| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/20/2005 | CN1211861C Method for producing a semiconductor component and semiconductor component produced by said method |
| 07/20/2005 | CN1211858C High frequency power transistor device |
| 07/20/2005 | CN1211856C Separable connecting bridge (fuse) and connectable line interuption (anti-fuse) and process for producing and activating fuse and anti-fuse |
| 07/20/2005 | CN1211855C Conductive copper wire with redundant liner |
| 07/20/2005 | CN1211854C Chip size package and method of fabricating the same |
| 07/20/2005 | CN1211853C Mother electric device, its producing method and electronic device and its producing device |
| 07/20/2005 | CN1211849C Method for mfg. recognizer, jointing device and circuit apparatus |
| 07/20/2005 | CN1211847C Pad metallization over active circuitry |
| 07/20/2005 | CN1211846C Semiconductor device manufacture method |
| 07/20/2005 | CN1211845C Method for making ceramic chip package |
| 07/20/2005 | CN1211723C Computer card making method |
| 07/20/2005 | CN1211709C Photoreactive resin composition and circuit board and method for making multilayer ceramic base material |
| 07/20/2005 | CN1211416C Preparation of cross-linked 2-dimensional polymers with sidedness from alpha beta-lactones |
| 07/20/2005 | CN1211197C Method for producing three-dimensionally arranged conducting and connecting structures for volumetric and energy flows |
| 07/20/2005 | CN1211178C System and method for reducing welding program error for IC welding machine |
| 07/19/2005 | US6920052 Dynamic isolating mount for processor packages |
| 07/19/2005 | US6920051 Hybrid capacitor, circuit, and system |
| 07/19/2005 | US6920047 Electrically isolated module |
| 07/19/2005 | US6920045 Heat-dissipating assembly |
| 07/19/2005 | US6919778 Duplexer with an impedance matching circuit and an electronic device using the same |
| 07/19/2005 | US6919645 Die package |
| 07/19/2005 | US6919644 Semiconductor device manufacturing method and semiconductor device manufactured thereby |
| 07/19/2005 | US6919643 Multi-chip module semiconductor devices |
| 07/19/2005 | US6919640 Semiconductor device having a contact window including a lower region with a wider width to provide a lower contact resistance |
| 07/19/2005 | US6919639 Multiple copper vias for integrated circuit metallization and methods of fabricating same |
| 07/19/2005 | US6919638 Method, structure and process flow to reduce line-line capacitance with low-K material |
| 07/19/2005 | US6919637 Interconnect structure for an integrated circuit and method of fabrication |
| 07/19/2005 | US6919636 For semiconductor device exhibiting increased operating speed/improved reliability; chemical vapor deposition |
| 07/19/2005 | US6919635 High density microvia substrate with high wireability |
| 07/19/2005 | US6919632 Semiconductor integrated circuit device with I/O cell and connection member |
| 07/19/2005 | US6919631 Structures for improving heat dissipation in stacked semiconductor packages |
| 07/19/2005 | US6919630 Semiconductor package with heat spreader |
| 07/19/2005 | US6919628 Stack chip package structure |
| 07/19/2005 | US6919626 High density integrated circuit module |
| 07/19/2005 | US6919625 Surface mount multichip devices |
| 07/19/2005 | US6919624 Semiconductor device with exposed electrodes |
| 07/19/2005 | US6919623 Hydrogen diffusion hybrid port and method of forming |
| 07/19/2005 | US6919622 For improved signal transduction/reduced electrical noises; for packaging |
| 07/19/2005 | US6919621 Bonding pad design for impedance matching improvement |
| 07/19/2005 | US6919620 Compact flash memory card with clamshell leadframe |
| 07/19/2005 | US6919619 Actively-shielded signal wires |
| 07/19/2005 | US6919618 Shielding device for integrated circuits |
| 07/19/2005 | US6919617 Semiconductor device and manufacturing method thereof |
| 07/19/2005 | US6919616 Chip with passive electrical contacts |
| 07/19/2005 | US6919614 Circuit with an integrated voltage regulator and its manufacturing process |
| 07/19/2005 | US6919602 Gate-coupled MOSFET ESD protection circuit |
| 07/19/2005 | US6919600 Permanently on transistor implemented using a double polysilicon layer CMOS process with buried contact |
| 07/19/2005 | US6919591 Thin film transistor array panel for a liquid crystal display |
| 07/19/2005 | US6919535 Electric heating for motor vehicles |
| 07/19/2005 | US6919525 Comprises heat source/sink with high efficiency diamond material interposed between and thermally coupled thereto; for cooling semiconductors |
| 07/19/2005 | US6919513 For decreasing deformation/damage from contact with sprocket teeth during assembly |
