Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2005
06/30/2005US20050140017 Semiconductior device having improved contact hole structure and method for fabricating the same
06/30/2005US20050140016 Contact plug in semiconductor device and method of forming the same
06/30/2005US20050140015 Semiconductor device
06/30/2005US20050140014 Semiconductor device and method of manufacturing same, wiring board, electronic module, and electronic instrument
06/30/2005US20050140013 Semiconductor device and manufacturing process therefor as well as plating solution
06/30/2005US20050140012 Method for forming copper wiring of semiconductor device
06/30/2005US20050140011 Semiconductor device and method for fabricating the same
06/30/2005US20050140010 Method and structure of manufacturing high capacitance metal on insulator capacitors in copper
06/30/2005US20050140007 Semiconductor device and method of fabricating the same
06/30/2005US20050140006 Method of manufacturing a semiconductor device
06/30/2005US20050140005 Chip package structure
06/30/2005US20050140004 Semiconductor device and method of fabricating the same
06/30/2005US20050140003 Semiconductor device with a protective security coating and method of manufacturing the same
06/30/2005US20050140002 Methods of forming contact structures for memory cells using etch stop layers and related devices
06/30/2005US20050140001 Integrated circuit arrangement
06/30/2005US20050140000 Method of manufacturing a semiconductor device and semiconductor device
06/30/2005US20050139999 Method and apparatus for applying body bias to integrated circuit die
06/30/2005US20050139998 Device and method for package warp compensation in an integrated heat spreader
06/30/2005US20050139997 Chip assembly package
06/30/2005US20050139996 Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package
06/30/2005US20050139995 CTE-matched heat pipe
06/30/2005US20050139994 Semiconductor package
06/30/2005US20050139993 Plastic microfabricated structure for biochip, microfabricated thermal device, microfabricated reactor, microfabricated reactor array, and micro array using the same
06/30/2005US20050139992 Integrated stacked microchannel heat exchanger and heat spreader
06/30/2005US20050139991 Thermal intermediate apparatus, systems, and methods
06/30/2005US20050139990 Method of manufacturing ceramic package sealing structure and ceramic package having said sealing structure
06/30/2005US20050139989 Glass molding die and renewing method thereof
06/30/2005US20050139988 Semiconductor device and electronic equipment using the same
06/30/2005US20050139987 Semiconductor integrated circuit device
06/30/2005US20050139986 Methods of making microelectronic assemblies including compliant interfaces
06/30/2005US20050139985 Semiconductor chip package and multichip package
06/30/2005US20050139984 Package element and packaged chip having severable electrically conductive ties
06/30/2005US20050139983 Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device
06/30/2005US20050139982 Method of manufacturing a semiconductor device
06/30/2005US20050139981 High-frequency device
06/30/2005US20050139980 High density integrated circuit module
06/30/2005US20050139979 Multi-chip package structure
06/30/2005US20050139978 Semiconductor device having layered chips
06/30/2005US20050139977 Semiconductor integrated circuit device
06/30/2005US20050139975 Tension resistant structure
06/30/2005US20050139974 Chip package structure
06/30/2005US20050139973 Dicing die-bonding film
06/30/2005US20050139972 System and method for improving solder joint reliability in an integrated circuit package
06/30/2005US20050139970 Leadless semiconductor package
06/30/2005US20050139969 Semiconductor package with increased number of input and output pins
06/30/2005US20050139968 Chemical leadframe roughening process and resulting leadframe and integrated circuit package
06/30/2005US20050139967 Signal routing in a hermetically sealed MEMS device
06/30/2005US20050139964 Semiconductor wafer and dicing method
06/30/2005US20050139963 Chip-mounted film package
06/30/2005US20050139962 Silicon wafer with soluable protective coating
06/30/2005US20050139956 Semiconductor device and fabrication method thereof
06/30/2005US20050139955 Radio frequency integrated circuit, and method for manufacturing the same
06/30/2005US20050139954 Radio frequency semiconductor device and method of manufacturing the same
06/30/2005US20050139953 Non-volatile memory devices including fuse covered field regions and methods of forming the same
06/30/2005US20050139948 Integration of barrier layer and seed layer
06/30/2005US20050139946 Photosensitive semiconductor package and method for fabricating the same
06/30/2005US20050139938 Semiconductor device and method of manufacturing the same
