Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2005
05/19/2005WO2005045381A1 An integrated thermal sensor for microwave transistors
05/19/2005WO2005045333A1 Expansion tank device, process for fabricating expansion tank device, and liquid cooling radiator
05/19/2005WO2005044899A1 Prepolymer, prepolymer composition, high molecular weight polymer having structure containing hole and electrically insulating film
05/19/2005WO2005044451A1 Electrical connection of components
05/19/2005WO2005033235A3 Heat dissipating adhesive tape
05/19/2005WO2005029557A3 Fuse structure for maintaining passivation integrity
05/19/2005WO2005027193A3 Embedded toroidal inductors
05/19/2005WO2004077547A3 Internal connection system for power semiconductors comprising large-area terminals
05/19/2005WO2004077546A3 Self-supporting contacting structures that are directly produced on components without housings
05/19/2005WO2004061952A3 Method of forming a multi-layer semiconductor structure having a seamless bonding interface
05/19/2005WO2004030039A3 Apparatus and method of using thin film material as diffusion barrier for metallization
05/19/2005US20050108673 CAD method for arranging via-holes, a CAD tool, photomasks produced by the CAD method, a semiconductor integrated circuit manufactured with photomasks and a computer program product for executing the CAD method
05/19/2005US20050107242 Zeolite-carbon doped oxide composite low k dielectric
05/19/2005US20050107055 Integrated switchless programmable attenuator and low noise amplifier
05/19/2005US20050106904 Connector and method of manufacturing the same
05/19/2005US20050106902 Interposer with electrical contact button and method
05/19/2005US20050106881 Wafer reuse techniques
05/19/2005US20050106855 Method for fabricating a semiconductor component using contact printing
05/19/2005US20050106852 Air gap interconnect structure and method
05/19/2005US20050106851 Wire bonding process for copper-metallized integrated circuits
05/19/2005US20050106848 System and method for stress free conductor removal
05/19/2005US20050106845 Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same
05/19/2005US20050106834 Method and apparatus for filling vias
05/19/2005US20050106823 MOSFET structure and method of fabricating the same
05/19/2005US20050106786 Method of manufacturing a semiconductor device
05/19/2005US20050106783 Method of fabricating lead frame and method of fabricating semiconductor device using the same, and lead frame and semiconductor device using the same
05/19/2005US20050106781 Method of manufacturing semiconductor device, semiconductor device, circuit board, and electronic instrument
05/19/2005US20050106780 Semiconductor/printed circuit board assembly, and computer system
05/19/2005US20050106779 Techniques for packaging multiple device components
05/19/2005US20050106777 Frame for semiconductor package
05/19/2005US20050106764 Test pattern for reliability measurement of copper interconnection line having moisture window and method for manufacturing the same
05/19/2005US20050106504 Photoimaged dielectric polymer and film, and circuit package containing the same
05/19/2005US20050106480 Mask, exposure method, line width measuring method, and method for manufacturing semiconductor devices
05/19/2005US20050106408 features separated by distance bridged by tin whisker; silver or silver alloy layer coating at least one surface of features; fine grain tin or tin alloy layer directly coating silver layer; silver phase is beneficial to minimize increase in resistivity due to oxidation of fretting wear debris
05/19/2005US20050106371 Injector module and air control module used in conjunction to infuse micro air bubbles into pulp slurry to optimize separating ink and other floatable contaminants by negatively pressurizing slurry as it accelerates through injector drawing air from module, forming bubbles to which contaminants cling
05/19/2005US20050106369 Thick film conductor case compositions for LTCC tape
05/19/2005US20050106366 Biocompatibility protective coating; dielectrics; prevent current leakage
05/19/2005US20050106059 Controlled melting; silver with silver or copper; reduced expansion; stress relieving
05/19/2005US20050105792 Enhanced uniqueness for pattern recognition
05/19/2005US20050105365 Repair fuse box of semiconductor device
05/19/2005US20050105277 Power unit comprising a heat sink, and assembly method
05/19/2005US20050105275 Universal heat sink retention module frame
05/19/2005US20050105274 Method for reducing the thermal resistance of a heat dissipating base and a heat dissipating base using the same
05/19/2005US20050105272 Micropin heat exchanger
