| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/25/2005 | CN1203542C Power semiconductor device |
| 05/25/2005 | CN1203535C Spin coating glass composition and method for forming silica layer in production of semiconductor |
| 05/25/2005 | CN1203533C Method for etching organic film, manufacture method of semiconductor device and pattern formin method |
| 05/25/2005 | CN1203104C Epoxy resin composition for semiconductor encapsulation |
| 05/24/2005 | US6898130 Semiconductor memory device and defect remedying method thereof |
| 05/24/2005 | US6898110 Semiconductor integrated circuit device |
| 05/24/2005 | US6898109 Semiconductor memory device in which bit lines connected to dynamic memory cells extend left and right of sense amplifier column |
| 05/24/2005 | US6898084 Thermal diffusion apparatus |
| 05/24/2005 | US6898083 Heat sink integrated retention system |
| 05/24/2005 | US6898082 Enhanced heat transfer structure with heat transfer members of variable density |
| 05/24/2005 | US6898081 Radiator structure for a computer device |
| 05/24/2005 | US6897742 Saw device using different colors or identifiers to distinguish the front and back of the package |
| 05/24/2005 | US6897669 Semiconductor device having bonding pads and probe pads |
| 05/24/2005 | US6897572 Power ring architecture for embedded low drop off voltage regulators |
| 05/24/2005 | US6897571 Method for sawing wafers employing multiple indexing techniques for multiple die dimensions |
| 05/24/2005 | US6897570 Semiconductor device and method of manufacturing same |
| 05/24/2005 | US6897569 Apparatus for implementing selected functionality on an integrated circuit device in an electronic device |
| 05/24/2005 | US6897568 Electronic component with flexible contacting pads and method for producing the electronic component |
| 05/24/2005 | US6897567 Method of making wireless semiconductor device, and leadframe used therefor |
| 05/24/2005 | US6897566 Encapsulated semiconductor package free of chip carrier |
| 05/24/2005 | US6897565 Stacked packages |
| 05/24/2005 | US6897563 Current crowding reduction technique using selective current injection |
| 05/24/2005 | US6897562 Electronic component and method of manufacturing same |
| 05/24/2005 | US6897561 Semiconductor power device having a diamond shaped metal interconnect scheme |
| 05/24/2005 | US6897556 I/O architecture for integrated circuit package |
| 05/24/2005 | US6897555 Integrated circuit package and method for a PBGA package having a multiplicity of staggered power ring segments for power connection to integrated circuit die |
| 05/24/2005 | US6897552 Semiconductor device wherein chips are stacked to have a fine pitch structure |
| 05/24/2005 | US6897551 Support for microelectronic, microoptoelectronic or micromechanical devices |
| 05/24/2005 | US6897550 Fully-molded leadframe stand-off feature |
| 05/24/2005 | US6897549 Frame for semiconductor package |
| 05/24/2005 | US6897548 Semiconductor differential interconnect |
| 05/24/2005 | US6897547 Semiconductor device including bipolar junction transistor, and production method therefor |
| 05/24/2005 | US6897544 Capacitor and manufacturing method thereof, semiconductor device and substrate for a semiconductor device |
| 05/24/2005 | US6897543 Electrically-programmable integrated circuit antifuses |
| 05/24/2005 | US6897542 Semiconductor assemblies |
| 05/24/2005 | US6897541 Semiconductor integrated circuit device and method of producing the same |
| 05/24/2005 | US6897536 ESD protection circuit |
| 05/24/2005 | US6897535 Integrated circuit with reverse engineering protection |
| 05/24/2005 | US6897509 Semiconductor device with a capacitor having upper and lower shield layers |
| 05/24/2005 | US6897507 Capacitor for high performance system-on-chip using post passivation device |
| 05/24/2005 | US6897503 Semiconductor memory device and manufacturing process for the same |
| 05/24/2005 | US6897497 Methods, apparatus, and systems for reducing interference on nearby conductors |
| 05/24/2005 | US6897496 Semiconductor device, a method of manufacturing the same and storage media |
| 05/24/2005 | US6897492 Power device with bi-directional level shift circuit |
| 05/24/2005 | US6897481 Semiconductor devices and manufacturing methods thereof |
| 05/24/2005 | US6897476 Test structure for determining electromigration and interlayer dielectric failure |
| 05/24/2005 | US6897475 Test structure and related methods for evaluating stress-induced voiding |
| 05/24/2005 | US6897428 Solid-state imaging device and method for manufacturing the same |
| 05/24/2005 | US6897151 Methods of filling a feature on a substrate with copper nanocrystals |
| 05/24/2005 | US6897150 Semiconductor wafer surface and method of treating a semiconductor wafer surface |
