Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2005
05/17/2005US6894944 Semiconductor integrated circuit device
05/17/2005US6894908 Bridge clip with bimetallic leaf and method
05/17/2005US6894904 Tab package
05/17/2005US6894900 Heat sink with heat pipe and base fins
05/17/2005US6894899 Integrated fluid cooling system for electronic components
05/17/2005US6894898 Fixing apparatus for heat sink
05/17/2005US6894790 Micropattern shape measuring system and method
05/17/2005US6894681 Character input device based on a two-dimensional movement sensor
05/17/2005US6894400 Robust electronic device packages
05/17/2005US6894399 Microelectronic device having signal distribution functionality on an interfacial layer thereof
05/17/2005US6894398 Insulated bond wire assembly for integrated circuits
05/17/2005US6894397 Plural semiconductor devices in monolithic flip chip
05/17/2005US6894396 Semiconductor device with capacitor
05/17/2005US6894395 System on a chip device including a re-wiring layer formed between groups of electronic devices
05/17/2005US6894394 Semiconductor device, circuit board, electronic apparatus, and method for manufacturing semiconductor device
05/17/2005US6894393 Buried power bus utilized as a sinker for high current, high power semiconductor devices and a method for providing the same
05/17/2005US6894390 Soft error resistant semiconductor device
05/17/2005US6894387 Semiconductor element having protruded bump electrodes
05/17/2005US6894386 Forming edge contactors; connecting to bonding pad; integrated circuits
05/17/2005US6894385 Integrated circuit package having bypass capacitors coupled to bottom of package substrate and supporting surface mounting technology
05/17/2005US6894384 Semiconductor device and method of manufacturing the same
05/17/2005US6894382 Optimized electronic package
05/17/2005US6894381 Electronic device having a stack of semiconductor chips and method for the production thereof
05/17/2005US6894378 Electronic component with stacked semiconductor chips
05/17/2005US6894377 Rectification chip terminal structure
05/17/2005US6894376 Integrated circuit packages; die attaching pads; contactors; encapsulated bonding wires
05/17/2005US6894375 Semiconductor device, semiconductor module and hard disk
05/17/2005US6894374 Semiconductor package insulation film and manufacturing method thereof
05/17/2005US6894373 Semiconductor chip wire bonded to substrate; encapsulation with resin; striped pattern
05/17/2005US6894372 Tape under frame for lead frame IC package assembly
05/17/2005US6894371 Semiconductor device
05/17/2005US6894370 Lead frame and semiconductor device having the same as well as method of resin-molding the same
05/17/2005US6894364 Capacitor in an interconnect system and method of manufacturing thereof
05/17/2005US6894361 Semiconductor device
05/17/2005US6894342 Structure and method for preventing UV radiation damage in a memory cell and improving contact CD control
05/17/2005US6894334 Active material zones separated by dielectric and channel barrier; etching using mask; overcoating aperture with tungsten, then aluminum, or alloy thereof
05/17/2005US6894320 Input protection circuit
05/17/2005US6894319 Semiconductor device
05/17/2005US6894311 Active matrix substrate for liquid crystal display utilizing interconnection lines formed from multilayered films that include an aluminum-neodymium alloy layer
05/17/2005US6894230 Printed circuit board employing lossy power distribution network to reduce power plane resonances
05/17/2005US6894229 Mechanically enhanced package and method of making same
05/17/2005US6894228 High performance dense wire for printed circuit board
05/17/2005US6894091 Of epoxy resin, phenolic resin curing agent, a molybdenum compound, and an inorganic filler, where given weight percent nitrogen atoms are contained in the the epoxy resin and/or phenolic resin; cures to flame retardant, heat resistance
05/17/2005US6893987 Simple process for fabricating semiconductor devices
05/17/2005US6893960 Method for manufacturing a semiconductor device
05/17/2005US6893959 Method to form selective cap layers on metal features with narrow spaces
05/17/2005US6893957 Method of forming a dual damascene interconnect by selective metal deposition
05/17/2005US6893956 Barrier layer for a copper metallization layer including a low-k dielectric
