Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2005
06/15/2005CN1626703A Electrolytic copper-stripping liquid and electrolytic stripping method
06/15/2005CN1206892C Method of applying phase change thermal interface material
06/15/2005CN1206807C Electron element packging method
06/15/2005CN1206732C Multiple chip module with integrated RF capabilities
06/15/2005CN1206731C Electrostatic discharge circuit suitable to bearing high roltage in high frequency and analogue
06/15/2005CN1206730C Semiconductor structure with embedded bus, and method for generating contact to embedded bus
06/15/2005CN1206729C Semiconductor device and its making process, circuit board and electronic instrument
06/15/2005CN1206728C Chip package and its making process
06/15/2005CN1206727C Chip package and its making process
06/15/2005CN1206726C Method of mfg. semiconductor device
06/15/2005CN1206259C Adhesive polyimide resin and adhesive laminate
06/14/2005US6906935 Inverter apparatus and method of manufacturing the same
06/14/2005US6906928 Electronic component with a semiconductor chip, and method of producing the electronic component
06/14/2005US6906923 Heat sink clip and method
06/14/2005US6906921 Channeled heat dissipation device and a method of fabrication
06/14/2005US6906901 Cooling apparatus for integrated circuit
06/14/2005US6906579 Optimal inductor management
06/14/2005US6906547 Conductive material for integrated circuit fabrication
06/14/2005US6906514 Concept for compensating the influences of external disturbing quantities on physical functional parameters of integrated circuits
06/14/2005US6906429 Semiconductor device and method of fabricating the same
06/14/2005US6906428 Electronic component having a semiconductor chip and method for populating a circuit carrier during the production of the electronic component
06/14/2005US6906426 Transceiver having shadow memory facilitating on-transceiver collection and communication of local parameters
06/14/2005US6906425 Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive
06/14/2005US6906424 Semiconductor package and method producing same
06/14/2005US6906422 Microelectronic elements with deformable leads
06/14/2005US6906421 Having stable metal oxide barrier layer that does not cause oxidation of titanium and prevents diffusion of oxygen from dielectric layer into conductive layer
06/14/2005US6906419 Semiconductor device having a wiring layer of damascene structure and method for manufacturing the same
06/14/2005US6906418 Semiconductor component having encapsulated, bonded, interconnect contacts
06/14/2005US6906417 Ball grid array utilizing solder balls having a core material covered by a metal layer
06/14/2005US6906415 Semiconductor device assemblies and packages including multiple semiconductor devices and methods
06/14/2005US6906414 Heat spreading; electrical performance
06/14/2005US6906413 Integrated heat spreader lid
06/14/2005US6906411 Multilayer substrate module and portable wireless terminal
06/14/2005US6906410 Semiconductor device and method for manufacturing same
06/14/2005US6906409 Multichip semiconductor package
06/14/2005US6906406 Multiple dice package
06/14/2005US6906405 Electronic part and its manufacturing method
06/14/2005US6906404 Power module with voltage overshoot limiting
06/14/2005US6906403 Sealed electronic device packages with transparent coverings
06/14/2005US6906402 High permeability thin films and patterned thin films to reduce noise in high speed interconnections
06/14/2005US6906396 Magnetic shield for integrated circuit packaging
06/14/2005US6906387 Method for implementing electro-static discharge protection in silicon-on-insulator devices
06/14/2005US6906386 Testable electrostatic discharge protection circuits
06/14/2005US6906374 Semiconductor device
06/14/2005US6906370 Semiconductor component having a material reinforced contact area
06/14/2005US6906259 High frequency module
06/14/2005US6905980 Semiconductor device and method of manufacturing same
06/14/2005US6905979 Apparatus and method for improving AC coupling on circuit boards
06/14/2005US6905961 Land grid array stiffener for use with flexible chip carriers
06/14/2005US6905954 Method for producing a semiconductor device and corresponding semiconductor device
06/14/2005US6905953 Selective passivation of exposed silicon
06/14/2005US6905951 Method of forming a device substrate and semiconductor package including a pyramid contact
06/14/2005US6905946 Thin flip-chip method
