Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2005
06/01/2005CN1204793C A printed circuit board assembly with improved bypass decoupling for BGA packages
06/01/2005CN1204790C Lead frame and manufacture method thereof, and manufacture method of heat-conducting substrate
06/01/2005CN1204622C Semiconductor device and manufacture method thereof
06/01/2005CN1204611C Tape for semiconductor device with adhesive and copper-clad laminate sheet using it
06/01/2005CN1204610C Method for manufacturing parts after installation of electronic element and manufacturing device thereof
06/01/2005CN1204607C Method for depositing diffusion barrier
05/2005
05/31/2005US6901566 Semiconductor integrated circuit having a plurality of circuit regions where different power supply voltages are used and method of manufacturing the same
05/31/2005US6901564 System and method for product yield prediction
05/31/2005US6901004 High voltage switch circuitry
05/31/2005US6900991 Electronic assembly with sandwiched capacitors and methods of manufacture
05/31/2005US6900990 Electronic apparatus provided with liquid cooling type cooling unit cooling heat generating component
05/31/2005US6900989 Flexible printed wiring board with semiconductor chip and releasing layer
05/31/2005US6900987 Stack up assembly
05/31/2005US6900986 Power module
05/31/2005US6900985 Heat sink clip with pressing cam
05/31/2005US6900767 IC card
05/31/2005US6900655 Determination of whether integrated circuit is acceptable or not in wafer-level burn-in test
05/31/2005US6900654 Method and apparatus for evaluating a known good die using both wire bond and flip-chip interconnects
05/31/2005US6900551 Semiconductor device with alternate bonding wire arrangement
05/31/2005US6900550 Semiconductor device including adhesive agent layer with embedded conductor bodies
05/31/2005US6900549 Semiconductor assembly without adhesive fillets
05/31/2005US6900548 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
05/31/2005US6900546 Semiconductor memory device and method for manufacturing the same
05/31/2005US6900545 Variable thickness pads on a substrate surface
05/31/2005US6900544 Integrated circuit package and printed circuit board arrangement
05/31/2005US6900542 Semiconductor device having increased adhesion between a barrier layer for preventing copper diffusion and a conductive layer, and method of manufacturing the same
05/31/2005US6900541 Semiconductor chip capable of implementing wire bonding over active circuits
05/31/2005US6900540 Simulating diagonal wiring directions using Manhattan directional wires
05/31/2005US6900539 Having via holes/metals improved in terms of reliability therein for connecting upper and lower interconnect layers to each other
05/31/2005US6900538 Integrating chip scale packaging metallization into integrated circuit die structures
05/31/2005US6900537 High power silicon carbide and silicon semiconductor device package
05/31/2005US6900536 Method for producing an electrical circuit
05/31/2005US6900535 BGA/LGA with built in heat slug/spreader
05/31/2005US6900534 Direct attach chip scale package
05/31/2005US6900533 Apparatus for routing electrical signals
05/31/2005US6900532 Wafer level chip scale package
05/31/2005US6900531 Image sensor device
05/31/2005US6900530 Stacked IC
05/31/2005US6900528 Stacked mass storage flash memory package
05/31/2005US6900527 Lead-frame method and assembly for interconnecting circuits within a circuit module
05/31/2005US6900526 Semiconductor device package
05/31/2005US6900525 Semiconductor package having filler metal of gold/silver/copper alloy
05/31/2005US6900524 Resin molded semiconductor device on a lead frame and method of manufacturing the same
05/31/2005US6900516 Semiconductor fuse device
05/31/2005US6900515 Use of DAR coating to modulate the efficiency of laser fuse blows
05/31/2005US6900511 Optoelectronic component and method for producing it
05/31/2005US6900509 Optical receiver package
05/31/2005US6900501 Silicon on insulator device with improved heat removal
05/31/2005US6900487 Wiring layer structure for ferroelectric capacitor
05/31/2005US6900479 Stochastic assembly of sublithographic nanoscale interfaces
05/31/2005US6900476 Light-emitting semiconductor component
05/31/2005US6900395 Enhanced high-frequency via interconnection for improved reliability
