| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 06/16/2005 | US20050127364 Wiring material and wiring board using the same |
| 06/16/2005 | US20050127358 Semiconductor device, electronic circuit array substrate provided with the same and method of manufacturing the electronic circuit array substrate |
| 06/16/2005 | US20050127356 Test mask structure |
| 06/16/2005 | US20050127165 Systems and methods for credit card charge validation over a network |
| 06/16/2005 | US20050127147 [method of forming bond microstructure] |
| 06/16/2005 | US20050127134 Nano-metal composite made by deposition from colloidal suspensions |
| 06/16/2005 | US20050126926 Free from cyan compound; comprises copper ammonium complexes |
| 06/16/2005 | US20050126819 Methods to prevent mechanical flexure related BGA failure |
| 06/16/2005 | US20050126763 Radiator with seamless heat conductor |
| 06/16/2005 | US20050126762 Radiating module and the manufacturing method thereof |
| 06/16/2005 | US20050126760 Heat transport device and electronic device |
| 06/16/2005 | US20050126759 Plate-type heat pipe and method for manufacturing the same |
| 06/16/2005 | US20050126754 Heat exchanger |
| 06/16/2005 | US20050126753 Heat dissipation assembly with resilient fastener |
| 06/16/2005 | US20050126752 Electronic apparatus |
| 06/16/2005 | US20050126750 Flow-path constituting body |
| 06/16/2005 | US20050126697 layers or adhesives in the formation of electronic devices; epoxy-based resins; triarylsulphonium hexafluoroantimonate ; ammonium hexafluoroantimonate |
| 06/16/2005 | US20050126290 Acceleration sensor and method of manufacturing acceleration sensor |
| 06/16/2005 | US20050125999 Manufacturing method of a modularized leadframe |
| 06/16/2005 | US20050125996 Apparatus for separating cull of semiconductor package molding system |
| 06/16/2005 | DE4330466B4 Hochreines Siliconpolymer und Verfahren zu seiner Herstellung Highly pure silicone polymer and process for its preparation |
| 06/16/2005 | DE202005003689U1 Anordnung mit einem elekronisch kommutierten Außenläufermotor Arrangement with a elekronisch commutated external rotor motor |
| 06/16/2005 | DE19713986B4 Halbleiterbauelement-Testgerät The semiconductor device testing apparatus |
| 06/16/2005 | DE10353648A1 Verfahren zum Fixieren eines Chipmoduls A method of fixing a chip module |
| 06/16/2005 | DE10352946A1 Halbleiterbauteil mit Halbleiterchip und Umverdrahtungslage sowie Verfahren zur Herstellung desselben Of the same semiconductor device with the semiconductor chip and rewiring and methods for preparing |
| 06/16/2005 | DE10352670A1 Electric component with equaliser of temperature caused mechanical stresses, connecting two part-elements with different length expansion coefficients, e.g. for optical components, i.e. glass plate connected to copper electrode etc |
| 06/16/2005 | DE10351005A1 Barrierenschicht mit einer Titannitridbeschichtung für eine Kupfermetallsierungsschicht, die ein Dielektrikum mit kleinem ε aufweist Barrier layer with a titanium nitride coating for a Kupfermetallsierungsschicht having a dielectric having a small ε |
| 06/16/2005 | DE10350239A1 Halbleiterbauteil mit Gehäusekunststoffmasse, Halbleiterchip und Schaltungsträger sowie Verfahren zur Herstellung desselben Of the same semiconductor device with housing plastic mass, semiconductor chip and circuit board and method for producing |
| 06/16/2005 | DE10348715A1 Verfahren zur Herstellung und Vorrichtung zur Verbesserung der Haftung zwischen einem Kunststoff und einem Metall Process for the preparation and apparatus for improving the adhesion between a plastic and a metal |
| 06/16/2005 | DE10249854B4 Leistungshalbleiter-Baugruppe The power semiconductor module |
| 06/16/2005 | DE102004051153A1 Resin solution for forming protection layer for semiconductor device, e.g. dynamic random access memory cell, comprises organic solvent and resol resin or novolac resin |
| 06/16/2005 | DE102004036908A1 Anordnung zur Verbesserung der Zuverlässigkeit von Halbleitermodulen Arrangement for improving the reliability of semiconductor modules |
| 06/16/2005 | CA2553664A1 Electronic circuit package with cavity resonance cut off member |
| 06/15/2005 | EP1542520A1 Method for forming bump on electrode pad with use of double-layered film |
| 06/15/2005 | EP1542519A1 Method for manufacturing board with built-in device and board with built-in device, and method for manufacturing printed wiring board and printed wiring board |
| 06/15/2005 | EP1542360A1 Integrated circuit power supply circuit |
| 06/15/2005 | EP1542282A1 Low-power semiconductor chip with separated power ring, method for manufacturing the same, and method for controlling the same |
| 06/15/2005 | EP1542281A1 Heat-dissipating member and joined structure |
| 06/15/2005 | EP1542280A1 Member for semiconductor device |
| 06/15/2005 | EP1542279A2 Semiconductor device and the method of producing the same |
| 06/15/2005 | EP1542278A1 Enhancement of underfill physical properties by the addition of a thermotropic cellulose |
| 06/15/2005 | EP1542276A2 Memory cell with a layer having colossal magnetoresistance and an asymmetric area |
