Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2005
06/28/2005US6911724 Integrated chip package having intermediate substrate with capacitor
06/28/2005US6911722 Resin-molded semiconductor device having posts with bumps
06/28/2005US6911721 Semiconductor device, method for manufacturing semiconductor device and electronic equipment
06/28/2005US6911720 Semiconductor device adhesive sheet with conductor bodies buried therein
06/28/2005US6911718 Double downset double dambar suspended leadframe
06/28/2005US6911714 Adhesion and/or encapsulation of silicon carbide-based semiconductor devices on ceramic substrates
06/28/2005US6911700 Semiconductor integrated circuit device including digital and analog circuits comprising electrostatic destruction protection circuits
06/28/2005US6911692 Semiconductor device
06/28/2005US6911683 Semiconductor integrated circuit device
06/28/2005US6911678 Glass-sealed light-emitting diode
06/28/2005US6911672 Method and apparatus for preparing a plurality of dice in wafers
06/28/2005US6911665 Superconducting integrated circuit and method for fabrication thereof
06/28/2005US6911624 Component installation, removal, and replacement apparatus and method
06/28/2005US6911622 Laser processing
06/28/2005US6911606 Electronic component for adhesion of a plurality of electrodes and method of mounting the same
06/28/2005US6911604 Bonding pads of printed circuit board capable of holding solder balls securely
06/28/2005US6911599 Header assembly for optoelectronic devices
06/28/2005US6911503 Curing agent composition for epoxy resins, epoxy resin composition and use thereof
06/28/2005US6911412 Carbon composite powders have a well-controlled microstructure, nanostructure and morphology having uniformly dispersed metal or metal oxide particles by heating an aerosol of precursors at low temperatures; fuel cells;
06/28/2005US6911405 Semiconductor device and method of manufacturing the same
06/28/2005US6911397 Method of forming dual damascene interconnection using low-k dielectric
06/28/2005US6911396 Method of producing metallic film
06/28/2005US6911394 Semiconductor devices and methods of manufacturing such semiconductor devices
06/28/2005US6911392 Process for making contact with and housing integrated circuits
06/28/2005US6911390 Fabrication method for an interconnect on a substrate
06/28/2005US6911389 Self aligned vias in dual damascene interconnect, buried mask approach
06/28/2005US6911387 Bump forming method and apparatus for heating and compressing bump materials inserted in positioning holes
06/28/2005US6911386 Integrated process for fuse opening and passivation process for CU/LOW-K IMD
06/28/2005US6911381 Boron incorporated diffusion barrier material
06/28/2005US6911371 Capacitor forming methods with barrier layers to threshold voltage shift inducing material
06/28/2005US6911360 Fuse and method for forming
06/28/2005US6911357 Method for wafer level testing of semiconductor using sacrificial on die power and ground metalization
06/28/2005US6911355 Semiconductor package having flex circuit with external contacts
06/28/2005US6911353 Semiconductor device and method of manufacturing same
06/28/2005US6911231 Superconducting having three basic layers
06/28/2005US6911229 Structure comprising an interlayer of palladium and/or platinum and method for fabrication thereof
06/28/2005US6910874 Semiconductors packages
06/28/2005US6910271 Mechanical highly compliant thermal interface pad
06/28/2005US6910268 An interconnect system employing a vertical signal path along an edge of an integrated circuit (IC) chip
06/28/2005CA2230065C Anti-tamper bond wire shield for an integrated circuit
06/23/2005WO2005057999A1 Method for constructing emi shielding around a component embedded in a circuit board
06/23/2005WO2005057656A1 Apparatus and arrangement for shielding a light emitting diode against electrostatic discharge
06/23/2005WO2005057655A1 Method and arrangement for shielding a component against electrostatic interference
06/23/2005WO2005057654A2 Wire-bonded semiconductor component with reinforced inner connection metallization
06/23/2005WO2005057653A1 High density integrated circuit package s and method of making same
06/23/2005WO2005057652A2 Connector for making electrical contact at semiconductor scales and method for forming same
06/23/2005WO2005057647A1 Silicone adhesive agent
06/23/2005WO2005057629A2 Assembly and adhesive layer for semiconductor components
06/23/2005WO2005057627A2 Manufacturing system and apparatus for balanced product flow with application to low-stress underfiling of flip-chip electronic devices
