP1111667A4 Semiconductor device and method for manufacturing the same
06/22/2005CN2705893Y Phase changing heat radiator
06/22/2005CN2705892Y Heat radiation module
06/22/2005CN1631067A Transfer carrier for flexible printed circuit board and electronic parts mounting method to flexible printed circuit board
06/22/2005CN1631066A Latching micro magnetic relay packages and methods of packaging
06/22/2005CN1630977A Piezoelectric oscillator, manufacturing method thereof, and electronic equipment
06/22/2005CN1630946A Electronic circuit component
06/22/2005CN1630945A Semiconductor device package and lead frame with die overhanging lead frame pad
06/22/2005CN1630944A High performance air cooled heat sinks used in high density packaging applications
06/22/2005CN1630939A Forming printed circuit board structure using piezoelectric micro-coating method
06/22/2005CN1630189A Mounting substrate and electronic component using the same
06/22/2005CN1630103A Electronics assembly
06/22/2005CN1630086A 半导体集成电路器件 The semiconductor integrated circuit device
06/22/2005CN1630079A 静电放电保护器件及其制造方法 Electrostatic discharge protection device and manufacturing method thereof
06/22/2005CN1630077A Semiconductor device structure and manufacturing technology thereof
06/22/2005CN1630076A Electric circuit module
06/22/2005CN1630075A Thermal conductivity composite sheet materials
06/22/2005CN1630074A Semiconductor element thermal radiation arrangement and radiator
06/22/2005CN1630073A 芯片球栅阵列封装结构 Chip ball grid array package
06/22/2005CN1630072A Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
06/22/2005CN1630071A Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus
06/22/2005CN1630070A Adhesive film for manufacturing semiconductor device
06/22/2005CN1630069A Package for mounting an optical element and a method of manufacturing the same
06/22/2005CN1630068A Wiring circuit board
06/22/2005CN1630067A Wiring circuit board
06/22/2005CN1630066A High wireability microvia substrate
06/22/2005CN1630062A Method of manufacturing semiconductor integrated circuit
06/22/2005CN1630051A Semiconductor device producing method, semiconductor device, circuit substrate, and electronic device
06/22/2005CN1630049A System and a method for fluid filling wafer level packages
06/22/2005CN1630048A Apparatus for separating cull of semiconductor package molding system
06/22/2005CN1630039A Method for selective electroplating of semiconductor device i/o pads
06/22/2005CN1630029A Semiconductor device and method of fabricating the same
06/22/2005CN1629988A Inductor element
06/22/2005CN1629926A Drive chip and display device with the same
06/22/2005CN1629917A Drive chip and display device with the same
06/22/2005CN1629706A Semiconductor device, semiconductor device array substrate and method of manufacturing the same
06/22/2005CN1629595A Forced fluid heat sink
06/22/2005CN1629242A Sprayable adhesive material for laser marking semiconductor wafers, dies and devices
06/22/2005CN1207947C Printed circuit board assembly
06/22/2005CN1207787C Combined transistor-capacitor structure in deep sub-micro MOS for power amplifier
06/22/2005CN1207785C Semiconductor device, method of manufacturing electronic device, electronic device and portable information terminal
06/22/2005CN1207783C 电子模块 Electronic Modules
06/22/2005CN1207782C Integrated circuit device, electronic module for smart card and method for making same
06/22/2005CN1207781C Stabilizing plate of heat radiator
06/22/2005CN1207780C Improved integrated circuit structure
06/22/2005CN1207779C Semiconductor device and method for mfg. same
06/22/2005CN1207778C Semiconductor device and method of manufacturing same
06/22/2005CN1207774C Semiconductor integrated circuit and mfg. method thereof
06/22/2005CN1207772C Method for designing wiring connecting part and semiconductor device
06/22/2005CN1207768C Semiconductor device with silicon structure on insulator, and method for manufacturing same
06/22/2005CN1207760C Method of forming conductive coating on semiconductor device
06/22/2005CN1207688C Method for producing chip module
06/22/2005CN1207411C High-strength and high-conductivity copper-base material and its prepn process
06/22/2005CN1207319C Semiconductor device and its manufacture
06/22/2005CN1207249C Ceramic parts and method for manufacturing the same
06/21/2005US6909655 Integrated circuit
06/21/2005US6909633 MRAM architecture with a flux closed data storage layer
06/21/2005US6909608 Heat sink assembly with heat pipe
06/21/2005US6909604 Cooling device capable of reducing thickness of electronic apparatus
06/21/2005US6909603 Ventilating slide rail mount
06/21/2005US6909593 Multi-layer capacitor, wiring board, and high-frequency circuit
06/21/2005US6909592 Thin film capacitor and fabrication method thereof
06/21/2005US6909591 Complimentary metal oxide semiconductor capacitor and method for making same
06/21/2005US6909589 MEMS-based variable capacitor
06/21/2005US6909487 Electro-optical device and semiconductor device
06/21/2005US6909196 Method and structures for reduced parasitic capacitance in integrated circuit metallizations
06/21/2005US6909194 Electronic assembly having semiconductor component with polymer support member and method of fabrication
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