| 07/19/2005 | US6919508 Build-up structures with multi-angle vias for chip to chip interconnects and optical bussing |
| 07/19/2005 | US6919507 Comprises circuit situated in a housing, partially covered with a protective layer with varying hardnesses for optimized mechanical/thermal loading capacity |
| 07/19/2005 | US6919504 Flexible heat sink |
| 07/19/2005 | US6919420 Thermosetting resins comprising polyepoxides used as reusable wafer underfillings for microelectronic packages |
| 07/19/2005 | US6919387 Electromagnetic wave absorber, method of manufacturing the same and appliance using the same |
| 07/19/2005 | US6919273 Method for forming TiSiN film, diffusion preventive film comprising TiSiN film, semiconductor device and its production method, and apparatus for forming TiSiN film |
| 07/19/2005 | US6919265 Semiconductor device with elongated interconnecting member and fabrication method thereof |
| 07/19/2005 | US6919264 Method for the solder-stop structuring of elevations on wafers |
| 07/19/2005 | US6919262 Release sheet and a protective film forming layer of a thermosetting or energy ray-curable component and binder component formed on a detachable surface of the release sheet |
| 07/19/2005 | US6919261 Method and resulting structure for manufacturing semiconductor substrates |
| 07/19/2005 | US6919234 Method for producing an antifuse in a substrate and an antifuse structure for integration in a substrate |
| 07/19/2005 | US6919232 Process for producing a semiconductor chip |
| 07/19/2005 | US6919231 Methods of forming channels on an integrated circuit die and die cooling systems including such channels |
| 07/19/2005 | US6919230 Method of eliminating uncontrolled voids in sheet adhesive layer |
| 07/19/2005 | US6919229 Method for controlling the depth of immersion of a semiconductor element in an exposed surface of a viscous fluid |
| 07/19/2005 | US6919227 Semiconductor part of component mounting, mounting structure and mounting method |
| 07/19/2005 | US6919226 Method for producing a multi-chip circuit module including a multi-layered wiring section utilizing a via-on-via structure |
| 07/19/2005 | US6919225 Methods and apparatuses relating to block configurations and fluidic self-assembly processes |
| 07/19/2005 | US6919223 Method of manufacturing semiconductor resin molding and resin member employed therefor |
| 07/19/2005 | US6919222 Method for sealing a semiconductor device and apparatus embodying the method |
| 07/19/2005 | US6919220 Method of making chip package with grease heat sink |
| 07/19/2005 | US6919219 Photon-blocking layer |
| 07/19/2005 | US6919218 Manufacturing method for sealing a semiconductor device |
| 07/19/2005 | US6919137 Can be applied to a wiring structure, a circuit |
| 07/19/2005 | US6919124 Ceramic substrate |
| 07/19/2005 | US6918984 Photocurable adhesive compositions, reaction products of which have low halide ion content |
| 07/19/2005 | US6918983 Adhesion method and electronic component |
| 07/19/2005 | US6918819 Method for defect reduction |
| 07/19/2005 | US6918438 Finned heat sink |
| 07/19/2005 | US6918437 Heatsink buffer configuration |
| 07/19/2005 | US6918431 Cooling assembly |
| 07/19/2005 | US6918429 Dual-layer heat dissipating structure |
| 07/19/2005 | US6918178 Method of attaching a heat sink to an IC package |
| 07/14/2005 | WO2005064688A1 Semiconductor module |
| 07/14/2005 | WO2005064679A1 Wafer with optical control modules in ic fields |
| 07/14/2005 | WO2005064678A1 Wafer with optical control modules in dicing paths |
| 07/14/2005 | WO2005064677A1 Thermal interface material and solder preforms |
| 07/14/2005 | WO2005064676A1 Assembly of a component mounted on a transfer surface |
| 07/14/2005 | WO2005064675A1 Radiator with radially arranged heat radiating fins, cooling device with radiator, and electronic apparatus mounted with cooling device |
| 07/14/2005 | WO2005064674A1 Cooling device with heat radiating section where liquid-like refrigerant flows and electronic apparatus with cooling device |
| 07/14/2005 | WO2005064673A2 Integrating passive components on spacer in stacked dies |
| 07/14/2005 | WO2005064667A1 Ic chip mounting body manufacturing method and manufacturing device |
| 07/14/2005 | WO2005064646A2 An integrated circuit package substrate having a thin film capacitor structure |
| 07/14/2005 | WO2005064641A2 Semiconductor device and method of fabricating the same |
| 07/14/2005 | WO2005064245A2 Heat exchanger |
| 07/14/2005 | WO2005062998A2 Metal interconnect system and method for direct die attachment |
| 07/14/2005 | WO2005048344A3 Diode |
| 07/14/2005 | WO2005038907A3 Heat-conducting coating of electronic circuit assemblies |
| 07/14/2005 | WO2005038876A3 Wiring protection element for laser deleted tungsten fuse |