| 06/15/2005 | EP1542273A1 Circuit-connecting material and circuit terminal connected structure and connecting method |
| 06/15/2005 | EP1542272A2 Semiconductor device and method for manufacturing the same |
| 06/15/2005 | EP1542261A1 Method of producing an element comprising an electrical conductor encircled by magnetic material |
| 06/15/2005 | EP1542168A1 Method of analyzing electronic components, device for analyzing electronic components and electronic components using these |
| 06/15/2005 | EP1542029A2 Surface mounting electronic module and method of testing the same |
| 06/15/2005 | EP1541524A2 Nanoparticle deposition process |
| 06/15/2005 | EP1541234A1 Hybrid microfluidic chip and method of manufacture |
| 06/15/2005 | EP1540828A1 Coding of information in integrated circuits |
| 06/15/2005 | EP1540769A1 Dielectric interconnect frame incorporating emi shield and hydrogen absorber for tile t/r modules |
| 06/15/2005 | EP1540736A2 Wafer-level seal for non-silicon-based devices |
| 06/15/2005 | EP1540729A1 Method of manufacturing a wafer assembly |
| 06/15/2005 | EP1540728A2 Forming a multi segment integrated circuit with isolated substrates |
| 06/15/2005 | EP1540727A1 Method for sealing a microcavity and package comprising at least one microcavity |
| 06/15/2005 | EP1540726A1 Diode |
| 06/15/2005 | EP1120449B1 Adhesive for bonding circuit members, circuit board, and method of producing the same |
| 06/15/2005 | CN2704926Y Liquid cooled radiators |
| 06/15/2005 | CN2704925Y Improved radiator structure of hot pipe |
| 06/15/2005 | CN2704924Y Hot pipe, combing structure for hot pipe and radiating fin |
| 06/15/2005 | CN2704923Y Backing-off cutting radiators |
| 06/15/2005 | CN2704922Y Multi-sectional radiators |
| 06/15/2005 | CN2704921Y Radiator of electronic components |
| 06/15/2005 | CN2704920Y Baseboard with fine interval sealing structure |
| 06/15/2005 | CN2704863Y Installing structure of semiconductor device, electro-optical device and electronic apparatus |
| 06/15/2005 | CN1628389A Contact structure of a wires and method manufacturing the same, and thin film transistor substrate including the contact structure and method manufacturing the same |
| 06/15/2005 | CN1628387A Enhanced structure and method for buried local interconnects |
| 06/15/2005 | CN1628384A Device for connecting an IC terminal to a reference potential |
| 06/15/2005 | CN1628382A Test wafer and method for investigating elecrostatic discharge induced wafer defects |
| 06/15/2005 | CN1628380A Monitoring of contact hole production |
| 06/15/2005 | CN1628379A Semiconductor device and its producing method |
| 06/15/2005 | CN1628378A Process for forming fusible links |
| 06/15/2005 | CN1628264A Thin film transistor array panel for a liquid crystal display |
| 06/15/2005 | CN1628263A 薄膜晶体管阵列面板 The thin film transistor array panel |
| 06/15/2005 | CN1627896A Electronic circuit unit |
| 06/15/2005 | CN1627892A Cooling apparatus and electronic equipment |
| 06/15/2005 | CN1627522A Semiconductor device and fabrication method thereof |
| 06/15/2005 | CN1627515A Semiconductor assembly and its mfg.method |
| 06/15/2005 | CN1627514A Semiconductor device and electronic device, and methods for manufacturing thereof |
| 06/15/2005 | CN1627513A Semiconductor device and electronic device, and methods for manufacturing thereof |
| 06/15/2005 | CN1627512A Semiconductor device and its mfg.method |
| 06/15/2005 | CN1627511A Structure of cooling fin in use for chip |
| 06/15/2005 | CN1627510A Radiator,cooler,electronic device,mfg.method of cooler |
| 06/15/2005 | CN1627508A Method for local reduction of compliant thermally conductive material layer thickness on chips |
| 06/15/2005 | CN1627507A Ball format array structure possessing heat sinks |
| 06/15/2005 | CN1627506A Method of making semiconductor having shield case,electronic device and its connection |
| 06/15/2005 | CN1627505A 半导体晶片 Semiconductor wafer |
| 06/15/2005 | CN1627498A Internal dielectric layer of semiconductor, semiconductor assembly and mfg.method thereof |
| 06/15/2005 | CN1627492A Semiconductor device, method of manufacturing semiconductor device, semiconductor chip, electronic module and electronic equipment |
| 06/15/2005 | CN1627491A Method for flattening tin ball and fixture |
| 06/15/2005 | CN1627490A Integrated circuit chip encapsulation and encapsulation method therefor |
| 06/15/2005 | CN1627489A Load supporting base plate for semiconductor chip and fabricating method |
| 06/15/2005 | CN1627480A Making method of semiconductor device |
| 06/15/2005 | CN1627477A Semiconductor device having metal-insulator-metal capacitor and method for fabricating the same |
| 06/15/2005 | CN1627303A Method of analyzing electronic components, device for analyzing electronic components and electronic components using these |
| 06/15/2005 | CN1627230A Heat-radiating structure of electronic apparatus |
| 06/15/2005 | CN1627168A Thin film transistor array panel and its mfg. method |
| 06/15/2005 | CN1627165A Lower substrate, display apparatus having the same and method of manufacturing the same |
| 06/15/2005 | CN1627083A Acceleration sensor and method of manufacturing acceleration sensor |
| 06/15/2005 | CN1627032A Sheet type heat-pipe and manufacturing method |