| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/02/2005 | US20050115936 Laser-based method and system for memory link processing with picosecond lasers |
| 06/02/2005 | US20050115740 Multilayered power supply line for semiconductor integrated circuit and layout method thereof |
| 06/02/2005 | US20050115702 Fin assembly of heat sink |
| 06/02/2005 | US20050115698 Structure of heat sink |
| 06/02/2005 | US20050115673 On-wafer monitoring system |
| 06/02/2005 | US20050115257 System and method for cooling multiple logic modules |
| 06/02/2005 | US20050115062 Chip assembling structure and socket |
| 06/02/2005 | DE202005005065U1 Finned heat sink incorporating heat pipe, for cooling electrical and electronic components, has fins of coppered aluminum with bores for attachment to heat pipe |
| 06/02/2005 | DE202004020371U1 Gegenstand mit einem Schichtenverbund An article comprising a layer composite |
| 06/02/2005 | DE19860322B4 Anordnung zur Abführung von in einem PTC-Element entstehender Wärme Arrangement for removing emerging in a PTC element heat |
| 06/02/2005 | DE19620021B4 Halbleitervorrichtung des Grabentyps The semiconductor device of grave type |
| 06/02/2005 | DE19525388B4 Elektronikbauteil mit anodisch gebondetem Leiterrahmen Electronic component having an anodically Bonded lead frame |
| 06/02/2005 | DE10353139A1 Packagesystem für modulare Systemaufbauten Package System for modular system structures |
| 06/02/2005 | DE10352805A1 Cooling device for computer electronic component has mounting bracket that fits closely next to heat sink body so that air guidance element can be closely attached |
| 06/02/2005 | DE10352079A1 Elektromotor, sowie Verfahren zur Herstellung eines solchen Electric motor, as well as methods for producing such |
| 06/02/2005 | DE10351196A1 Anodisch mit Silizium bondbare Glaskeramik (LTCC) Anodically bondable with silicon glass-ceramic (LTCC) |
| 06/02/2005 | DE10349908A1 Power semiconductor component with a MESA structure used as a diode for a rectifier comprises a semiconductor body with a first zone of a first conducting type and a second zone of a second conducting type |
| 06/02/2005 | DE10349839A1 Electrical structural element including a conductive plate with at least one light emitting diode and enclosed by transparent synthetic plastic housing useful in electrical technology |
| 06/02/2005 | DE10348620A1 Halbleitermodul mit Gehäusedurchkontakten Semiconductor module with a housing contacts |
| 06/02/2005 | DE10348446A1 Protection circuit against electrostatic discharge (ESD) with connection of input/output pad of integrated circuit to internal circuit unit, to which are coupled two protection circuit parts |
| 06/02/2005 | DE102004053680A1 Hybridbeleuchtungskörper Hybrid Lighting |
| 06/02/2005 | DE102004052653A1 Halbleitervorrichtung mit Metallplatten und Halbleiterchip A semiconductor device having metal plates and the semiconductor chip |
| 06/02/2005 | DE102004050027A1 Wafer level package for chip, i.e. dynamic random access memory, comprises chip bonded to fiber reinforced synthetic resin sheet and polymer coating on edges of chip and resin sheet |
| 06/02/2005 | DE102004047007A1 Keramiksubstrat für elektronische Dünnschichtbauelemente, Verfahren für das Herstellen des Substrats und elektronisches Dünnschichtbauelement unter Verwendung des Substrats Ceramic substrates for electronic thin film device, method for manufacturing the substrate and electronic thin film device using the substrate |
| 06/02/2005 | DE102004044149A1 Hochleistungs-Leuchtdiodenvorrichtung High performance light emitting diode device |
| 06/02/2005 | DE102004025908A1 Halbleitervorrichtung Semiconductor device |
| 06/02/2005 | DE10162676B4 Elektronisches Bauteil mit einem Halbleiterchip und einer Umverdrahtungsplatte und Systemträger für mehrere elektronische Bauteile sowie Verfahren zur Herstellung derselben Electronic component having a semiconductor chip and a system carrier for a plurality of rewiring and electronic components as well as method of producing same |
| 06/02/2005 | DE10021907B4 Brennstoffzellensystem mit einem Brennstoffzellenstapel mit integrierter Verpolschutzdiode Fuel cell system with a fuel cell stack with integrated reverse polarity protection diode |
| 06/02/2005 | CA2546810A1 Method for controlling the hermeticity of a closed cavity of a micrometric component, and micrometric component for the implementation thereof |
| 06/01/2005 | EP1536676A2 Cooling device for cooling heat-generating part comprising electric components |
| 06/01/2005 | EP1536673A1 Composite multi-layer substrate and module using the substrate |
| 06/01/2005 | EP1536478A2 Solid state imaging device and producing method thereof |
| 06/01/2005 | EP1536469A1 Semiconductor device with connecting bumps |
| 06/01/2005 | EP1536468A2 Cooling system for cooling electric component installed in computer system |
| 06/01/2005 | EP1536467A2 Retaining member and heat conducting member for electronic apparatus |
| 06/01/2005 | EP1536466A2 Carrier substrate for semiconductor multilayer strcuture and method of manufacturing semiconductor chips |
| 06/01/2005 | EP1536433A1 High frequency thin film electrical circuit element |
| 06/01/2005 | EP1536313A2 Thermal solution for electronic devices |
| 06/01/2005 | EP1535880A1 Particulate aluminum nitride and method for production thereof |