06/23/2005WO2005057626A2 System and method to reduce metal series resistance of bumped chip
06/23/2005WO2005057617A2 Bond wireless package
06/23/2005WO2005057591A1 Conductive paste for electrode layer of multilayer ceramic electronic component and method for producing multilayer unit for multilayer ceramic electronic component
06/23/2005WO2005056675A1 Dual-stage wafer applied underfills
06/23/2005WO2005031807A3 Wafer-level moat structures
06/23/2005WO2004064071A3 Tamper-resistant packaging and approach using magnetically-set data
06/23/2005WO2004063639A3 3-dimensional high performance heat sinks
06/23/2005WO2004061953A3 Method of forming a multi-layer semiconductor structure incorporating a processing handle member
06/23/2005WO2004061851A3 An improved method for making high-density nonvolatile memory
06/23/2005WO2004056162A8 Flip-chip mounting electronic component and method for producing the same, circuit board and method for producing the same, method for producing package
06/23/2005US20050138593 Semiconductor integrated circuit having diagonal wires, semiconductor integrated circuit layout method, and semiconductor integrated circuit layout design program
06/23/2005US20050138592 Apparatuses and methods to route line to line
06/23/2005US20050138577 Method, apparatus, and article of manufacture for manufacturing high frequency balanced circuits
06/23/2005US20050138317 Real-time feedback for policies for computing system management
06/23/2005US20050136826 Central processing unit cooling device
06/23/2005US20050136801 Cutting machine for plate-shaped material
06/23/2005US20050136740 Premolded housing
06/23/2005US20050136685 Chips, and apparatus and method for reaction analysis
06/23/2005US20050136664 Novel process for improved hot carrier injection
06/23/2005US20050136662 Method to remove fluorine residue from bond pads
06/23/2005US20050136661 Method for fabricating semiconductor device
06/23/2005US20050136652 Semiconductor interconnection structure with TaN and method of forming the same
06/23/2005US20050136651 Metal interconnection structure of semiconductor device and method of forming the same
06/23/2005US20050136650 Method of manufacturing semiconductor integrated circuit
06/23/2005US20050136645 Semiconductor device and fabrication method thereof
06/23/2005US20050136643 Dielectric film forming method for semiconductor device and semiconductor device
06/23/2005US20050136641 Solder structures for out of plane connections and related methods
06/23/2005US20050136640 Die exhibiting an effective coefficient of thermal expansion equivalent to a substrate mounted thereon, and processes of making same
06/23/2005US20050136636 Method for manufacturing metal structure having different heights
06/23/2005US20050136635 Attachment of integrated circuit structures and other substrates to substrates with vias
06/23/2005US20050136634 Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities
06/23/2005US20050136609 Capacitor having an anodic metal oxide substrate
06/23/2005US20050136608 Capacitor having an anodic metal oxide substrate
06/23/2005US20050136602 Dual-trench isolated crosspoint memory array
06/23/2005US20050136570 Process for producing optical semiconductor device
06/23/2005US20050136569 Plastic lead frames utilizing reel-to-reel processing
06/23/2005US20050136568 Manufacturing method of semiconductor device, semiconductor device, circuit substrate and electronic equipment
06/23/2005US20050136567 Warpage control of array packaging
06/23/2005US20050136558 Stacked semiconductor device assembly and method for forming
06/23/2005US20050136240 Very low dielectric constant plasma-enhanced CVD films
06/23/2005US20050135777 Small form factor transceiver with externally modulated laser
06/23/2005US20050135430 Temperature compensated delay signals
06/23/2005US20050135182 Chip-to-chip communication system using an ac-coupled bus and devices employed in same
06/23/2005US20050135137 Semiconductor memory devices having conductive line in twisted areas of twisted bit line pairs
06/23/2005US20050135105 LED package assembly
06/23/2005US20050135067 Semiconductor module with vertically mounted semiconductor chip packages
06/23/2005US20050135066 Method of attaching non-adhesive thermal interface materials
06/23/2005US20050135065 Electric circuit module
06/23/2005US20050135064 Locking device for heat dissipating device
06/23/2005US20050135063 Cooling apparatus
06/23/2005US20050135062 Heat sink, assembly, and method of making
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