Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2005
05/26/2005US20050113472 thermosetting dielectric containing porogen (comprises vinylanisole units) and N-vinylpyrrolidone units for electronics/integrated circuits; planarization
05/26/2005US20050113016 Airflow guide structure and manufacture thereof
05/26/2005US20050112957 Partial inter-locking metal contact structure for semiconductor devices and method of manufacture
05/26/2005US20050112932 Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation
05/26/2005US20050112907 Gas-assisted rapid thermal processing
05/26/2005US20050112905 Sealing method for electronic devices formed on a common semiconductor substrate and corresponding circuit structure
05/26/2005US20050112880 Selective plating of package terminals
05/26/2005US20050112879 Insulation film etching method
05/26/2005US20050112877 Method of manufacturing a semiconductor device
05/26/2005US20050112871 Multilevel copper interconnect with double passivation
05/26/2005US20050112867 Semiconductor device and manufacturing method thereof
05/26/2005US20050112866 Semiconductor device and method of manufacturing the same
05/26/2005US20050112864 Back End Interconnect With a Shaped Interface
05/26/2005US20050112863 Method for fabricating semiconductor device
05/26/2005US20050112862 Crystallographic Modification of Hard mask Properties
05/26/2005US20050112861 Roughened bonding pad and bonding wire surfaces for low pressure wire bonding
05/26/2005US20050112842 Integrating passive components on spacer in stacked dies
05/26/2005US20050112838 Method for forming inductor of semiconductor device
05/26/2005US20050112836 MIM capacitor structure and method of fabrication
05/26/2005US20050112816 Self-aligned electrodes contained within the trenches of an electroosmotic pump
05/26/2005US20050112804 Silicide-silicon oxide-semiconductor antifuse device and method of making
05/26/2005US20050112803 Semiconductor device and its manufacturing method, and semiconductor device manufacturing system
05/26/2005US20050112802 System and method for improved auto-boating
05/26/2005US20050112800 Semiconductor device and method of fabricating the same
05/26/2005US20050112799 Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding
05/26/2005US20050112798 Electronics circuit manufacture
05/26/2005US20050112797 Wiring base, semiconductor device manufacturing method thereof and electronic equipment
05/26/2005US20050112796 Semiconductor package heat spreaders and fabrication methods therefor
05/26/2005US20050112795 Novel encapsulation method for SBGA
05/26/2005US20050112794 Improved bond pad
05/26/2005US20050111797 Device package and methods for the fabrication and testing thereof
05/26/2005US20050111207 Package substrate for integrated circuit and method of making the substrate
05/26/2005US20050111197 Heat dissipation assembly
05/26/2005US20050111196 Fastening structure of heat sink
05/26/2005US20050111195 Heat dissipation mechanism for electronic apparatus
05/26/2005US20050111194 Heat radiating system and method for a mobile communication terminal
05/26/2005US20050111193 Clip for heat sink
05/26/2005US20050111192 Heat sink mounting apparatus
05/26/2005US20050111191 Locking device for heat dissipating device
05/26/2005US20050111190 Heat dissipating device having improved fastening structure
05/26/2005US20050111189 Thermal solution for electronic devices
05/26/2005US20050111188 Thermal management device for an integrated circuit
05/26/2005US20050111157 Decoupling circuit for co-packaged semiconductor devices
05/26/2005US20050110935 Semiconductor chip, tape carrier package having the same mounted thereon, and liquid crystal display apparatus including the tape carrier package
05/26/2005US20050110889 Packaged microelectronic imagers and methods of packaging microelectronic imagers
05/26/2005US20050110608 Trimmer impedance component, semiconductor device and trimming method
05/26/2005US20050110543 Digital signal transmission circuit and method of designing it
05/26/2005US20050110509 Contactor having conductive particles in a hole as a contact electrode
05/26/2005US20050110169 Semiconductor device and method of making the same
05/26/2005US20050110168 Low coefficient of thermal expansion (CTE) semiconductor packaging materials
05/26/2005US20050110167 Routing scheme for differential pairs in flip chip substrates
