| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/12/2005 | US6916688 Apparatus and method for a wafer level chip scale package heat sink |
| 07/12/2005 | US6916687 Bump process for flip chip package |
| 07/12/2005 | US6916686 Method of manufacturing a semiconductor device |
| 07/12/2005 | US6916683 Methods of fabricating a molded ball grid array |
| 07/12/2005 | US6916682 Semiconductor package device for use with multiple integrated circuits in a stacked configuration and method of formation and testing |
| 07/12/2005 | US6916679 Methods of and device for encapsulation and termination of electronic devices |
| 07/12/2005 | US6916671 Gate oxide measurement apparatus |
| 07/12/2005 | US6916670 Electronic package repair process |
| 07/12/2005 | US6916668 Methods for providing a magnetic shield for an integrated circuit having magnetoresistive memory cells |
| 07/12/2005 | US6916538 A thermosetting resin composition which contains: an epoxy resin having at least two epoxy groups per molecule; a hardener; a compound represented by the following general formula (1) or (2); and a microcapsule type hardening |
| 07/12/2005 | US6916430 Superconducting heat transfer medium |
| 07/12/2005 | US6916185 Connection of integrated circuit to a substrate |
| 07/12/2005 | US6916181 Remountable connector for land grid array packages |
| 07/12/2005 | US6916122 Modular heat sinks |
| 07/12/2005 | US6915844 Cooling device |
| 07/12/2005 | US6915842 Heat-transfer device |
| 07/12/2005 | US6915653 Semiconductor cooling device |
| 07/12/2005 | US6915566 Method of fabricating flexible circuits for integrated circuit interconnections |
| 07/12/2005 | US6915551 Multi-barrel die transfer apparatus and method for transferring dies therewith |
| 07/12/2005 | CA2310765C Stress relaxation type electronic component, a stress relaxation type circuit board, and a stress relaxation type electronic component mounted member |
| 07/07/2005 | WO2005062688A1 Method of attaching non-adhesive thermal interface materials |
| 07/07/2005 | WO2005062384A2 Method of forming bridging lateral nanowires and device manufactured thereby |
| 07/07/2005 | WO2005062381A2 Bump power connections of a semiconductor die |
| 07/07/2005 | WO2005062380A1 Bipolar and cmos integration with reduced contact height |
| 07/07/2005 | WO2005062371A2 Plastic lead frames utilizing reel-to-reel processing |
| 07/07/2005 | WO2005062370A1 A method of making a microelectronic assembly |
| 07/07/2005 | WO2005062369A1 Combinations of resin compositions and methods of use thereof |
| 07/07/2005 | WO2005062368A1 Semiconductor device and method of manufacturing thereof |
| 07/07/2005 | WO2005062367A1 I/o sites for probe test and wire bond |
| 07/07/2005 | WO2005062363A1 Method of etching a semiconductor device |
| 07/07/2005 | WO2005062355A1 Capacitor |
| 07/07/2005 | WO2005062348A1 Method for producing a semiconductor product |
| 07/07/2005 | WO2005062318A1 Electronic component |
| 07/07/2005 | WO2005061972A1 Cooling of electronics by electrically conducting fluids |
| 07/07/2005 | WO2005061615A1 Curable resin composition |
| 07/07/2005 | WO2005061575A1 Encapsulant mixture having a polymer bound catalyst |
| 07/07/2005 | WO2005061376A1 Method for containing a device and a corresponding device |
| 07/07/2005 | WO2005061375A1 Microcomponent comprising a hermetically-sealed cavity and a plug, and method of producing one such microcomponent |
| 07/07/2005 | WO2005061374A1 Microcomponent comprising a hermetic microcavity and method for production of such a microcomponent |
| 07/07/2005 | WO2005061227A1 Multilayer body |
| 07/07/2005 | WO2005060450A2 Land grid array packaged device and method of forming same |
| 07/07/2005 | WO2005060370A2 Cooling of high power density devices by electrically conducting fluids |
| 07/07/2005 | WO2005052990A3 Semiconductor device with magneticaly permeable heat sink |
| 07/07/2005 | WO2005048323A3 Detachable on package voltage regulation module |
| 07/07/2005 | WO2005029555A3 Nanostructure augmentation of surfaces for enhanced thermal transfer |
| 07/07/2005 | WO2005021828A3 Copper-containing pvd targets and methods for their manufacture |
| 07/07/2005 | WO2005013352A3 Method for the production of a semiconductor element with a plastic housing and support plate for carrying out said method |
| 07/07/2005 | WO2005011349A3 Cooling device for leading dissipated heat away from an electrical or electronic component or assembly groups |
| 07/07/2005 | WO2005006556A3 Integrated circuit with interface tile for coupling to a stacked -die second integrated circuit |
| 07/07/2005 | WO2005004238A3 Offset dependent resistor for measuring misalignment of stitched masks |
| 07/07/2005 | WO2004107440B1 Electronic parts, module, module assembling method, identification method, and environment setting method |
| 07/07/2005 | WO2004077525A3 Ball grid array with bumps |
