Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2014
03/27/2014DE102013110541A1 Integrierte schaltung, chipgehäuse und verfahren zur herstellung einer integrierten schaltung An integrated circuit chip package and method for manufacturing an integrated circuit
03/27/2014DE102013109834A1 Bidirektionale Heteroübergangshalbleiterschutzvorrichtungen und Verfahren zur Bildung derselben Bidirectional heterojunction semiconductor protection devices and methods of forming the same
03/27/2014DE102013109831A1 Schutzbegrenzer für Heteroübergangsverbindungshalbleiter und Verfahren zu deren Herstellung Schutzbegrenzer for hetero-junction compound semiconductor and process for their preparation
03/27/2014DE102013103578A1 Gehäuseanordnung und Verfahren zum Herstellen derselben Housing assembly and method of manufacturing the same
03/27/2014DE102013103570A1 Elektronisches Modul und Verfahren zum Herstellen desselben The same electronic module and method of producing
03/27/2014DE102013103489A1 Wärmeableitung durch Dichtungsringe in 3DIC-Struktur Heat dissipation by sealing rings in 3DIC structure
03/27/2014DE102013015942A1 Halbleiterbauelement mit einem Clipkontakt Semiconductor component with a clip contact
03/27/2014DE102013012071A1 Variieren der Induktanz Varying the inductance
03/27/2014DE102012223793A1 Optoelectronic component e.g. LED, has current path for draining charge carriers, which is formed parallel to p-n junction and is electrically connected to p-type and n-type semiconductor layers
03/27/2014DE102012222772A1 Organisches optoelektronisches Bauelement Organic optoelectronic component
03/27/2014DE102012217609A1 Optoelectronic semiconductor device i.e. LED, has support substrate embedded in mold body, and optoelectronic semiconductor chip arranged above top side of substrate, where top side of substrate flushingly terminates with mold body top side
03/27/2014DE102012216956A1 Lead frame for lighting device e.g. LED module, has fitting station for semiconductor light source that is arranged adjacent to contact surface of conductive paths that are non-destructive pivotable towards connecting portions
03/27/2014DE102012216949A1 Carrier for interconnecting electro technical component e.g. switching or driving device of electric motor vehicle component, has control signal conductor strip and high current conductor strips that are formed in electric lines
03/27/2014DE102012215449A1 Gehäuse für ein elektronisches bauelement, elektronische baugruppe, verfahren zum herstellen eines gehäuses für ein elektronisches bauelement und verfahren zum herstellen einer elektronischen baugruppe Housing for an electronic component, electronic module, method for manufacturing a housing for an electronic component and method for manufacturing an electronic module,
03/27/2014DE102012214704A1 Thermoelektrisches Modul The thermoelectric module
03/27/2014DE102012109159A1 Leiterrahmenverbund, Gehäuseverbund, Baugruppenverbund und Verfahren zum Ermitteln mindestens eines Messwerts einer Messgröße einer elektronischen Baugruppe Lead frame composite, composite housing, module assembly and method for determining at least one measured value of a measurand an electronic assembly
03/27/2014DE102012109156A1 Bauteilanordnung und Verfahren zum Herstellen von elektrischen Bauteilen Component arrangement and method for manufacturing of electrical components
03/27/2014DE102012109141A1 Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelementes Optoelectronic component and method of manufacturing an optoelectronic component
03/27/2014DE102012109139A1 Gehäuse für ein optoelektronisches Bauelement, Elektronische Baugruppe, Verfahren zum Herstellen von Gehäusen und Verfahren zum Herstellen elektronischer Baugruppen A housing for an optoelectronic component, Electronic module, method for producing housings and methods for making electronic assemblies
03/27/2014DE102012109131A1 Optoelektronische Bauelementevorrichtung, Verfahren zum Herstellen einer optoelektronischen Bauelementevorrichtung und Verfahren zum Betreiben einer optoelektronischen Bauelementevorrichtung Optoelectronic Devices device, method of manufacturing an opto-electronic device components and methods of operating an opto-electronic device components
03/27/2014DE102012109107A1 Circuit arrangement for use in motor vehicle headlight, has conduction path to be separated from another conduction path and including carrier contact region, over which bond is connected with element contact region of component element
03/27/2014DE102012018943A1 Halbleitergehäuse mit Rückseiten-Strukturierung Semiconductor package with backs structuring
03/27/2014DE102012018928A1 Halbleitergehäuse für Chipkarten Semiconductor package for smart cards
03/27/2014DE102006035875B4 Verfahren zur Herstellung eines Fuse-Elements, eines Fuse-Speicherelements oder eines Widerstandselements A process for the preparation of a fuse element, a fuse memory element or a resistive element
03/27/2014DE102006035864B4 Verfahren zur Herstellung einer elektrischen Durchkontaktierung A method for producing an electrical plated-through hole
03/26/2014EP2712282A2 Thinned and flexible semiconductor elements on three dimensional surfaces
03/26/2014EP2711985A2 Semiconductor device
03/26/2014EP2711984A1 Metal-insulator-metal capacitor formed within an interconnect metallisation layer of an integrated circuit and manufacturing method thereof
03/26/2014EP2711983A1 Cooler for use in semiconductor module
03/26/2014EP2711982A2 Method and apparatus for pre-emptive power semiconductor module fault indication