05/19/2005US20050105225 Microtransformer for system-on-chip power supply
05/19/2005US20050104792 High frequency package
05/19/2005US20050104679 Power amplifier device
05/19/2005US20050104620 Semiconductor device
05/19/2005US20050104525 Reducing apparatus and method
05/19/2005US20050104512 Thermionic vacuum diode device with adjustable electrodes
05/19/2005US20050104481 Crystal unit
05/19/2005US20050104230 Chip mounting device and method of calibrating the device
05/19/2005US20050104229 Semiconductor device having align key and method of fabricating the same
05/19/2005US20050104228 Microelectronic devices, methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
05/19/2005US20050104227 Substrate-based package for integrated circuits
05/19/2005US20050104226 Wafer level chip scale packaging structure and method of fabricating the same
05/19/2005US20050104225 Conductive bumps with insulating sidewalls and method for fabricating
05/19/2005US20050104224 Bond pad for flip chip package
05/19/2005US20050104223 Conductive bumps with non-conductive juxtaposed sidewalls and method for fabricating
05/19/2005US20050104222 Flip chip device having supportable bar and mounting structure thereof
05/19/2005US20050104221 High wireability microvia substrate
05/19/2005US20050104220 Semiconductor device and its manufacture method capable of preventing short circuit of electrodes when semiconductor device is mounted on sub-mount substrate
05/19/2005US20050104219 Intermediate chip module, semiconductor device, circuit board, and electronic device
05/19/2005US20050104218 High frequency circuit chip and method of producing the same
05/19/2005US20050104217 Seedless wirebond pad plating
05/19/2005US20050104216 Electroplated CoWP composite structures as copper barrier layers
05/19/2005US20050104215 Barrier layers for tin-bearing solder joints
05/19/2005US20050104214 Flexible metal stacked body
05/19/2005US20050104213 Electric connection terminal and method of manufacturing the same, semiconductor device and method of mounting the same
05/19/2005US20050104212 Mounting structure for semiconductor parts and semiconductor device
05/19/2005US20050104211 Semiconductor device having semiconductor chips mounted on package substrate
05/19/2005US20050104210 Use of palladium in IC manufacturing with conductive polymer bump
05/19/2005US20050104209 Semiconductor chip package having decoupling capacitor and manufacturing method thereof
05/19/2005US20050104208 Stabilizing copper overlayer for enhanced c4 interconnect reliability
05/19/2005US20050104207 Corrosion-resistant bond pad and integrated device
05/19/2005US20050104206 Mounting structure in integrated circuit module
05/19/2005US20050104205 Substrate for electrical device and methods of manufacturing the same
05/19/2005US20050104204 Wafer-level package and its manufacturing method
05/19/2005US20050104202 Semiconductor device
05/19/2005US20050104201 Heat spreader and semiconductor device package having the same
05/19/2005US20050104200 Micropin heat exchanger
05/19/2005US20050104198 Circuit device and manufacturing method thereof
05/19/2005US20050104197 Carbon-carbon and/or metal-carbon fiber composite heat spreaders
05/19/2005US20050104196 Semiconductor package
05/19/2005US20050104195 Heat spreader and semiconductor device package having the same
05/19/2005US20050104194 Heat sink is disposed above the chip for improving heat dissipation, especially for stack type chip package structure; semiconductor electronic devices; solving heat generation problem
05/19/2005US20050104193 Semiconductor device with magnetically permeable heat sink
05/19/2005US20050104192 Electronic device
05/19/2005US20050104191 Embedded microelectronic capacitor incorporating ground shielding layers and method for fabrication
05/19/2005US20050104190 Electronic module
05/19/2005US20050104189 Semiconductor device
05/19/2005US20050104188 Optimum padset for wire bonding rf technologies with high-q inductors
05/19/2005US20050104187 Redistribution of substrate interconnects
05/19/2005US20050104184 Semiconductor chip package and method
05/19/2005US20050104182 Stacked BGA packages
05/19/2005US20050104181 Wafer level stack structure for system-in-package and method thereof
05/19/2005US20050104180 Electronic device with reduced entrapment of material between die and substrate electrical connections
05/19/2005US20050104179 Methods and apparatus for packaging integrated circuit devices
05/19/2005US20050104177 Post passivation interconnection schemes on top of the IC chips
05/19/2005US20050104176 High temperature electronic devices
1 ... 1367 1368 1369 1370 1371 1372 1373 1374 1375 1376 1377 1378 1379 1380 1381 1382 1383 1384 1385 1386 1387 ... 2262