| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/13/2005 | CN1638108A Method of manufacturing a semiconductor device |
| 07/13/2005 | CN1638107A Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device |
| 07/13/2005 | CN1638106A Device to cool integrated circuit element and disk drive having the same |
| 07/13/2005 | CN1638105A Semiconductor device |
| 07/13/2005 | CN1638104A Hybrid integrated circuit device and manufacturing method of the same |
| 07/13/2005 | CN1638103A Tape circuit substrate with reduced size of base film |
| 07/13/2005 | CN1638102A High-frequency device |
| 07/13/2005 | CN1638101A Inductor element containing circuit board and power amplifier module |
| 07/13/2005 | CN1638100A Semiconductor device, manufacturing method thereof and electronic equipment |
| 07/13/2005 | CN1638094A Manufacturing method of thin film integrated circuit device and manufacturing method of non-contact type thin film integrated circuit device |
| 07/13/2005 | CN1638092A Dicing die-bonding film |
| 07/13/2005 | CN1638091A Novel nitride barrier layer to prevent metal leakage issue in a dual damascene structure |
| 07/13/2005 | CN1638089A Damascene interconnect structures including etchback for low-k dielectric materials |
| 07/13/2005 | CN1638078A Electronic element, method for producing electronic element and electronic apparatus |
| 07/13/2005 | CN1638076A Semiconductor chip and manufacturing method for the same, and semiconductor device |
| 07/13/2005 | CN1638074A Semiconductor device and electronic equipment using the same |
| 07/13/2005 | CN1638073A Method of forming bump pad of flip chip and structure thereof |
| 07/13/2005 | CN1638072A Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted body |
| 07/13/2005 | CN1638071A Manufacturing method of a semiconductor device |
| 07/13/2005 | CN1638069A Method of manufacturing a semiconductor device by using a matrix frame |
| 07/13/2005 | CN1638053A Method of adjusting deviation of critical dimension of patterns |
| 07/13/2005 | CN1638048A Novel process for improved hot carrier injection |
| 07/13/2005 | CN1638036A Structural body for producing electronic device and method for producing electronic device using the same |
| 07/13/2005 | CN1638035A Method of manufactuing inductor in semiconductor device |
| 07/13/2005 | CN1638020A Manufacturing method of semiconductor device, semiconductor device, circuit substrate and electronic equipment |
| 07/13/2005 | CN1638016A Metallic photonic box and its fabrication techniques and light source |
| 07/13/2005 | CN1637973A Thin film capacitors on ceramic |
| 07/13/2005 | CN1637971A Capacitor and method for manufacturing the same |
| 07/13/2005 | CN1637960A Direct application voltage variable material, components thereof and devices employing |
| 07/13/2005 | CN1637957A Thick film conductor case compositions for LTCC tape |
| 07/13/2005 | CN1637681A Electronic apparatus having a circulating path of liquid coolant |
| 07/13/2005 | CN1637566A Flat panel display device and method of fabricating the same |
| 07/13/2005 | CN1637487A Chip-mounted film package |
| 07/13/2005 | CN1637377A Pump-free water-cooling system |
| 07/13/2005 | CN1637174A Electrolytic stripping method |
| 07/13/2005 | CN1637169A Electroplating method for a semiconductor device |
| 07/13/2005 | CN1637109A Uv curable protective encapsulant |
| 07/13/2005 | CN1637105A Adhesive for circuit components connection circuit board and producing method thereof |
| 07/13/2005 | CN1637097A Composition for forming silica based coating film, silica based coating film and method for preparation thereof, and electronic parts |
| 07/13/2005 | CN1637073A Organopolysiloxane composition and electronic part encapsulated therewith |
| 07/13/2005 | CN1636987A Epoxy compound, preparation method thereof, and use thereof |
| 07/13/2005 | CN1636704A Coupling structure for component and coupling method |
| 07/13/2005 | CN1211000C Rigidity flexible base board and camera using the same |
| 07/13/2005 | CN1210799C Semiconductor device and its manufacture |
| 07/13/2005 | CN1210798C Semiconductor device and making method |
| 07/13/2005 | CN1210797C Power transistor module, power amplifier and fabrication method thereof |
| 07/13/2005 | CN1210796C Power transistor module, power amplifier and method in fabrication thereof |
| 07/13/2005 | CN1210795C Electronic device and its manufacturing method |
| 07/13/2005 | CN1210794C Carrier-belt automatic bonding type semiconductor device |
| 07/13/2005 | CN1210793C Lead frame and semiconductor pack having same and mfg. method of semiconductor pack |