| 07/07/2005 | WO2004045016A3 Method and structures for enhanced temperature control of high power components on multilayer ltcc and ltcc-m boards |
| 07/07/2005 | WO2002099849A3 Apparatus for microdeposition of multiple fluid materials |
| 07/07/2005 | US20050148721 Thin bond-line silicone adhesive composition and method for preparing the same |
| 07/07/2005 | US20050148695 Organic component comprises long-chain cycloaliphatic epoxy resin, short-chain cycloaliphatic epoxy resin, cyanate ester, lewis acid catalyst; useful in die attach adhesives, underfills, encapsulants, via fills, prepreg binders |
| 07/07/2005 | US20050148237 Electronic circuit device |
| 07/07/2005 | US20050148202 Method for sealing porous materials during chip production and compounds therefor |
| 07/07/2005 | US20050148180 Photoresist process to enable sloped passivation bondpad openings for ease of metal step coverings |
| 07/07/2005 | US20050148177 Method and an apparatus for manufacturing a semiconductor device |
| 07/07/2005 | US20050148174 Contact-connection of nanotubes |
| 07/07/2005 | US20050148172 Seed layers for metallic interconnects |
| 07/07/2005 | US20050148164 A suspension for filling via holes in silicon and method for making the same |
| 07/07/2005 | US20050148160 Encapsulated semiconductor components and methods of fabrication |
| 07/07/2005 | US20050148159 Process of cutting electronic package |
| 07/07/2005 | US20050148124 ESD protection for semiconductor products |
| 07/07/2005 | US20050148121 Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device |
| 07/07/2005 | US20050148117 Method for fabricating a flash-preventing window ball grid array semiconductor package |
| 07/07/2005 | US20050148116 Alignment and orientation features for a semiconductor package |
| 07/07/2005 | US20050148115 Programmed material consolidation methods for fabricating heat sinks |
| 07/07/2005 | US20050148112 Method of manufacturing an electronic device, and electronic device |
| 07/07/2005 | US20050147927 Patterning semiconductor layers using phase shifting and assist features |
| 07/07/2005 | US20050147913 High volume reticle (HVR) configured for registration with a low volume reticle; an array of dies; plurality of scribeswrapped around each die in array of dies; processing of gate arrays, embedded arrays and rapid chips |
| 07/07/2005 | US20050147839 metallic alloy foil for electroconductive, thermoconductive paths in a direction along the plane of the sheet; use in vehicle, convert direct current power supplied from a battery to alternate current power, then supply to the motor engine; lead-free |
| 07/07/2005 | US20050147801 Use of gold surface finish on a copper wire-bond substrate, method of making same, and method of testing same |
| 07/07/2005 | US20050147762 Method to fabricate amorphous electroless metal layers |
| 07/07/2005 | US20050147522 Conductive material and method for filling via-hole |
| 07/07/2005 | US20050147500 Method and apparatus for two-phase start-up operation |
| 07/07/2005 | US20050146977 Circuit |
| 07/07/2005 | US20050146953 Semiconductor integrated circuit device |
| 07/07/2005 | US20050146854 High frequency module |
| 07/07/2005 | US20050146853 Heat dissipating device |
| 07/07/2005 | US20050146852 Parallel heat exchanger for a component in a mobile system |
| 07/07/2005 | US20050146850 Active cooling system for cpu |
| 07/07/2005 | US20050146821 Insulating substrate for IC packages having integral ESD protection |
| 07/07/2005 | US20050146632 Solid image-pickup device and method for manufacturing the solid image pickup device |
| 07/07/2005 | US20050146411 Integrated inductor |
| 07/07/2005 | US20050146403 High-frequency module and its manufacturing method |
| 07/07/2005 | US20050146058 Method of manufacturing semiconductor device |
| 07/07/2005 | US20050146057 Durable, reliable; reduced material use; smaller, lighter; permanently interlocked; noncracking, nonpeeling |
| 07/07/2005 | US20050146056 Thinned without cracking or chipping while dicing |
| 07/07/2005 | US20050146055 Preventing cracking and/or chipping both at time of dicing and during handling; using resin protective film on active surface |
| 07/07/2005 | US20050146054 Electronic package structure and the packaging process thereof |
| 07/07/2005 | US20050146053 Wafer stacking with anisotropic conductive adhesive |
| 07/07/2005 | US20050146052 Semiconductor device and semiconductor module |
| 07/07/2005 | US20050146051 Semiconductor device and method of manufacturing the same |
| 07/07/2005 | US20050146050 Flip chip package structure and chip structure thereof |
| 07/07/2005 | US20050146049 RF and MMIC stackable micro-modules |
| 07/07/2005 | US20050146048 Damascene interconnect structures |
| 07/07/2005 | US20050146047 Method for fabricating a semiconductor interconnect having conductive spring contacts |