| 05/24/2005 | US6897148 Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby |
| 05/24/2005 | US6897143 Method of manufacturing semiconductor device including two-step polishing operation for cap metal |
| 05/24/2005 | US6897141 Solder terminal and fabricating method thereof |
| 05/24/2005 | US6897136 Method for forming fuse in semiconductor device |
| 05/24/2005 | US6897127 Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument |
| 05/24/2005 | US6897125 Methods of forming backside connections on a wafer stack |
| 05/24/2005 | US6897110 Method of protecting a memory array from charge damage during fabrication |
| 05/24/2005 | US6897097 Semiconductor device and a method of manufacturing the same |
| 05/24/2005 | US6897096 Method of packaging semiconductor dice employing at least one redistribution layer |
| 05/24/2005 | US6897094 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 05/24/2005 | US6897093 Method of manufacturing a resin molded or encapsulation for small outline non-leaded (SON) or quad flat non-leaded (QFN) package |
| 05/24/2005 | US6897092 Method of supporting a substrate film |
| 05/24/2005 | US6897091 Semiconductor device and manufacturing method thereof |
| 05/24/2005 | US6897090 Method of making a compliant integrated circuit package |
| 05/24/2005 | US6897089 Method and system for fabricating semiconductor components using wafer level contact printing |
| 05/24/2005 | US6897088 Method for connecting circuit devices |
| 05/24/2005 | US6897077 Test structure for determining a short circuit between trench capacitors in a memory cell array |
| 05/24/2005 | US6897010 Opaque patterns; forming photoresists; exposure; photolithography |
| 05/24/2005 | US6896998 Pattern forming method |
| 05/24/2005 | US6896976 Tin antimony solder for MOSFET with TiNiAg back metal |
| 05/24/2005 | US6896955 Process for forming dielectric layer over substrate comprising coating substrate with solution comprising soluble source of silicon oxide, water, solvent, nonionic surfactant, ionic additive, acid catalyst, hardening |
| 05/24/2005 | US6896953 Wiring board and process of producing the same |
| 05/24/2005 | US6896824 Heat-softening heat-radiation sheet |
| 05/24/2005 | US6896546 Method for assembling semiconductor device socket |
| 05/24/2005 | US6896186 Semiconductor device and an information management system thereof |
| 05/24/2005 | US6896170 Wire bonder for ball bonding insulated wire and method of using same |
| 05/24/2005 | US6896046 Heat dissipation assembly with fan mounting device |
| 05/24/2005 | US6896039 Integrated circuit heat pipe heat spreader with through mounting holes |
| 05/24/2005 | US6895666 Underfill system for semiconductor package |
| 05/24/2005 | US6895664 Method of making an optical coupling device |
| 05/24/2005 | CA2357790C Heater module and optical waveguide module |
| 05/19/2005 | WO2005046299A1 An apparatus and method for manufacturing integrated circuits, microelectromechanical system (mems) devices and nanofilters |
| 05/19/2005 | WO2005046298A1 Method of conformal coating using noncontact dispensing |
| 05/19/2005 | WO2005046020A2 Electric motor and method for producing said motor |
| 05/19/2005 | WO2005045944A1 Package structure for opt device |
| 05/19/2005 | WO2005045934A2 Method and device for connecting chips |
| 05/19/2005 | WO2005045932A1 Generation of metal holes by via mutation |
| 05/19/2005 | WO2005045931A2 Semiconductor chip having flip-chip contacts and method for producing the same |
| 05/19/2005 | WO2005045930A1 Leadframe with insulating ring |
| 05/19/2005 | WO2005045929A1 Integrated circuit bond pad structures and methods of making |
| 05/19/2005 | WO2005045928A1 Dc-dc converter implemented in a land grid array package |
| 05/19/2005 | WO2005045927A1 Using external radiators with electroosmotic pumps for cooling integrated circuits |
| 05/19/2005 | WO2005045926A2 Semiconductor component comprising synthetic housing material, semiconductor chip and circuit support, and method for producing the same |
| 05/19/2005 | WO2005045925A1 Electronic device and process for manufacturing same |
| 05/19/2005 | WO2005045923A1 A method for making a semiconductor device having increased conductive material reliability |
| 05/19/2005 | WO2005045919A1 Non-contact id card and manufacturing method thereof |
| 05/19/2005 | WO2005045912A1 Etching liquid and etching method for low-k film |
| 05/19/2005 | WO2005045902A2 Semiconductor device and manufacturing method thereof |
| 05/19/2005 | WO2005045896A2 Lateral high-voltage junction device |
| 05/19/2005 | WO2005045888A2 Electromagnetic noise shielding in semiconductor packages using caged interconnect structures |