| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/07/2005 | US20050146044 Semiconductor devices and method for fabricating the same |
| 07/07/2005 | US20050146042 Method of forming a bonding pad structure |
| 07/07/2005 | US20050146041 Semiconductor device and method for manufacturing the same |
| 07/07/2005 | US20050146036 Method of forming a metal silicide layer on non-planar-topography polysilicon |
| 07/07/2005 | US20050146033 High density chip level package for the packaging of integrated circuits and method to manufacture same |
| 07/07/2005 | US20050146032 Producing without cracking or chipping; sealing sidewall with protective resin then simultaneously grinding and polishing inactive surface on opposite side |
| 07/07/2005 | US20050146031 Low profile stacking system and method |
| 07/07/2005 | US20050146030 Solder ball pad structure |
| 07/07/2005 | US20050146029 Semiconductor element having protruded bump electrodes |
| 07/07/2005 | US20050146027 Power semiconductor device |
| 07/07/2005 | US20050146026 Semiconductor-mounted device and method for producing same |
| 07/07/2005 | US20050146025 Method of forming an opening or cavity in a substrate for receiving an electronic component |
| 07/07/2005 | US20050146024 Electronics unit |
| 07/07/2005 | US20050146023 System and method for self-leveling heat sink for multiple height devices |
| 07/07/2005 | US20050146021 System and method for high performance heat sink for multiple chip devices |
| 07/07/2005 | US20050146020 Single layer configurable logic |
| 07/07/2005 | US20050146018 Package circuit board and package including a package circuit board and method thereof |
| 07/07/2005 | US20050146017 Power supply connection structure to a semiconductor device |
| 07/07/2005 | US20050146016 Electronic package with improved current carrying capability and method of forming the same |
| 07/07/2005 | US20050146014 Seal ring for integrated circuits |
| 07/07/2005 | US20050146013 Wafer-level testing apparatus |
| 07/07/2005 | US20050146012 Method of fabricating a pad over active circuit I.C. with frame support structure |
| 07/07/2005 | US20050146011 Pitch change and chip scale stacking system and method |
| 07/07/2005 | US20050146010 Stackable ceramic FBGA for high thermal applications |
| 07/07/2005 | US20050146008 Semiconductor device |
| 07/07/2005 | US20050146006 Securities, chip mounting product, and manufacturing method thereof |
| 07/07/2005 | US20050146005 Semiconductor device and manufacturing method thereof |
| 07/07/2005 | US20050146004 Semiconductor sensor device and method of producing the same |
| 07/07/2005 | US20050146003 Microdisplay packaging system |
| 07/07/2005 | US20050146002 Multi-part lead frame with dissimilar materials |
| 07/07/2005 | US20050146001 Method of packaging an optical sensor |
| 07/07/2005 | US20050145999 Semiconductor device |
| 07/07/2005 | US20050145998 Surface mount package |
| 07/07/2005 | US20050145997 Layer sequence for producing a composite material for electromechanical components |
| 07/07/2005 | US20050145996 Integrated circuit package for semiconductor devices with improved electric resistance and inductance |
| 07/07/2005 | US20050145994 Compliant passivated edge seal for low-k interconnect structures |
| 07/07/2005 | US20050145993 Semiconductor device and method for manufacturing the same |
| 07/07/2005 | US20050145988 Semiconductor device and method of fabricating the same |
| 07/07/2005 | US20050145987 Semiconductor device |
| 07/07/2005 | US20050145986 Semiconductor device and method of fabricating the same |
| 07/07/2005 | US20050145985 Semiconductor device and method of manufacturing the same |
| 07/07/2005 | US20050145983 Structures and methods of anti-fuse formation in SOI |
| 07/07/2005 | US20050145976 Semiconductor package assembly and method for electrically isolating modules |
| 07/07/2005 | US20050145946 Over-voltage protection device in a portable equipment |
| 07/07/2005 | US20050145938 SOI MOSFET with multi-sided source/drain silicide |
| 07/07/2005 | US20050145897 Manufacturing method of semiconductor device |
| 07/07/2005 | US20050145885 I/O architecture for integrated circuit package |
| 07/07/2005 | US20050145880 Strobe light control circuit and IGBT device |
| 07/07/2005 | US20050145847 Electronic circuit |
| 07/07/2005 | US20050145846 Apparatus and methods for an underfilled integrated circuit package |
| 07/07/2005 | US20050145844 Wiring line assembly and method for manufacturing the same, and thin film transistor array substrate having the wiring line assembly and method for manufacturing the same |
| 07/07/2005 | US20050145841 Method to selectively identify reliability risk die based on characteristics of local regions on the wafer |
| 07/07/2005 | US20050145609 Method of forming an opening or cavity in a substrate for receiving an electronic component |
| 07/07/2005 | US20050145608 Method of forming an opening or cavity in a substrate for receiving an electronic component |
| 07/07/2005 | US20050145602 Test patterns and methods of controlling CMP process using the same |
| 07/07/2005 | US20050145413 Method for fabricating a warpage-preventive circuit board |
| 07/07/2005 | US20050145374 Integrated circuit heat pipe heat spreader with through mounting holes |
| 07/07/2005 | US20050145373 Heat pipe structure |
| 07/07/2005 | US20050145371 Thermal solution for electronics cooling using a heat pipe in combination with active loop solution |
| 07/07/2005 | US20050145369 Structure of a uniform thermal conductive heat dissipation device |