03/26/2014EP2711981A1 Circuit substrate for large-capacity module periphery circuit, and large-capacity module including periphery circuit employing circuit substrate
03/26/2014EP2711977A1 Manufacture of coated copper pillars
03/26/2014EP2711976A2 Stackable layers containing encapsulated integrated circuit chips with one or more overlying interconnect layers and a method of making the same
03/26/2014EP2711973A1 Al ALLOY FILM FOR SEMICONDUCTOR DEVICES
03/26/2014EP2710632A1 Improved tie bar resonance suppression
03/26/2014EP2710631A1 Heat sink for cooling power electronics
03/26/2014CN203503700U SMD LED structure
03/26/2014CN203503657U Array substrate and display apparatus
03/26/2014CN203503656U Surface-mount-device type photoelectric coupler black ceramic packaging shell
03/26/2014CN203503650U Semiconductor device
03/26/2014CN203503649U Semiconductor device
03/26/2014CN203503648U Lead frame structure of SSOP20 integration circuit package
03/26/2014CN203503647U Lead frame structure of ESOP8 integration circuit package
03/26/2014CN203503646U Lead frame structure of SOP28 integration circuit package
03/26/2014CN203503645U Lead frame structure of SSOP24 integration circuit package
03/26/2014CN203503644U Power module free of terminal welding
03/26/2014CN203503643U Power module free of bending of power terminals
03/26/2014CN203503642U Chip liquid cooling device
03/26/2014CN203503641U Radiator
03/26/2014CN203503640U Wireless communication module
03/26/2014CN203503639U High voltage semiconductor device of self-positioning chip
03/26/2014CN203503638U Dual in-line type optocoupler black ceramic packaging shell
03/26/2014CN203503637U LTCC flip chip bonding SMT type housing structure
03/26/2014CN203503636U Electronic component and package thereof
03/26/2014CN203502898U Heat dissipating device of DSP chip
03/26/2014CN103688605A Installation structure for coolant pipe
03/26/2014CN103688598A Wiring board and electronic device
03/26/2014CN103688355A Integrated circuit design using through silicon vias
03/26/2014CN103688354A Improved matching techniques for wide-bandgap power transistors
03/26/2014CN103688353A Microelectronic device, stacked die package and computing system containing same, method of manufacturing a multi not channel communication pathway in same, and method of enabling electrical communication between components of a stacked-die package
03/26/2014CN103688352A Semiconductor device and method for manufacturing semiconductor device
03/26/2014CN103688351A Compact thermal module
03/26/2014CN103688350A Chip module embedded in PCB substrate
03/26/2014CN103688349A Electrical fuse and method of making the same
03/26/2014CN103688126A Heat transfer system with integrated evaporator and condenser
03/26/2014CN103687923A Use of an anisotropic fluoropolymer for the conduction of heat
03/26/2014CN103687920A A two-part dual-cure adhesive for use on electronics
03/26/2014CN103687535A Connectors for making connections between analyte sensors and other devices
03/26/2014CN103687441A Cooling circuit with sufficiently small dimensioned heat exchanger
03/26/2014CN103687417A Fastener and heat dissipation device using same
03/26/2014CN103687415A Fastener and heat dissipation device using same
03/26/2014CN103687275A Multi-layered board and semiconductor package
03/26/2014CN103687274A Multilayer printed circuit board
03/26/2014CN103684244A Diode elastic clamping type photovoltaic junction box
03/26/2014CN103681869A Thin film transistor substrate, manufacturing method for thin film transistor substrate, and display
03/26/2014CN103681852A Power semiconductor device
03/26/2014CN103681788A Semiconductor device and manufacturing method thereof
03/26/2014CN103681751A Thin film transistor array substrate and method for manufacturing same
03/26/2014CN103681730A Display panel
03/26/2014CN103681706A 3D IC and 3D CIS structure
03/26/2014CN103681693A Array substrate, manufacturing method of array substrate and display device
03/26/2014CN103681692A Array substrate, production method thereof and display device
03/26/2014CN103681675A Semiconductor device and method for fabricating the same
03/26/2014CN103681669A Common drain power clip for battery pack protection MOSFET
03/26/2014CN103681654A Semiconductor device
03/26/2014CN103681648A Electrical circuit and method for producing electrical circuit
03/26/2014CN103681647A Packaging structure and manufacturing method thereof
03/26/2014CN103681646A Stacked semiconductor devices and method of making same
03/26/2014CN103681645A Three-dimensional semiconductor package device having enhanced security
03/26/2014CN103681642A Fast recovery rectification diode parallel connection modules
03/26/2014CN103681640A Laminated semiconductor device and method for manufacturing same
03/26/2014CN103681639A A system-level packaging structure and a packaging method thereof
03/26/2014CN103681636A Chip to package interface
03/26/2014CN103681635A Semiconductor devices with impedance matching-circuit, and method of manufacture thereof
03/26/2014CN103681634A Connecting element for electrically conducting connection of first power electronics device with second power electronics device
03/26/2014CN103681633A Magnetic core and forming method thereof, and integrated circuit, substrate, transformer and inductor including the magnetic core
03/26/2014CN103681632A Capacitor and organic light emitting diode display including same
03/26/2014CN103681631A Spiral round micro-inductor and preparation method thereof
03/26/2014CN103681630A Overvoltage protection for multi-chip module and system-in-package
03/26/2014CN103681629A Light emitting diode device
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