05/31/2005US6900383 Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces
05/31/2005US6900284 Poly-o-hydroxyamides, polybenzoxazoles, processes for producing poly-o-hydroxyamides, processes for producing polybenzoxazoles, dielectrics including a polybenzoxazole, electronic components including the dielectrics, and processes for manufacturing the electronic components
05/31/2005US6900163 Dry thermal interface material
05/31/2005US6900131 Method of manufacturing semiconductor device
05/31/2005US6900119 Agglomeration control using early transition metal alloys
05/31/2005US6900116 High permeability thin films and patterned thin films to reduce noise in high speed interconnections
05/31/2005US6900110 Chip scale package with compliant leads
05/31/2005US6900087 Symmetric inducting device for an integrated circuit having a ground shield
05/31/2005US6900084 Semiconductor device having a display device
05/31/2005US6900080 Microelectronic package with reduced underfill and methods for forming such packages
05/31/2005US6900078 Tape stiffener, semiconductor device component assemblies including same, and stereolithographic methods for fabricating same
05/31/2005US6900077 Methods of forming board-on-chip packages
05/31/2005US6900076 Methods for manufacturing semiconductor chips, methods for manufacturing semiconductor devices, semiconductor chips, semiconductor devices, connection substrates and electronic devices
05/31/2005US6900075 Mixed LVR and HVR reticle set design for the processing of gate arrays, embedded arrays and rapid chip products
05/31/2005US6900074 Method of manufacturing a semiconductor device having plural semiconductor chips, wherein electrodes of the semiconductor chips are electrically connected together via wiring substrates of the semiconductor chips
05/31/2005US6900073 Fast firing flattening method and apparatus for sintered multilayer ceramic electronic substrates
05/31/2005US6900065 Apparatus and method for enhanced voltage contrast analysis
05/31/2005US6899960 Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material
05/31/2005US6899543 Test structure for determining the electrical loadability of contacts
05/31/2005US6899534 Mold assembly for a package stack via bottom-leaded plastic (blp) packaging
05/31/2005US6899165 Structure of a heat-pipe cooler
05/31/2005US6899164 Heat sink with guiding fins
05/31/2005US6898848 Method of bonding inner leads to chip pads
05/31/2005US6898845 Method for manufacturing hybrid electronic circuits for active implantable medical devices
05/26/2005WO2005048667A1 Conductive paste and multilayer ceramic substrate
05/26/2005WO2005048664A2 High temperature circuits
05/26/2005WO2005048422A1 High-frequency signal transmitting optical module and method of fabricating the same
05/26/2005WO2005048410A1 Land grid socket connector
05/26/2005WO2005048352A1 Trench gate field effect devices
05/26/2005WO2005048347A2 Power module
05/26/2005WO2005048346A2 A cooling system for an electronic component
05/26/2005WO2005048345A1 Package system for modular superstructures and method for producing package systems
05/26/2005WO2005048344A2 Diode
05/26/2005WO2005048323A2 Detachable on package voltage regulation module
05/26/2005WO2005048316A2 Teardrop shaped lead frames
05/26/2005WO2005048314A2 Tapered dielectric and conductor structures and applications thereof
05/26/2005WO2005048311A2 Bump-on-lead flip chip interconnection
05/26/2005WO2005048307A2 Flip chip interconnection pad layout
05/26/2005WO2005048304A2 Structure and programming of laser fuse
05/26/2005WO2005048302A2 Method for integrating pre-fabricated chip structures into functional electronic systems
05/26/2005WO2005048298A2 Sandwiched thermal solution
05/26/2005WO2005048262A2 Mram architecture with a flux closed data storage layer
05/26/2005WO2005010937A3 Packaging of semiconductor devices for incrased reliability
05/26/2005WO2004081992A3 Semiconductor wafer with non-rectangular shaped dice
05/26/2005WO2004068551A3 Patterning layers comprised of spin-on ceramic films
05/26/2005US20050114816 Parallel design processes for integrated circuits
05/26/2005US20050114613 Multi-chip package type memory system
05/26/2005US20050113895 Medical device and method of manufacturing
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