| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/14/2005 | US20050150880 Laser-based method and system for memory link processing with picosecond lasers |
| 07/14/2005 | US20050150879 Laser-based method and system for memory link processing with picosecond lasers |
| 07/14/2005 | US20050150875 Package sealing method, manufacturing method of electronic device modules, sealing apparatus, and packaged product |
| 07/14/2005 | US20050150813 Foldover packages and manufacturing and test methods therefor |
| 07/14/2005 | US20050150691 High temperature environment tool system and method |
| 07/14/2005 | US20050150685 Configuration having an electronic device electrically connected to a printed circuit board |
| 07/14/2005 | US20050150683 Methods of fabricating substrates and substrate precursor structures resulting therefrom |
| 07/14/2005 | US20050150649 Heat release sheet and heat sink |
| 07/14/2005 | US20050150637 Heat sink and multi-directional passages thereof |
| 07/14/2005 | US20050150636 Heat pipe radiator for eliminating heat of electric component |
| 07/14/2005 | US20050150633 Heat sink and method for manufacturing the same |
| 07/14/2005 | US20050150539 Monolithic thin-film thermoelectric device including complementary thermoelectric materials |
| 07/14/2005 | US20050150536 Method for forming a monolithic thin-film thermoelectric device including complementary thermoelectric materials |
| 07/14/2005 | US20050150535 Method for forming a thin-film thermoelectric device including a phonon-blocking thermal conductor |
| 07/14/2005 | US20050150402 Printing device, production unit, and production method of electronic parts |
| 07/14/2005 | DE19630902B4 Einrichtung zur Temperaturüberwachung in einer leistungselektronischen Anordnung Means for monitoring the temperature in a power electronic device |
| 07/14/2005 | DE19549750B4 Elektronikbauteil mit anodisch gebontetem Leiterrahmen Electronic component having an anodically gebontetem lead frame |
| 07/14/2005 | DE19514162B4 Temperaturgeber und Verfahren zur Abstimmung der Kennlinie eines Temperaturgebers Temperature sensor and method for tuning the characteristics of a temperature sensor |
| 07/14/2005 | DE10358324A1 Leistungstransistorzelle und Leistungstransistorbauelement mit Schmelzsicherung Power transistor cell and power transistor device with fuse |
| 07/14/2005 | DE10345825A1 Comparison method for comparing programmable integrated circuit units, uses two memory units for use-specific data with second data being non-volatile |
| 07/14/2005 | DE10327126B4 Verfahren zur Herstellung von Chipmodulen Process for the preparation of chip modules |
| 07/14/2005 | DE102004011202A1 Semiconductor component e.g. dynamic RAM, cooling device for computer system, has fan with air pressure outlet side connected to connector that directs cooling air from fan to components |
| 07/14/2005 | CA2551299A1 Heat exchanger |
| 07/14/2005 | CA2547358A1 Thermal interface material and solder preforms |
| 07/13/2005 | EP1553812A2 Semiconductor chip and circuit including a shielded inductance |
| 07/13/2005 | EP1553806A1 Hygroscopic molding |
| 07/13/2005 | EP1553700A2 Surface acoustic wave device |
| 07/13/2005 | EP1553630A1 Modular board device and high frequency module and method for producing them |
| 07/13/2005 | EP1553629A2 Electrically conductive adhesive sheet, method of manufacturing the same, and electric power conversion equipment |
| 07/13/2005 | EP1553628A1 Heat sink and heat spreader assembly |
| 07/13/2005 | EP1553627A1 Material for a heat dissipation substrate for mounting a semiconductor and a ceramic package using the same |
| 07/13/2005 | EP1553626A1 Multilayer printed wiring board |
| 07/13/2005 | EP1553625A1 Method for fabrication of a contact structure |
| 07/13/2005 | EP1553623A1 Anisotropic conductivity connector, probe member, wafer inspecting device, and wafer inspecting method |
| 07/13/2005 | EP1553622A1 Anisotropic conductivity connector, conductive paste composition, probe member, wafer inspecting device, and wafer inspecting method |
| 07/13/2005 | EP1553621A1 Anisotropic conductivity connector, conductive paste composition, probe member, wafer inspecting device, and wafer inspecting method |
| 07/13/2005 | EP1553205A1 Sputter target for forming thin film interconnector and thin film interconnector line |
| 07/13/2005 | EP1553067A1 Aluminum nitride sintered compact, metallized substrate, heater,jig and method for producing aluminum nitride sintered compact |
| 07/13/2005 | EP1552735A2 Heat sink made from longer and shorter graphite sheets |
| 07/13/2005 | EP1552560A1 A lamp and method of producing a lamp |
| 07/13/2005 | EP1552559A1 Semiconductor device and method of manufacturing thereof |
| 07/13/2005 | EP1552558A1 Support device for monolithically integrated circuits |
