Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2005
06/30/2005WO2005059999A1 Integrated circuit protected by an active shielding
06/30/2005WO2005059998A1 Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities
06/30/2005WO2005059997A1 Various structure/height bumps for wafer level-chip scale package
06/30/2005WO2005059996A1 Electronic device cooler, electronic device cooling method, and electronic device cooling control program
06/30/2005WO2005059995A2 Semiconductor package with integrated heatsink and electromagnetic shield
06/30/2005WO2005059994A1 Structure for air conduction in radiator device
06/30/2005WO2005059993A2 Packaging substrates for integrated circuits and soldering methods
06/30/2005WO2005059987A1 Insulating film, method for forming same and composition for forming film
06/30/2005WO2005059968A2 Integrated circuit fuse and method of fabrication
06/30/2005WO2005059957A2 Metal interconnect system and method for direct die attachment
06/30/2005WO2005059465A1 Heat conduction device
06/30/2005WO2005059436A1 Lighting assembly, heat sink and heat recovery system therefor
06/30/2005WO2005059194A1 Metal base carbon fiber composite material and process for producing the same
06/30/2005WO2005059053A1 Thermally conductive pressure-sensitive adhesive composition, thermally conductive sheet-form molded foam, and process for producing the same
06/30/2005WO2005044899A8 Prepolymer, prepolymer composition, high molecular weight polymer having structure containing hole and electrically insulating film
06/30/2005WO2005044451A9 Electrical connection of components
06/30/2005WO2005041627A3 Flow distributing unit and cooling unit having bypass flow
06/30/2005WO2005038865A3 Amorphous carbon layer to improve photoresist adhesion
06/30/2005WO2005006458A3 Test structures and methods
06/30/2005WO2005001935A3 Integrated circuit package having stacked integrated circuits and method therefor
06/30/2005US20050144546 Semiconductor integrated circuit and evaluation method of wiring in the same
06/30/2005US20050143000 Cooling device
06/30/2005US20050142943 Semiconductor differential interconnect
06/30/2005US20050142933 Flexible rewiring plate for semiconductor components, and process for producing it
06/30/2005US20050142917 Electrically insulating body, and electronic device
06/30/2005US20050142874 Methods for fabricating a copper interconnect
06/30/2005US20050142865 Methods of fabricating via hole and trench
06/30/2005US20050142862 Dual damascene interconnection in semiconductor device and method for forming the same
06/30/2005US20050142861 Method of forming an interconnection line in a semiconductor device
06/30/2005US20050142855 Method for manufacturing semiconductor device
06/30/2005US20050142854 Methods for preventing copper oxidation in a dual damascene process
06/30/2005US20050142853 Dual damascene process for forming a multi-layer low-K dielectric interconnect
06/30/2005US20050142852 Method of manufacturing multilayer wiring substrate, and multilayer wiring substrate
06/30/2005US20050142851 Method of fabricating MIM capacitor
06/30/2005US20050142850 Method of forming metal wiring of semiconductor device
06/30/2005US20050142847 Method for forming metal wiring in semiconductor device
06/30/2005US20050142844 Method for fabricating metal interconnect in semiconductor device
06/30/2005US20050142841 Method for forming metal pattern to reduce contact resistivity with interconnection contact
06/30/2005US20050142840 Semiconductor device having a multilevel interconnection and a method for manufacturing the same
06/30/2005US20050142838 Method of fabricating a test pattern for junction leakage current
06/30/2005US20050142836 Method of forming bump pad of flip chip and structure thereof
06/30/2005US20050142834 Methods of fabricating semiconductor devices
06/30/2005US20050142833 Method of fabricating semiconductor device
06/30/2005US20050142820 Method of manufacturing gallium nitride based semiconductor light emitting device
06/30/2005US20050142814 Method of manufacturing a semiconductor device by using a matrix frame
06/30/2005US20050142793 Method of manufactuing inductor in semiconductor device
06/30/2005US20050142778 Method for forming inductor in semiconductor device
06/30/2005US20050142737 Methods of fabricating MIM capacitors in semiconductor devices
06/30/2005US20050142711 Method of manufacturing a semiconductor device
06/30/2005US20050142699 Method and structure for electrostatic discharge protection of photomasks