05/17/2005US6893955 Manufacturing seedless barrier layers in integrated circuits
05/17/2005US6893953 Fabrication process of a semiconductor device including a CVD process of a metal film
05/17/2005US6893952 Methods of forming a ball grid array including a non-conductive polymer core and a silver or silver alloy outer layer
05/17/2005US6893951 Vertical interconnection structure and methods
05/17/2005US6893949 Semiconductor devices having contact plugs and local interconnects and methods for making the same
05/17/2005US6893943 Method of dividing a semiconductor wafer
05/17/2005US6893923 Reduced mask count process for manufacture of mosgated device
05/17/2005US6893908 Thin film transfer array substrate for liquid crystal display and method for fabricating same
05/17/2005US6893904 Stereolithographic methods of fabricating semiconductor devices having protective layers thereon through which contact pads are exposed
05/17/2005US6893903 Semiconductor device and method for manufacturing the same
05/17/2005US6893902 Method and apparatus for thermal management of integrated circuits
05/17/2005US6893901 Carrier with metal bumps for semiconductor die packages
05/17/2005US6893900 Method of making an integrated circuit package
05/17/2005US6893898 Semiconductor device and a method of manufacturing the same
05/17/2005US6893894 Method of manufacturing a compound semiconductor by heating a layered structure including rare earth transition metal
05/17/2005US6893893 Method of preventing short circuits in magnetic film stacks
05/17/2005US6893885 Method for electrically and mechanically connecting microstructures using solder
05/17/2005US6893883 Method and apparatus using an on-chip ring oscillator for chip identification
05/17/2005US6893799 Dual-solder flip-chip solder bump
05/17/2005US6893736 Thermosetting resin compositions useful as underfill sealants
05/17/2005US6893591 Thermoplastic adhesive preform for heat sink attachment
05/17/2005US6893574 Miniaturized device to protect the mechanical and electrical components of the Micro-Electromechanical System
05/17/2005US6893541 Multi-step process for depositing copper seed layer in a via
05/17/2005US6892801 Thermal control apparatus for electronic systems
05/17/2005US6892800 Omnidirectional fan-heatsinks
05/17/2005US6892796 Apparatus and method for mounting a power module
05/17/2005US6892453 Method for forming an encapsulation device
05/17/2005US6892447 Chip mounting device
05/12/2005WO2005043966A1 Solder stop barrier
05/12/2005WO2005043634A1 Sealed structure of optical device, optical coupler, and method for sealing optical device
05/12/2005WO2005043623A2 Method for forming a dielectric on a metallic layer and capacitor assembly
05/12/2005WO2005043622A1 Semiconductor device and process for fabricating the same
05/12/2005WO2005043621A1 Power-electronic-cooling device
05/12/2005WO2005043620A1 Cooling device and electronic device
05/12/2005WO2005043619A1 Variable denisty graphite foam heat sink
05/12/2005WO2005043618A1 Method and arrangement in inverter
05/12/2005WO2005043602A2 Three-dimensional inductive micro components
05/12/2005WO2005043584A2 Single mask via method and device
05/12/2005WO2005043482A2 Processor component for contactless signal transmission
05/12/2005WO2005043176A2 Probe testing structure
05/12/2005WO2005042426A2 Glass-ceramic (ltcc) capable of being assembled with silicon by anodic bonding
05/12/2005WO2005031866A3 System for connection in integrated mos structures
05/12/2005WO2005024912A3 Methods of processing thick ild layers using spray coating or lamination for c4 wafer level thick metal integrated flow
05/12/2005WO2005020285A3 Extrusion thermo-electric temperature control unit
05/12/2005WO2005015104A3 Tower heat sink with sintered grooved wick
05/12/2005WO2005008695A3 Inductive and capacitive elements for semiconductor technologies with minimum pattern density requirements
05/12/2005WO2005003668A9 Microchannel heat exchangers and methods of manufacturing the same
05/12/2005WO2005001934A3 High-frequency package
05/12/2005WO2004112094A3 Semiconductor package having optimized wire bond positioning
05/12/2005WO2004093140A3 Electronic component and method of manufacturing same
05/12/2005WO2004077548A3 Connection technology for power semiconductors
05/12/2005WO2004042780A3 Flexible semiconductor device and method of manufacturing the same
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