| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/06/2005 | CN2708501Y Radiator |
| 07/06/2005 | CN2708500Y Structure of IC wafer |
| 07/06/2005 | CN2708499Y Ultra-high power high-vacuum ceramic cartridge |
| 07/06/2005 | CN1636274A Test structures and models for estimating the yield impact of dishing and/or voids |
| 07/06/2005 | CN1636273A Semiconductor wafer with process control modules |
| 07/06/2005 | CN1636271A Semiconductor power device and method of formation |
| 07/06/2005 | CN1636263A Topside active optical device apparatus and method |
| 07/06/2005 | CN1636167A Method and materials for printing particle-enhanced electrical contacts |
| 07/06/2005 | CN1636124A Electroosmotic microchannel cooling system |
| 07/06/2005 | CN1635950A Carbon-carbon and/or metal-carbon fiber composite heat spreaders |
| 07/06/2005 | CN1635949A Apparatus for microdeposition of multiple fluid materials |
| 07/06/2005 | CN1635638A Multiple metal layer SRAM memory used as testing apparatus |
| 07/06/2005 | CN1635636A Method and structure for combining copper with copper-insulator-copper capacitor |
| 07/06/2005 | CN1635635A Directly connected chip packaging structure |
| 07/06/2005 | CN1635634A Method and apparatus for producing welding pad for chip level packaging |
| 07/06/2005 | CN1635633A Structure of semiconductor element |
| 07/06/2005 | CN1635632A Light sensitive semiconductor package, and manufacturing method and conductor frame thereof |
| 07/06/2005 | CN1635627A Low energy dosage monitoring using wafer impregnating machine |
| 07/06/2005 | CN1635625A Method and structure for manufacturing high-capacitance capacitor by using copper |
| 07/06/2005 | CN1635612A Electrostatic discharge protection method and structure for photomask |
| 07/06/2005 | CN1635449A Liquid-circulating refrigeration system for computer heat radiation |
| 07/06/2005 | CN1209951C Method for manufacturing ceramic multi-layer substrate, and unbaked composite laminated body |
| 07/06/2005 | CN1209816C Electrostatic discharge protection assembly and electrostatic discharge protection circuit |
| 07/06/2005 | CN1209815C Welding pad structure for semiconductor package |
| 07/06/2005 | CN1209814C Process for the manufacture of printed circuit board with plated resistor |
| 07/06/2005 | CN1209804C Spiral contactor and manufacturing method thereof, semiconductor detection apparatus using same and electronic element |
| 07/06/2005 | CN1209802C Method for producing electronic device and electronic device |
| 07/06/2005 | CN1209795C Method for encapsulation in chip level by use of electroplating mask of elastic body |
| 07/06/2005 | CN1209771C Insulator ceramic composition |
| 07/06/2005 | CN1209220C Method for producing radiator |
| 07/05/2005 | USRE38753 Interconnect structure and method for forming the same |
| 07/05/2005 | US6915498 Semiconductor device provided using wiring data of common design core |
| 07/05/2005 | US6914786 Converter device |
| 07/05/2005 | US6914779 Controlling thermal, acoustic, and/or electromagnetic properties of a computing device |
| 07/05/2005 | US6914645 Liquid crystal display device |
| 07/05/2005 | US6914501 High performance embedded RF filters |
| 07/05/2005 | US6914482 Power amplifier module for wireless communication devices |
| 07/05/2005 | US6914337 Calibration wafer and kit |
| 07/05/2005 | US6914336 Capable of preventing connection failure of the contact plugs without causing an increase in the product failures or contact resistances |
| 07/05/2005 | US6914334 Circuit board with trace configuration for high-speed digital differential signaling |
| 07/05/2005 | US6914333 Wafer level package incorporating dual compliant layers and method for fabrication |
| 07/05/2005 | US6914332 Flip-chip without bumps and polymer for board assembly |
| 07/05/2005 | US6914331 Semiconductor device having an inductor formed on a region of an insulating film |
| 07/05/2005 | US6914330 Heat sink formed of diamond-containing composite material with a multilayer coating |
| 07/05/2005 | US6914329 Micro cooling and power supply structure |
| 07/05/2005 | US6914328 Electronic component with an insulating layer formed from fluorinated norbornene polymer and method for manufacturing the insulating layers |
| 07/05/2005 | US6914327 Semiconductor device and manufacturing method thereof |
| 07/05/2005 | US6914326 Solder ball landpad design to improve laminate performance |
| 07/05/2005 | US6914325 Power semiconductor module |
| 07/05/2005 | US6914324 Memory expansion and chip scale stacking system and method |
| 07/05/2005 | US6914322 Semiconductor device package and method of production and semiconductor device of same |
| 07/05/2005 | US6914321 Semiconductor device |
| 07/05/2005 | US6914320 Bilayer HDP CVD/PE CVD cap in advanced BEOL interconnect structures and method thereof |