06/30/2005US20050139920 Semiconductor device, method of manufacturing a semiconductor device, electroluminescence device, and method of manufacturing an electroluminescence device
06/30/2005US20050139905 Dummy layer in semiconductor device and fabricating method thereof
06/30/2005US20050139903 Protection againts in-process charging in silicon-oxide-nitride-oxide-silicon (SONOS) memories
06/30/2005US20050139892 Repatterned integrated circuit chip package
06/30/2005US20050139886 Capacitor for semiconductor device and fabricating method thereof
06/30/2005US20050139885 Capacitor pair structure for increasing the match thereof
06/30/2005US20050139874 Test patterns for semiconductor devices and methods of fabricating the same
06/30/2005US20050139864 Multi-layer substrate structure for reducing layout area
06/30/2005US20050139855 Package structure for semiconductor
06/30/2005US20050139843 Chip carrier used for semiconductor optical device, optical module, and optical transmitter and receiver
06/30/2005US20050139828 Solid-state imaging device and method for manufacturing the same
06/30/2005US20050139827 Test patterns for measurement of effective vacancy diffusion area
06/30/2005US20050139826 Structure of test element group wiring and semiconductor substrate
06/30/2005US20050139821 Organic electroluminescent display device and method of fabricating the same
06/30/2005US20050139768 Method and apparatus for the characterization of a depth structure in a substrate
06/30/2005US20050139767 Multiple directional scans of test structures on semiconductor integrated circuits
06/30/2005US20050139644 Electronic devices and methods of forming electronic devices
06/30/2005US20050139642 Nanotube modified solder thermal intermediate structure, systems, and methods
06/30/2005US20050139488 Electrolytic stripping method
06/30/2005US20050139391 Circuit board with trace configuration for high-speed digital differential signaling
06/30/2005US20050139390 Printed circuit board and package having oblique vias
06/30/2005US20050139388 Semiconductor devices having more than two-rows of pad structures and methods of fabricating the same
06/30/2005US20050139387 Wiring circuit board
06/30/2005US20050139371 Wiring circuit board
06/30/2005US20050139347 Heat dissipation device
06/30/2005US20050139345 Apparatus for using fluid laden with nanoparticles for application in electronic cooling
06/30/2005US20050138800 Method and apparatus for thermally coupling a heat dissipation device to a microelectronic device
06/30/2005US20050138799 Method of manufacturing a metal-ceramic circuit board
06/30/2005DE29924723U1 Method of detecting and preventing regions critical for etching, e.g. for screen printing plate manufacture - involves accessing data structures of layout and configuration elements in plane of layout, detecting critical regions between configuration elements, altering, displaying regions
06/30/2005DE19701189B4 Halbleiterbauteil Semiconductor device
06/30/2005DE19503178B4 Verfahren und Vorrichtung zur Herstellung einer lötbaren Metallisierungsschicht auf einer nichtlötbaren Oberfläche Method and apparatus for producing a solderable metallization layer on a surface nichtlötbaren
06/30/2005DE10392524T5 Spannungsvariables Material zur direkten Anwendung und Vorrichtung zu dessen Anwendung Voltage variable material for direct application and device for its application
06/30/2005DE10355925A1 Leistungshalbleitermodul und Verfahren seiner Herstellung The power semiconductor module and its production method
06/30/2005DE10355921A1 Elektrische Schaltungsanordnung Electrical circuitry
06/30/2005DE10355600A1 Trägerschicht für eine Halbleiterschichtenfolge und Verfahren zur Herstellung von Halbleiterchips Carrier layer for a semiconductor layer sequence and process for producing semiconductor chips
06/30/2005DE10355597A1 Kühlsystem zur Kühlung einer in einem Computersystem angeordneten elektronischen Komponente Cooling system for cooling a computer system arranged in an electronic component
06/30/2005DE10354112A1 Repair method for memory chips uses redundant cell areas and corresponding fuses with micro-lithographic devices
06/30/2005DE10353677A1 Außenstromlose Kontaktierung Electroless contact
06/30/2005DE10353676A1 Raue Kontakte Rough Contacts
06/30/2005DE10351719A1 Prozessorbaustein Processor module
06/30/2005DE10315225B4 Wärmetauscher Heat exchanger
06/30/2005DE102004054996A1 Electronic appliance with electrically insulated metallic heat sink, has soft metallic layer arranged between foil and heat sink
06/30/2005DE102004049868A1 Halbleitervorrichtung in Stapelanordnung und Steuerverfahren für Halbleiterchips Semiconductor device stack assembly and control method for semiconductor chips
1 ... 1349 1350 1351 1352 1353 1354 1355 1356 1357 1358 1359 1360 1361 1362 1363 1364 1365 1366 1367 1368 1369 ... 2262