| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/30/2005 | DE102004048678A1 Keramiksubstrat für ein elektronisches Dünnschicht-Bauelement, Herstellungsverfahren hierfür und elektronisches Dünnschicht-Bauelement unter Verwendung desselben Of the same ceramic substrate for an electronic thin film device, manufacturing method thereof and electronic thin film device using |
| 06/30/2005 | DE102004033057A1 Wafer-Level-Package-Struktur vom Fan-Out-Typ und Verfahren zur Herstellung derselben Wafer-level package structure of the fan-out type and method of making same |
| 06/30/2005 | DE102004031736A1 Anpassungsschaltungen auf optoelektronischen Vorrichtungen Matching circuits on optoelectronic devices |
| 06/30/2005 | DE102004005269A1 Light emitting semiconductor element has multilayers on a substrate with the pn junction insulatively separated into light emitting and protective diode sections |
| 06/30/2005 | DE102004004097A1 Opto-electronic component for emitting radiation links to a heat sink for pulsed operation with a duration of pulse |
| 06/30/2005 | CA2591569A1 Lighting assembly, heat sink and heat recovery system therefor |
| 06/29/2005 | EP1549121A2 Inductor element containing circuit board and power amplifier module |
| 06/29/2005 | EP1548905A1 Light emitting element |
| 06/29/2005 | EP1548893A1 Connecting a solenoid to a lead frame |
| 06/29/2005 | EP1548884A1 Anisotropic conductive sheet, its manufacturing method, and its application |
| 06/29/2005 | EP1548838A1 Source/drain electrode for flat panel display device and method of fabricating the same |
| 06/29/2005 | EP1548833A1 Ferroelectric memory and its manufacturing method |
| 06/29/2005 | EP1548829A2 Power semiconductor module and method for its manufacture |
| 06/29/2005 | EP1548828A2 Semiconductor device and electronic equipment using the same |
| 06/29/2005 | EP1548827A1 Integrated circuit package arrangement and method |
| 06/29/2005 | EP1548826A1 Chip pad layout |
| 06/29/2005 | EP1548825A2 Semiconductor device, manufacturing method thereof and electronic equipment |
| 06/29/2005 | EP1548824A2 System and method for improving solder joint reliability in an integrated circuit package |
| 06/29/2005 | EP1548821A2 Dicing die-bonding film |
| 06/29/2005 | EP1548815A1 Semiconductor device and its manufacturing method |
| 06/29/2005 | EP1548043A1 Epoxy resin composition for sealing optical semiconductor |
| 06/29/2005 | EP1547456A1 Heat sink having folded fin heat exchanger core |
| 06/29/2005 | EP1547394A2 Packaged rf power transistor having rf bypassing/output matching network |
| 06/29/2005 | EP1547144A2 Reduced splattering of unpassivated laser fuses |
| 06/29/2005 | EP1547142A1 Selective connection in ic packaging |
| 06/29/2005 | EP1547141A2 Semiconductor multi-package module having wire bond interconnection between stacked packages |
| 06/29/2005 | EP1547136A2 Method for making a wire nanostructure in a semiconductor film |
| 06/29/2005 | EP1547133A2 Mim capacitor structures and fabrication methods in dual-damascene structures |
| 06/29/2005 | EP1547128A2 Method and apparatus for shielding an integrated circuit from radiation |
| 06/29/2005 | EP1546946A2 Integrated circuit devices and methods and apparatuses for designing integrated circuit devices |
| 06/29/2005 | EP1546656A2 Method and apparatus for monitoring integrated circuit fabrication |
| 06/29/2005 | EP1546028A2 Method for selectively covering a micro machined surface |
| 06/29/2005 | EP1545828A1 Method and appartus for high volume assembly of radio frequency identification tags |
| 06/29/2005 | EP1354381B1 Mounting of optical device on heat sink |
| 06/29/2005 | EP1352008B1 Epoxy resin composition for semiconductor encapsulation |
| 06/29/2005 | EP1317801B1 Thick film millimeter wave transceiver module |
| 06/29/2005 | EP1060647A4 Method of making microwave, multifunction modules using fluoropolymer composite substrates |
| 06/29/2005 | CN2706876Y Semiconductor LED with strong radiating mechanism |
| 06/29/2005 | CN2706872Y Radiating device for LED |
| 06/29/2005 | CN2706871Y Radiating device for LED |
| 06/29/2005 | CN2706870Y Efficient two-phase fluid evaporator |
| 06/29/2005 | CN2706869Y Radiating device |
| 06/29/2005 | CN2706868Y Radiating device combination |
| 06/29/2005 | CN2706867Y Radiator |
| 06/29/2005 | CN2706866Y 散热器 Heat sink |
| 06/29/2005 | CN2706865Y Radiator fastener |
| 06/29/2005 | CN2706864Y Stacked fin type radiator |
| 06/29/2005 | CN2706863Y Heat radiator combination |