05/26/2005US20050110165 Semiconductor chip, semiconductor device, circuit board, and electronic instrument
05/26/2005US20050110164 Bump-on-lead flip chip interconnection
05/26/2005US20050110162 Electronic component having at least one semiconductor chip and flip-chip contacts, and method for producing the same
05/26/2005US20050110161 Method for mounting semiconductor chip and semiconductor chip-mounted board
05/26/2005US20050110160 Semiconductor module and method for forming the same
05/26/2005US20050110159 Stacked integrated circuit device including multiple substrates and method of manufacturing the same
05/26/2005US20050110158 Semiconductor device and method of manufacturing the same, circuit board, and electronic apparatus
05/26/2005US20050110157 Device package and method for the fabrication and testing thereof
05/26/2005US20050110156 Wafer level packages for chips with sawn edge protection
05/26/2005US20050110155 Semiconductor device and method of manufacturing the same, circuit board and electronic device
05/26/2005US20050110154 Semiconductor device
05/26/2005US20050110153 dielectric ceramic also comprises cobalt oxide or neodymium oxide as colorant; for controlling a light transmittance of a visible light of certain wavelength emitted from a phosphor in the plasma display panel
05/26/2005US20050110151 Semiconductor device
05/26/2005US20050110150 Semiconductor device and PLL circuit
05/26/2005US20050110149 Semiconductor multilayer wiring board and method of forming the same
05/26/2005US20050110148 Fuse stucture
05/26/2005US20050110147 Method for forming a multi-layer seed layer for improved Cu ECP
05/26/2005US20050110146 Method for combining via patterns into a single mask
05/26/2005US20050110145 Multilayer metallization
05/26/2005US20050110144 Integrated circuits; damascene structure; controlling thickness; electroconductive material embedded into dielectrics; tantalum nitride lining
05/26/2005US20050110143 Capacitor of semiconductor device applying damascene process and method of fabricating the same
05/26/2005US20050110142 Diffusion barriers formed by low temperature deposition
05/26/2005US20050110141 Semiconductor device, its manufacturing method, circuit board, and electronic unit
05/26/2005US20050110140 Heat spreader ball grid array (HSBGA) design for low-k integrated circuits (IC)
05/26/2005US20050110139 Customized microelectronic device and method for making customized electrical interconnections
05/26/2005US20050110138 High Speed Electrical On-Chip Interconnects and Method of Manufacturing
05/26/2005US20050110137 Plastic dual-in-line packaging (PDIP) having enhanced heat dissipation
05/26/2005US20050110136 Multi-concentric pad arrangements for integrated circuit pads
05/26/2005US20050110135 Module assembly and method for stacked BGA packages
05/26/2005US20050110134 Electronic circuit unit with semiconductor components disposed on both surfaces of board
05/26/2005US20050110132 Semiconductor device
05/26/2005US20050110131 Vertical wafer stacking using an interposer
05/26/2005US20050110130 Semiconductor integrated circuit wiring design method and semiconductor integrated circuit
05/26/2005US20050110128 Highly reliable stack type semiconductor package
05/26/2005US20050110127 Semiconductor device
05/26/2005US20050110126 Chip adhesive
05/26/2005US20050110125 Overlap stacking of center bus bonded memory chips for double density and method of manufacturing the same
05/26/2005US20050110124 Wafer level package having a side package
05/26/2005US20050110122 System and method for improved auto-boating
05/26/2005US20050110121 Lead frame, resin-encapsulated semiconductor device, and method of producing the same
05/26/2005US20050110120 Scribe line structure of wafer
05/26/2005US20050110119 Integrated circuit chip
05/26/2005US20050110118 Scribe seal providing enhanced substrate noise isolation
05/26/2005US20050110116 Semiconductor device having SOI construction
05/26/2005US20050110113 Anti-fuse structure employing metal silicide/doped polysilicon laminate
05/26/2005US20050110112 Encapsulated chip and procedure for its manufacture
05/26/2005US20050110109 Semiconductor device manufacturing method and semiconductor device manufactured by such manufacturing method
05/26/2005US20050110107 Solid state imaging device and producing method thereof
05/26/2005US20050110100 Semiconductor device
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