Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2005
05/26/2005US20050110099 Vacuum gap; reducing power consumption; miniaturized heat pump; prevent back flow of heat
05/26/2005US20050110095 Novel stacked string for power protection and power connection
05/26/2005US20050110092 CMOS silicon-control-rectifier (SCR) structure for electrostatic discharge (ESD) protection
05/26/2005US20050110084 Thin film transistor, method of fabricating the same, and flat panel display using thin film transistor
05/26/2005US20050110065 Semiconductor integrated circuit device including dummy patterns located to reduce dishing
05/26/2005US20050110058 Method and structure for reducing resistance of a semiconductor device feature
05/26/2005US20050110053 Detector plate containing apertures; barrier contactors
05/26/2005US20050110049 Semiconductor device and its manufacturing method, electronic module, and electronic unit
05/26/2005US20050110046 High-frequency diode
05/26/2005US20050110014 Thin film transistor array panel and manufacturing method thereof
05/26/2005US20050110012 Overlay mark for measuring and correcting alignment errors
05/26/2005US20050109926 Solid-state imaging device and method for manufacturing the same
05/26/2005US20050109631 Tape substrate and method for fabricating the same
05/26/2005US20050109536 Connecting a solenoid to a lead frame
05/26/2005US20050109535 High performance chip carrier substrate
05/26/2005US20050109525 Methods and apparatus for integrated circuit device power distribution via internal wire bonds
05/26/2005US20050109488 Fastening structure of heat sink
05/26/2005US20050109455 Device having a complaint element pressed between substrates
05/26/2005US20050109453 Fabrication of LTCC T/R modules with multiple cavities and an integrated ceramic ring frame
05/26/2005US20050108877 Apparatus and method for coupling a thermal dissipation device to an electronic substrate
05/26/2005CA2535634A1 Nanotube-based switching elements with multiple controls and circuits made from same
05/25/2005EP1534053A2 Thick film conductor paste compositions for LTCC tape
05/25/2005EP1533842A2 Semiconductor device with protection against unauthorized analysis
05/25/2005EP1533841A2 Cooling apparatus
05/25/2005EP1533840A1 A heat radiating system and method for a mobile communication terminal
05/25/2005EP1533839A2 Semiconductor device with a gel-filled case
05/25/2005EP1533837A1 Selective electroplating method
05/25/2005EP1532683A2 Prevention of tampering in electronic devices
05/25/2005EP1532682A2 Semiconductor wafer having electrically connected contact and testing surfaces
05/25/2005EP1532681A1 Multi-layer circuit carrier and production thereof
05/25/2005EP1532416A2 Composite heat sink with metal base and graphite fins
05/25/2005EP1532226A1 Oxygen-scavenging packaging
05/25/2005EP1531985A2 Thermal interconnect and interface systems, methods of production and uses thereof
05/25/2005EP1504468A4 Microelectronic assembly with die support and method
05/25/2005EP1474828B1 Housing for a power semiconductor module which is resistant to high voltages
05/25/2005EP1368833B1 Integrated circuit comprising electric connecting elements
05/25/2005EP1354357B1 Semiconductor device with an improved transmission line
05/25/2005DE19519499B4 Thermoplastische Klebstoffolie und deren Verwendung Thermoplastic adhesive and their use
05/25/2005DE10355598B3 Cooling device for electrical component of computer system with heat-generating components has spring compressed when electrical component fitted in computer system so contacts are connected to thermally connect heat conducting tubes
05/25/2005DE10349749B3 Anti-Fuse-Verbindung für integrierte Schaltungen sowie Verfahren zur Herstellung von Anti-Fuse-Verbindungen Anti-fuse link for integrated circuits as well as methods for the preparation of anti-fuse connections
05/25/2005DE10348641A1 Verfahren zur Verringerung parasitärer Kopplungen in Schaltkreisen A method for reducing parasitic couplings in circuits
05/25/2005DE10347622A1 Substrate for making solder connection to second substrate or chip has solder pad with solderable adhesive surfaces in addition to electrical contact surface
05/25/2005DE10347621A1 Substratbasiertes Package für integrierte Schaltkreise Substrate-based package for integrated circuits
05/25/2005DE10347518A1 Elektronisches Bauelement, Schaltungsträgeraufbau und Elektronikeinheit mit Wärmespeicher Electronic component, circuit board design and electronics unit with heat storage
05/25/2005DE10340714B3 Teststruktur für ein Single-sided Buried Strap-DRAM-Speicherzellenfeld Test structure for a single-sided buried strap DRAM memory cell array
05/25/2005DE102004048529A1 Electronic device for driving brushless motor, has semiconductor chip with one contact side bonded to metallic conductor portion through solid soldering agent layer whose softening temperature is used as device operating temperature