| 06/29/2005 | CN2706862Y Chip embedded packaging structure |
| 06/29/2005 | CN2706794Y Air guiding device |
| 06/29/2005 | CN1633712A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 06/29/2005 | CN1633710A Method for determining an ESD/latch-up strength of an integrated circuit |
| 06/29/2005 | CN1633709A Semicoductor radiating substrate and production method therefor and package |
| 06/29/2005 | CN1633708A Semiconductor device and method of manufacturing the same |
| 06/29/2005 | CN1633705A Semiconductor device and method of manufacturing the same |
| 06/29/2005 | CN1633704A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof |
| 06/29/2005 | CN1633513A Lead-free tin-silver-copper alloy solder composition |
| 06/29/2005 | CN1633466A Static electricity preventing method and method using the method |
| 06/29/2005 | CN1633230A 一种加热系统 A heating system |
| 06/29/2005 | CN1632950A 半导体封装构造 Semiconductor package |
| 06/29/2005 | CN1632949A Integrate circuit chip structure |
| 06/29/2005 | CN1632948A Method for implementing signal transmission between ICs using multilevel technology |
| 06/29/2005 | CN1632947A Heat sink and method for making same |
| 06/29/2005 | CN1632718A Unpowered self-loop computer liquid cooling system |
| 06/29/2005 | CN1632717A Highly effective liquid cooling heat sink for computer |
| 06/29/2005 | CN1632716A Integrated fan and circulating pump for computer liquid cooling radiator |
| 06/29/2005 | CN1632715A Heat radiating method and apparatus for side blowing type CPU radiator |
| 06/29/2005 | CN1632714A Reducing support of CPU radiator fan |
| 06/29/2005 | CN1631665A Laminar composition and method for preparing the same |
| 06/29/2005 | CN1208839C Built-in protective N-type high-voltage MOS transistor |
| 06/29/2005 | CN1208835C Plane mounted electronic circuit unit |
| 06/29/2005 | CN1208832C Semiconductor device and production method thereof |
| 06/29/2005 | CN1208831C Semiconductor lead frame |
| 06/29/2005 | CN1208830C Semiconductor chip and wiring base plate and manufacturing method, semiconductor chip, semiconductor device |
| 06/29/2005 | CN1208821C Method for packaging semiconductor chip and its products |
| 06/29/2005 | CN1208820C Semiconductor chip, semiconductor device and manufacture method thereof |
| 06/29/2005 | CN1208816C Method for forming copper wires in semiconductor device |
| 06/29/2005 | CN1208815C Semiconductor device and manufacturing method thereof |
| 06/29/2005 | CN1208783C 介电陶瓷组合物 The dielectric ceramic composition |
| 06/29/2005 | CN1208661C Semiconductor device |
| 06/29/2005 | CN1208420C Heat conductive electronic pouring sealant |
| 06/29/2005 | CN1208418C Adhesive composition, process for producing the same, adhesive film made with the same, substrate for semiconductor mounting, and semiconductor device |
| 06/28/2005 | US6912699 Testing design for flip chip connection process |
| 06/28/2005 | US6912130 Combined member of aluminum-ceramics |
| 06/28/2005 | US6912128 Electronics cooling subassembly |
| 06/28/2005 | US6912019 Method of manufacturing a semiconductor device |
| 06/28/2005 | US6911837 Method and apparatus for evaluating and adjusting microwave integrated circuit |
| 06/28/2005 | US6911739 Methods and apparatus for improving high frequency input/output performance |
| 06/28/2005 | US6911738 Method and apparatus for improving defective solder joint detection using x-ray inspection of printed assemblies |
| 06/28/2005 | US6911737 Semiconductor device package and method |
| 06/28/2005 | US6911736 Electrostatic discharge protection |
| 06/28/2005 | US6911734 Semiconductor device and electronic device |
| 06/28/2005 | US6911733 Semiconductor device and electronic device |
| 06/28/2005 | US6911732 Integrated circuit |
| 06/28/2005 | US6911730 Multi-chip module including embedded transistors within the substrate |
| 06/28/2005 | US6911729 Tape carrier semiconductor device |
| 06/28/2005 | US6911728 Member for electronic circuit, method for manufacturing the member, and electronic part |
| 06/28/2005 | US6911727 Package for sealing an integrated circuit die |
| 06/28/2005 | US6911726 Heat resistance substrates comprising pads and dies, pins coupled to the pads with electroconductive connectors and layers of curable coverings |
| 06/28/2005 | US6911725 Film substrate, semiconductor device, method of manufacturing film substrate, method of manufacturing semiconductor device and method of manufacturing circuit board with semiconductor device |