06/14/2005US6905938 Method of forming interconnect structure with low dielectric constant
06/14/2005US6905925 Method of forming a low inductance high capacitance capacitor
06/14/2005US6905917 Thin film transistor array panel for liquid crystal display and method for manufacturing the same
06/14/2005US6905915 Semiconductor device and method of manufacturing the same, and electronic instrument
06/14/2005US6905914 Wafer level package and fabrication method
06/14/2005US6905913 Semiconductor device and method of manufacturing same
06/14/2005US6905912 Semiconductor device and method for fabricating the same
06/14/2005US6905911 Semiconductor device, method for manufacturing an electronic equipment, electronic equipment, and portable information terminal
06/14/2005US6905910 Method of packaging an optical sensor
06/14/2005US6905897 Wafer acceptance testing method and structure of a test key used in the method
06/14/2005US6905893 Method and structure for determining a concentration profile of an impurity within a semiconductor layer
06/14/2005US6905892 Operating method for a semiconductor component
06/14/2005US6905768 Epoxy resin composition and electronic part
06/14/2005US6905757 Dielectric filler containing resin for use in formation of built-in capacitor layer of printed wiring board and double-sided copper clad laminate with dielectric layer formed using the same dielectric filler containing resin, and production method of double-sided copper clad laminate
06/14/2005US6905726 Component having at least two mutually adjacent insulating layers and corresponding production method
06/14/2005US6905361 Electrical device
06/14/2005US6904675 Method of forming electrical interconnects having electromigration-inhibiting plugs
06/14/2005US6904674 Producing a printed wiring board suitable as an interposer of chip size packages for electrically connecting a semiconductor chip to an external printed wiring board
06/14/2005US6904650 Unlocking mechanism
06/09/2005WO2005053371A1 Flat plate heat transfer device
06/09/2005WO2005053366A1 Electric circuit arrangement
06/09/2005WO2005053122A1 Heat sink for a pulsed laser diode bar with optimized thermal time constant
06/09/2005WO2005053114A1 Socket for electric component
06/09/2005WO2005053091A1 Fabrication of ltcc t/r modules wih multiple cavities and an integrated ceramic ring frame
06/09/2005WO2005053028A1 Semiconductor device comprising electrostatic breakdown protection element
06/09/2005WO2005053026A1 Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same
06/09/2005WO2005053025A1 Semiconductor integrated circuit device
06/09/2005WO2005053023A1 Ultra-thin semiconductor circuit having contact bumps and corresponding production method
06/09/2005WO2005053022A1 Direct contact fluid cooling for semiconductor device
06/09/2005WO2005053021A2 Thermal interface and method of making the same
06/09/2005WO2005053012A1 Method for galvanising and forming a contact boss
06/09/2005WO2005053008A1 Method for forming insulating film, system for forming insulating film, and method for manufacturing semiconductor device
06/09/2005WO2005052999A2 Decoupling circuit for co-packaged semiconductor devices
06/09/2005WO2005052990A2 Semiconductor device with magneticaly permeable heat sink
06/09/2005WO2005052961A1 High frequency thin film electrical circuit element
06/09/2005WO2005052705A1 Circuit substrate manufacturing method and system, substrate used for the same, and circuit substrate using the same
06/09/2005WO2005052179A2 Method of making carbon nanotube arrays, and thermal interfaces using same
06/09/2005WO2005042426A3 Glass-ceramic (ltcc) capable of being assembled with silicon by anodic bonding
06/09/2005WO2005027196A3 Radiation shielded semiconductor device package
06/09/2005WO2005001928A3 Capacitor-related systems for addressing package/motherboard resonance
06/09/2005WO2004102659A3 Composite material, electrical circuit or electric module
06/09/2005US20050125751 Method of incorporating interconnect systems into an integrated circuit process flow
06/09/2005US20050125184 Method and apparatus for monitoring integrated circuit fabrication
06/09/2005US20050124785 Microelectronics; molding integrated circuits; using phase transfer catalyst
06/09/2005US20050124232 Semiconductor packaging
06/09/2005US20050124197 Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment
06/09/2005US20050124186 Electronic device having adapter and connection method thereof
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