06/30/2005US20050142696 Method of backside grinding a bumped wafer
06/30/2005US20050142693 Semiconductor device with intermediate connector
06/30/2005US20050142692 Wafer-level packaging of optoelectronic devices
06/30/2005US20050142691 Mounting structure of semiconductor chip, semiconductor device and method of making the semiconductor device
06/30/2005US20050142686 Method for forming at least one protective cap
06/30/2005US20050142672 Method for monitoring an ion implanter
06/30/2005US20050142671 Low energy dose monitoring of implanter using implanted wafers
06/30/2005US20050142454 Grid with a space smaller than a minimum pitch allowed by a design rule, and provides hole patterns at lattice points, which are the intersections of the grid; semiconductor integrated circuit manufacturing; flexibility of hole pattern arrangement and quality of hole pattern arrangement easily evaluated
06/30/2005US20050142293 separating pattern layouts into discrete design layers having only parallel layout features; multi-pass features can be avoided, and homogenous, smooth-edged printed patterns can be printed
06/30/2005US20050142242 Moulding assembly for forming at least one protective cap
06/30/2005US20050141826 Package for housing optical semiconductor element and optical semiconductor apparatus
06/30/2005US20050141584 Optical coupler and electronic equipment using same
06/30/2005US20050141574 Cooling device for semiconductor component
06/30/2005US20050141318 Dual chip package
06/30/2005US20050141206 Array capacitors with voids to enable a full-grid socket
06/30/2005US20050141203 Heat dissipation device incorporating with protective cover
06/30/2005US20050141202 Heat sink retention device
06/30/2005US20050141201 Fastener for heat sink
06/30/2005US20050141200 Backside cooling apparatus for modular platforms
06/30/2005US20050141199 Heat Sink Riveted to Memory Module with Upper Slots and Open Bottom Edge for Air Flow
06/30/2005US20050141198 Heat dissipating device incorporating heat pipe
06/30/2005US20050141197 Apparatus and method for cooling integrated circuit devices
06/30/2005US20050141196 Liquid cooling system and electronic equipment using the same
06/30/2005US20050141195 Folded fin microchannel heat exchanger
06/30/2005US20050141194 Acoustic and thermal energy management system
06/30/2005US20050141193 Heat Sink Fan and Method for Manufacturing Heat Sink That Is Used For the Heat Sink Fan
06/30/2005US20050141171 Thin film capacitors on ceramic
06/30/2005US20050141169 Capacitor device, electronic parts packaging structure, and method of manufacturing the capacitor device
06/30/2005US20050141150 Electrical connection of components
06/30/2005US20050140814 Connecting structure for connecting an image pick-up unit to a wiring plate
06/30/2005US20050140579 Structure for a plasma display panel that reduces capacitance between electrodes
06/30/2005US20050140539 Electromagnetic wave absorber, method of manufacturing the same and appliance using the same
06/30/2005US20050140486 Multi-layer chip inductive element
06/30/2005US20050140470 High frequency module
06/30/2005US20050140462 High permeability layered magnetic films to reduce noise in high speed interconnection
06/30/2005US20050140456 Variable-gain cascode amplifier using voltage-controlled and variable inductive load
06/30/2005US20050140436 Dual band power amplifier module for wireless communication devices
06/30/2005US20050140434 Inductor element containing circuit board and power amplifier module
06/30/2005US20050140030 Scribe street width reduction by deep trench and shallow saw cut
06/30/2005US20050140029 Heterogeneous low k dielectric
06/30/2005US20050140028 Forming a chip package having a no-flow underfill
06/30/2005US20050140027 Method and device for manufacturing bonding pads for chip scale packaging
06/30/2005US20050140026 Fabrication methods for electronic system modules
06/30/2005US20050140025 Direct attach chip scale package
06/30/2005US20050140024 Semiconductor device, manufacturing method thereof and electronic equipment
06/30/2005US20050140023 Method of manufacturing a semiconductor device
06/30/2005US20050140022 Multi-chip package structure
06/30/2005US20050140021 Semiconductor device and manufacturing method thereof
06/30/2005US20050140020 Semiconductor interconnection line and method of forming the same
06/30/2005US20050140019 Semiconductor multilayer wiring substrate of coaxial wiring structure and method of fabricating the same
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