05/25/2005DE102004048498A1 Herstellung von Fullerenol mit Nanoschicht- oder Nanodrahtstruktur Production of fullerenol with nanolayer or nanowire structure
05/25/2005DE102004040773B3 Semiconductor switching device for switching high currents and voltages has temperature measurement sensor attached to surface of isolating film facing away from copper layer in area of film laminated onto surface of copper layer
05/25/2005DE102004029232A1 Herstellungsverfahren eines Halbleiterbauelements und Halbleiterbauelement Manufacturing method of a semiconductor device and semiconductor device
05/25/2005DE102004013770A1 Wafer level package for micro device e.g. film bulk acoustic resonator device comprises via connectors extending from bonding pads to other surface of device wafer and external bonding pads formed at other surface of wafer
05/25/2005DE10164522B4 Spannvorrichtung und Halbleiterbauelement mit einer Spannvorrichtung Clamping device and semiconductor device with a tensioning device
05/25/2005CN2702445Y Chip structure modification
05/25/2005CN2702444Y Water-cooling type heat sink
05/25/2005CN2702443Y Heat sink protective device
05/25/2005CN2702442Y Adjustable positioning support structure for radiating assembly
05/25/2005CN1620725A Electrical component assembly and method of fabrication
05/25/2005CN1620724A Device and method for package warp compensation in an integrated heat spreader
05/25/2005CN1620722A Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices
05/25/2005CN1620712A Self-ionized and inductively-coupled plasma for sputtering and resputtering
05/25/2005CN1620592A Heat dissipating component using high conducting inserts
05/25/2005CN1620240A Composite radiator for power electron equipment
05/25/2005CN1620236A Interposer with electrical contact button and method
05/25/2005CN1620227A Method of manufacturing substrate for circuit board and smart label having the substrate
05/25/2005CN1619953A Electronic element
05/25/2005CN1619844A GaN based LED upside down welding combination, and lamp and chip horizontally upside down welding technique
05/25/2005CN1619813A Light source structure of luminous diode
05/25/2005CN1619812A Stacked semiconductor device
05/25/2005CN1619811A 半导体器件 Semiconductor devices
05/25/2005CN1619809A Interconnect structures with engineered dielectrics with nanocolumnar porosity
05/25/2005CN1619808A 半导体装置 Semiconductor device
05/25/2005CN1619807A Substrate including integrated circuit chip and integrated circuit on said substrate
05/25/2005CN1619806A Method of fabricating lead frame and method of fabricating semiconductor device using the same
05/25/2005CN1619805A Bond pad for flip chip package and semiconductor assembly
05/25/2005CN1619804A Semiconductor device and its mfg method, electroluminescence apparatus and its mfg method
05/25/2005CN1619803A Flow-path constituting body
05/25/2005CN1619802A Aluminium profile material water cooling heat rdiating body for semi conductor device
05/25/2005CN1619801A Heat radiator
05/25/2005CN1619800A Radiator and its preparation method
05/25/2005CN1619799A Semiconductor device with a pair of radiating fan
05/25/2005CN1619798A Heat spreader ball grid array package its forming method
05/25/2005CN1619797A Connector and method of manufacturing the same
05/25/2005CN1619796A Semiconductor device
05/25/2005CN1619787A 半导体装置 Semiconductor device
05/25/2005CN1619784A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
05/25/2005CN1619550A Semiconductor IC with inclined wiring and its wiring method and wiring diagram designing program
05/25/2005CN1619324A Test pattern for reliability measurement of copper interconnection line having moisture window and method for manufacturing the same
05/25/2005CN1619249A Flat press sealing method of thermal conducting pipe
05/25/2005CN1619248A Sealing method of thermal conducting pipe round end
05/25/2005CN1619247A Preparation method of thermal conducting pipe
05/25/2005CN1619002A Self-encapsulated silver alloys for interconnects
05/25/2005CN1618601A Electroplated CoWP composite structures as copper barrier layers
05/25/2005CN1203748C Electronic device producing method
05/25/2005CN1203747C Multiple heat radiating set
05/25/2005CN1203746C Electronic device with improved heat dissipation performance
05/25/2005CN1203741C Method for mfg. printed circuit board
05/25/2005CN1203553C Low voltage triggered SCR containing Si in insulating layer and protecting circuit for electrostatic discharge
05/25/2005CN1203547C Semiconductor device and its producing method
05/25/2005CN1203546C High density design for organic chip carrier
05/25/2005CN1203544C Methods and compositions for improving interconnect metallization performance in integrated circuits
05/25/2005CN1203543C 半导体器件和半导体模块 A semiconductor device and a semiconductor module
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