| 07/13/2005 | CN1210792C Semiconductor device and making method thereof |
| 07/13/2005 | CN1210791C Semiconductor package |
| 07/13/2005 | CN1210790C Refrigerating cooler of semiconductor element or device |
| 07/13/2005 | CN1210789C Semiconductor packaging element with heat sink structure |
| 07/13/2005 | CN1210788C Package sealing method, method for manufacturing module for electronic device, sealing device and package element |
| 07/13/2005 | CN1210774C Electrostatic discharge protection structure with defect area inside drain and its making process |
| 07/13/2005 | CN1210683C Planar display and its driver chip |
| 07/13/2005 | CN1210325C Liquid epoxy resin emulsions, method for production and use thereof |
| 07/12/2005 | US6917638 Heat radiator for electronic device and method of making it |
| 07/12/2005 | US6917526 Electronic component module |
| 07/12/2005 | US6917522 Apparatus and method for cooling integrated circuit devices |
| 07/12/2005 | US6917521 Centrifugal blower unit having swirl chamber, and electronic apparatus equipped with centrifugal blower unit |
| 07/12/2005 | US6917120 Microchip controller board |
| 07/12/2005 | US6917119 Low fabrication cost, high performance, high reliability chip scale package |
| 07/12/2005 | US6917118 Semiconductor device |
| 07/12/2005 | US6917116 Electrical connection device between two tracks of an integrated circuit |
| 07/12/2005 | US6917115 Alignment pattern for a semiconductor device manufacturing process |
| 07/12/2005 | US6917113 Useful for the assembly of passive components and organic substrates with conventional ceramic packages |
| 07/12/2005 | US6917110 Semiconductor device comprising an interconnect structure with a modified low dielectric insulation layer |
| 07/12/2005 | US6917109 Air gap structure and formation method for reducing undesired capacitive coupling between interconnects in an integrated circuit device |
| 07/12/2005 | US6917108 Reliable low-k interconnect structure with hybrid dielectric |
| 07/12/2005 | US6917107 Board-on-chip packages |
| 07/12/2005 | US6917106 Selective ball-limiting metallurgy etching processes for fabrication of electroplated tin bumps |
| 07/12/2005 | US6917105 Integrating chip scale packaging metallization into integrated circuit die structures |
| 07/12/2005 | US6917104 Integrated circuit chip, electronic device and method of manufacturing the same, and electronic instrument |
| 07/12/2005 | US6917103 Molded semiconductor power device having heat sinks exposed on one surface |
| 07/12/2005 | US6917099 Die carrier with fluid chamber |
| 07/12/2005 | US6917098 Three-level leadframe for no-lead packages |
| 07/12/2005 | US6917097 Dual gauge leadframe |
| 07/12/2005 | US6917095 Integrated radio frequency circuits |
| 07/12/2005 | US6917094 Electrode for electric double layer capacitor |
| 07/12/2005 | US6917092 Wiring structure having a slit dummy |
| 07/12/2005 | US6917091 High power semiconductor device having source electrodes connected by air bridges and having opposite current path directions |
| 07/12/2005 | US6917090 Chip scale image sensor package |
| 07/12/2005 | US6917089 Integrated sensor packages and methods of making the same |
| 07/12/2005 | US6917086 Trilayered beam MEMS device and related methods |
| 07/12/2005 | US6917063 Ferroelectric memory and method of fabricating the same |
| 07/12/2005 | US6917052 Modified contact for programmable devices |
| 07/12/2005 | US6916995 Optimization of routing layers and board space requirements for ball grid array package implementations including single and multi-layer routing |
| 07/12/2005 | US6916743 Semiconductor device and method for manufacturing thereof |
| 07/12/2005 | US6916739 Structural element and process for its production including bonding through an amorphous hard layer |
| 07/12/2005 | US6916736 Method of forming an intermetal dielectric layer |
| 07/12/2005 | US6916735 Method for forming aerial metallic wiring on semiconductor substrate |
| 07/12/2005 | US6916734 Contact-forming method |
| 07/12/2005 | US6916732 Method of forming bumps |
| 07/12/2005 | US6916725 Method for manufacturing semiconductor device, and method for manufacturing semiconductor module |
| 07/12/2005 | US6916724 Semiconductor device and method for manufacturing the same |
| 07/12/2005 | US6916723 Methods of forming rugged semiconductor-containing surfaces |
| 07/12/2005 | US6916719 Method and apparatus for non-conductively interconnecting integrated circuits |
| 07/12/2005 | US6916701 Method for fabricating a silicide layer of flat cell memory |