| 07/07/2005 | US20050145367 Thermal interface |
| 07/07/2005 | US20050145366 Heat-sink with large fins-to-air contact area |
| 07/07/2005 | US20050145365 Guide flow heat sink |
| 07/07/2005 | US20050144767 Capacitor, circuit board, method of formation of capacitor, and method of production of circuit board |
| 07/07/2005 | US20050144764 Retaining tool |
| 07/07/2005 | DE4425943B4 Verfahren zur Herstellung eines mehrschichtigen Leiter- bzw. Anschlusselements und Leiter- bzw. Anschlusselement A method for producing a multilayer printed circuit or of the connecting element and conductor terminal element, or |
| 07/07/2005 | DE202005003992U1 Fanless cooling system with heat conducting tube mounted on both sides for cooling electrical/electronic components in computer processors or power electronics has cooling body with one or more fins with bores and/or through openings |
| 07/07/2005 | DE19935677B4 Paste für den Siebdruck von elektrischen Strukturen auf Trägersubstraten Paste for screen printing of electrical structures to support substrates |
| 07/07/2005 | DE19700650B4 Metallleitungsstruktur und Verfahren zu deren Herstellung Metal line structure and process for their preparation |
| 07/07/2005 | DE10392441T5 Eine miniaturisierte Kontaktfeder A miniaturized contact spring |
| 07/07/2005 | DE10361521A1 Method of alternate contacting of two wafers especially a semiconductor and a functional component wafer uses selected laser wavelength to fuse contact metallization only |
| 07/07/2005 | DE10358036A1 Verfahren und Vorrichtung zum Charakterisieren einer Tiefenstruktur in einem Substrat Method and apparatus for characterizing a deep structure in a substrate, |
| 07/07/2005 | DE10357775A1 Marking semiconductor wafers by converting identification numbers into binary coded pattern which is projected bit by bit onto resist layer, followed by etching |
| 07/07/2005 | DE10356885A1 Verfahren zum Gehäusen von Bauelementen und gehäustes Bauelement A method for housings of components and a housed component |
| 07/07/2005 | DE10356153A1 Modul für kontaktlose Chipkarten oder Identifizierungssysteme Module for contactless chip cards or identification systems |
| 07/07/2005 | DE10355953A1 Verfahren zum Galvanisieren und Kontaktvorsprungsanordnung Method of electroplating and contact projection arrangement |
| 07/07/2005 | DE10355508A1 Ultradünne Halbleiterschaltung mit Kontakt-Bumps sowie zugehöriges Herstellungsverfahren Ultra-thin semiconductor circuit with contact bumps and manufacturing method thereof |
| 07/07/2005 | DE10255462B4 Elektrische Anordnung und Verfahren zum Herstellen einer elektrischen Anordnung Electrical arrangement and method for manufacturing an electrical assembly |
| 07/07/2005 | DE102004055215A1 Versetzt gebondete Mehrchip-Halbleitervorrichtung Offset bonded multi-chip semiconductor device |
| 07/07/2005 | DE102004049249A1 Wafer-level electronic module, has monolithic substrate with redistribution structure for providing connector contact coupled to integrated circuit dice, where structure provides electronic device coupled to circuit dice |
| 07/07/2005 | DE102004044547A1 Kühlkörper und Verfahren zur Herstellung desselben Of the same heat sink and method for the production |
| 07/07/2005 | DE102004042784A1 Beschleunigungssensor und Verfahren zum Herstellen eines Beschleunigungssensors Acceleration sensor and method for producing an acceleration sensor |
| 07/07/2005 | DE102004015929A1 Electronic component, typically memory module, containing semiconductor element on main face of circuit board, and heat convecting element extending along entire semiconductor element and thermally coupled to circuit board |
| 07/07/2005 | DE102004014439A1 Circuit assembly with circuit module on supporting circuit board, with housing containing integrated circuit chip and electrically conductive plate, aligned with circuit chip on its underside |
| 07/07/2005 | DE10121241B4 Integrierte Schaltung Integrated circuit |
| 07/07/2005 | CA2551542A1 Laminate |
| 07/07/2005 | CA2550882A1 Capacitor |
| 07/06/2005 | EP1551211A1 Solder-coated ball and method for manufacture thereof, and method for forming semiconductor interconnecting structure |
| 07/06/2005 | EP1551041A1 Thin film capacitors on ceramic substrate |
| 07/06/2005 | EP1550160A1 Integrated circuit package including sealed gaps and prevention of vapor induced failures and method of manufacturing the same |
| 07/06/2005 | EP1550023A2 A scalable computer system having surface-mounted capacitive couplers for intercommunication |
| 07/06/2005 | EP1549472A1 Method and apparatus for manufacturing a packaged semiconductor device, packaged semiconductor device obtained with such a method and metal carrier suitable for use in such a method |
| 07/06/2005 | EP1549216A1 Sensor for determining the effect of anaesthetic treatment by cooling the skin with the sensor |
| 07/06/2005 | EP1483419A4 Lead-free tin-silver-copper alloy solder composition |
| 07/06/2005 | EP1419289B1 Device for continuous electrodeposition and electrical or electronic components manufactured in strip comprising a plated layer by electrodeposition |
| 07/06/2005 | CN2708529Y 电连接器 The electrical connector |
| 07/06/2005 | CN2708505Y Amending pattern for interconnection line error |
| 07/06/2005 | CN2708504Y Wafer packaging structure |
| 07/06/2005 | CN2708503Y Liquid flow path board for water-cooling radiator |
| 07/06/2005 | CN2708502Y Split integrated heat-pipe radiator for heat radiating electronic component |