| 06/01/2005 | EP1535730A1 Layered arrangement and composite material for electromechanical articles |
| 06/01/2005 | EP1535341A1 Enhanced structure and method for buried local interconnects |
| 06/01/2005 | EP1535331A2 Chip stack with intermediate cavity |
| 06/01/2005 | EP1535330A1 Mram mtj stack to conductive line alignment method |
| 06/01/2005 | EP1535329A1 Buried digit line stack and process for making same |
| 06/01/2005 | EP1535328A2 Integrated circuit comprising intermediate materials and corresponding components |
| 06/01/2005 | EP1535327A1 Method and apparatus for electronically aligning capacitively coupled chip pads |
| 06/01/2005 | EP1535325A1 Method of preventing shift of alignment marks during rapid thermal processing |
| 06/01/2005 | EP1535315A1 Glass-type planar substrate, use thereof, and method for the production thereof |
| 06/01/2005 | EP1534788A1 Electrodepositable dielectric coating compositions to coat a substrate and methods to form dielectric coating |
| 06/01/2005 | EP1534632A1 Anomalous expansion materials |
| 06/01/2005 | EP1534624A1 Microchip with thermal stress relief means |
| 06/01/2005 | EP1534513A1 Laminated glazing panel |
| 06/01/2005 | EP1421618B1 Power electronics component |
| 06/01/2005 | EP1375688B1 Heat dissipation member for electronic apparatus and method for producing the same |
| 06/01/2005 | EP1130041B1 Epoxy resin composition and semiconductor device |
| 06/01/2005 | EP1125482B1 Stacked circuit board assembly adapted for heat dissipation |
| 06/01/2005 | EP1116424B1 Electronic assembly comprising a sole plate forming a heat sink |
| 06/01/2005 | EP1115781B1 Salt-modified electrostatic dissipative polymers |
| 06/01/2005 | EP0898857A4 Method for connecting area grid arrays to printed wire board |
| 06/01/2005 | CN1623232A RF amplifier |
| 06/01/2005 | CN1623231A 冷却装置 Cooling device |
| 06/01/2005 | CN1623230A Carbon nanotube thermal interface structures |
| 06/01/2005 | CN1623229A High-frequency module and its manufacturing method |
| 06/01/2005 | CN1623228A Interconnect structures containing conductive electrolessly deposited etch stop layers, liner layers, and via plugs |
| 06/01/2005 | CN1623132A Cooling unit for cooling heat generating component |
| 06/01/2005 | CN1623097A Scatterometry structure with embedded ring oscillator, and methods of using same |
| 06/01/2005 | CN1622879A 改进的热界面材料 Improved thermal interface material |
| 06/01/2005 | CN1622749A 电子设备和电路模块设备 Electronic devices and circuit modules equipment |
| 06/01/2005 | CN1622745A Thermal solution for electronic devices |
| 06/01/2005 | CN1622356A Electronic heat pump device, laser component, optical pickup and electronic equipment |
| 06/01/2005 | CN1622338A Thin film transistor, method of fabricating the same, and flat panel display using thin film transistor |
| 06/01/2005 | CN1622337A Thin film transistor and method of manufacturing the same |
| 06/01/2005 | CN1622334A Solid state imaging device and producing method thereof |
| 06/01/2005 | CN1622328A Semiconductor device and fabrication method thereof |
| 06/01/2005 | CN1622327A Optical semiconductor element and electronic device using the optical semiconductor element |
| 06/01/2005 | CN1622326A Offset-bonded, multi-chip semiconductor device |
| 06/01/2005 | CN1622325A Electrostatic discharge protection device for high-voltage integrated circuit |
| 06/01/2005 | CN1622324A 集成电路芯片 IC chip |
| 06/01/2005 | CN1622323A Partial inter-locking metal contact structure for semiconductor devices and method of manufacture |
| 06/01/2005 | CN1622322A Stabilizing copper overlayer for enhanced C4 interconnect reliability |
| 06/01/2005 | CN1622321A Semiconductor device and manufacturing method the same |
| 06/01/2005 | CN1622320A Semiconductor device and method of manufacturing the same |
| 06/01/2005 | CN1622319A Wafer radiating element |
| 06/01/2005 | CN1622318A Manufacturing method and structure for radiator |
| 06/01/2005 | CN1622317A Chip radiating element |
| 06/01/2005 | CN1622316A Radiating module mechanism |
| 06/01/2005 | CN1622315A High performance chip carrier substrate |
| 06/01/2005 | CN1622293A 半导体器件 Semiconductor devices |
| 06/01/2005 | CN1622286A Photolithography evaluating method and photolithography process |
| 06/01/2005 | CN1622284A Method for forming inductor of semiconductor device |
| 06/01/2005 | CN1622282A Method for forming alignment pattern of semiconductor device |
| 06/01/2005 | CN1622001A Hot plug fan and coupling device thereof |
| 06/01/2005 | CN1621925A Semiconductor chip, tape carrier package having the same mounted thereon, and liquid crystal display apparatus including the tape carrier package |
| 06/01/2005 | CN1621572A Electroplating clamp and electrolytic plating device for electronic parts |
| 06/01/2005 | CN1621482A Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same |
| 06/01/2005 | CN1621481A Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same |
| 06/01/2005 | CN1621479A Epoxy resin composition for semiconductor packaging and its preparation |
| 06/01/2005 | CN1621448A Silicon rubber composition for electrode circuit protection, electrode circuit protection material and electric, electronic parts |
| 06/01/2005 | CN1204797C Radiator for electronic component |
| 06/01/2005 | CN1204796C Semiconductor component fixed on cooler |