| 07/05/2005 | US6914319 Semiconductor device having a fuse |
| 07/05/2005 | US6914317 Thin microelectronic substrates and methods of manufacture |
| 07/05/2005 | US6914306 Electrostatic discharge protection device |
| 07/05/2005 | US6914305 Circuits and methods for electrostatic discharge protection in integrated circuits |
| 07/05/2005 | US6914304 Electronic component protected against electrostatic discharges |
| 07/05/2005 | US6914300 Semiconductor device |
| 07/05/2005 | US6914297 Configuration for generating a voltage sense signal in a power semiconductor component |
| 07/05/2005 | US6914286 Semiconductor memory devices using sidewall spacers |
| 07/05/2005 | US6914278 High permeability thin films and patterned thin films to reduce noise in high speed interconnections |
| 07/05/2005 | US6914276 Molecular device, molecule array, rectifier device, rectifying method, sensor device, switching device, circuit device, logical circuit device, operational device and information processing device |
| 07/05/2005 | US6914275 Semiconductor component with electrical characteristic adjustment circuitry |
| 07/05/2005 | US6914259 Multi-chip module, semiconductor chip, and interchip connection test method for multi-chip module |
| 07/05/2005 | US6914198 Electrical device allowing for increased device densities |
| 07/05/2005 | US6914196 Reel-deployed printed circuit board |
| 07/05/2005 | US6914025 Heat conductive material |
| 07/05/2005 | US6914006 Wafer scribing method and wafer scribing device |
| 07/05/2005 | US6914004 Method for via etching in organo-silica-glass |
| 07/05/2005 | US6913999 Semiconductor device with components embedded in backside diamond layer |
| 07/05/2005 | US6913997 Method of using tantalum-aluminum-nitrogen material as diffusion barrier and adhesion layer in semiconductor devices |
| 07/05/2005 | US6913996 Method of forming metal wiring and semiconductor manufacturing apparatus for forming metal wiring |
| 07/05/2005 | US6913989 Method of exposing a semiconductor integrated circuit including device regions and global routing region |
| 07/05/2005 | US6913983 Integrated circuit arrangement and method for the manufacture thereof |
| 07/05/2005 | US6913970 Semiconductor device and method of manufacturing the same |
| 07/05/2005 | US6913966 Method for stabilizing or offsetting voltage in an integrated circuit |
| 07/05/2005 | US6913954 Programmable fuse device |
| 07/05/2005 | US6913953 Semiconductor device capable of preventing moisture absorption of fuse area thereof and method for manufacturing the fuse area |
| 07/05/2005 | US6913952 Methods of forming circuit traces and contact pads for interposers utilized in semiconductor packages |
| 07/05/2005 | US6913951 Method of making a lead-on-chip device |
| 07/05/2005 | US6913950 Semiconductor device with chamfered substrate and method of making the same |
| 07/05/2005 | US6913949 Stacked packages |
| 07/05/2005 | US6913948 Partially captured oriented interconnections for BGA packages and a method of forming the interconnections |
| 07/05/2005 | US6913947 Multi-layer circuit board and method of manufacturing the same |
| 07/05/2005 | US6913945 Method of mounting a chip |
| 07/05/2005 | US6913827 Nanocoated primary particles and method for their manufacture |
| 07/05/2005 | US6913790 A MoO2 layer is formed on the surface of the electrically conductive layer of molybdenum or alloy. The sheet resistivity can thereby be reduced in the order of magnitude of 10% to 15%. |
| 07/05/2005 | US6913468 Methods of removably mounting electronic components to a circuit board, and sockets formed by the methods |
| 07/05/2005 | US6913075 A thermal interface includes nanofibrils. The nanofibrils may be attached to a flat base or membrane, or may be attached to the tip portions of larger diameter fibers. The nanofibrils have a diameter of less than about 1 micron, and may |
| 07/05/2005 | US6913072 Heat dissipating device |
| 07/05/2005 | US6913070 Planar heat pipe structure |
| 07/05/2005 | US6913069 Cooling device having fins arranged to funnel air |
| 07/05/2005 | US6912785 Flexible heat pipe structure and associated methods for dissipating heat in electronic apparatus |
| 07/05/2005 | US6912781 Method of manufacturing electronic packaging device with insertable leads |
| 07/05/2005 | US6912765 Easily removed heatsink clip |
| 07/05/2005 | CA2340677C Semiconductor package, semiconductor device, electronic device, and method for producing semiconductor package |
| 06/30/2005 | WO2005060325A1 Flat plate heat transfer device and method for manufacturing the same |
| 06/30/2005 | WO2005060057A1 Semiconductor laser device and method of producing the same |
| 06/30/2005 | WO2005060004A1 Solid-state imaging device, its production method, camera with the solid-state imaging device, and light-receiving chip |