| 07/13/2005 | EP1552557A1 Flat plate heat transferring apparatus and manufacturing method thereof |
| 07/13/2005 | EP1552556A2 Heat spreader |
| 07/13/2005 | EP1552555A1 An electronic and optoelectronic component packaging technique |
| 07/13/2005 | EP1552329A1 Package for optical module with compact ceramic inserts |
| 07/13/2005 | EP1552258A1 Hermetic packaging |
| 07/13/2005 | EP0932500B1 Method to control cavity dimensions of fired multilayer circuit boards on a support |
| 07/13/2005 | CN2710308Y Wiring substrate |
| 07/13/2005 | CN2710289Y Mobile phone antenna circuit |
| 07/13/2005 | CN2710168Y Photoelectric semiconductor component |
| 07/13/2005 | CN2710162Y Integrated heat tube radiator with outside auxiliary guide radiation |
| 07/13/2005 | CN2710161Y Packing structure of analog-digital signal coversion chip module |
| 07/13/2005 | CN2710160Y Circuit substrate |
| 07/13/2005 | CN2710159Y Power LED mounting |
| 07/13/2005 | CN2710158Y Insulation structure of laminited chip type electronic element |
| 07/13/2005 | CN1639978A Improved emitter turn-off thyristors and their drive circuits |
| 07/13/2005 | CN1639933A Semiconductor light emitting device and plant cultivating system |
| 07/13/2005 | CN1639866A EMI shield including a lossy medium |
| 07/13/2005 | CN1639865A Semiconductor device having a wire bond pad and method therefor |
| 07/13/2005 | CN1639864A Multi-row leadframe |
| 07/13/2005 | CN1639863A Thermally enhanced microcircuit package and method of forming same |
| 07/13/2005 | CN1639862A Semiconductor |
| 07/13/2005 | CN1639861A Process for making a MIM capacitor |
| 07/13/2005 | CN1639852A B-stageable underfill encapsulant and method for its application |
| 07/13/2005 | CN1639850A On-wafer monitoring system |
| 07/13/2005 | CN1639812A Spiral inductor and transformer |
| 07/13/2005 | CN1639283A Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts |
| 07/13/2005 | CN1639282A Varnish containing polyamide resin and use thereof |
| 07/13/2005 | CN1639258A Encapsulating epoxy resin composition, and electronic parts device using the same |
| 07/13/2005 | CN1639224A Encapsulating epoxy resin composition, and electronic parts device using the same |
| 07/13/2005 | CN1639223A Phosphorus-containing epoxy resin, phosphorus-containing epoxy resin composition, process for producing the same, and sealing material and laminate board |
| 07/13/2005 | CN1639222A Low-corrosive epoxy resins and production method therefor |
| 07/13/2005 | CN1638952A Thermal interface materials |
| 07/13/2005 | CN1638617A Heat sink fan and method for manufacturing heat sink that is used for the heat sink fan |
| 07/13/2005 | CN1638611A Printed circuit board and package having oblique vias |
| 07/13/2005 | CN1638610A Method for producing circuit substrate, and circuit substrate and electronic machine |
| 07/13/2005 | CN1638609A Connecting structure for connecting an image pick-up unit to a wiring plate |
| 07/13/2005 | CN1638602A Metal-containing resin particle, resin particle, electronic circuit substrate, and method of producing electronic circuit |
| 07/13/2005 | CN1638600A Wiring circuit board and production method thereof |
| 07/13/2005 | CN1638598A Plasma treatment device and substrate surface treatment device |
| 07/13/2005 | CN1638557A Organic electroluminescent display device and method of fabricating the same |
| 07/13/2005 | CN1638194A Adhesive film for circuit connection, and circuit connection structure |
| 07/13/2005 | CN1638158A Surface mount type semiconductor device and lead frame structure thereof |
| 07/13/2005 | CN1638152A LSI package, interposer, interface module and signal processing LSI monitoring circuit |
| 07/13/2005 | CN1638128A Semiconductor integrated circuit device |
| 07/13/2005 | CN1638124A Radio frequency semiconductor device and method of manufacturing the same |
| 07/13/2005 | CN1638122A Method of manufacturing a semiconductor device |
| 07/13/2005 | CN1638121A 半导体集成电路装置 The semiconductor integrated circuit device |
| 07/13/2005 | CN1638120A Semiconductor-mounted device and method for producing same |
| 07/13/2005 | CN1638119A 电力半导体装置 Power semiconductor devices |
| 07/13/2005 | CN1638118A Semiconductor apparatus |
| 07/13/2005 | CN1638117A High frequency module |
| 07/13/2005 | CN1638115A Method and system for hermetically sealing packages for optics |
| 07/13/2005 | CN1638114A Power converter package with enhanced thermal management |
| 07/13/2005 | CN1638113A Semiconductor integrated circuit apparatus |
| 07/13/2005 | CN1638112A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 07/13/2005 | CN1638111A Method of manufacturing a semiconductor device |
| 07/13/2005 | CN1638110A Semiconductor device having layered chips |
| 07/13/2005 | CN1638109A 半导体器件 Semiconductor devices |