Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2005
07/14/2005WO2005034239A3 Variable inductor for integrated circuit and printed circuit board
07/14/2005WO2005008348A3 System and method for thermal management using distributed synthetic jet actuators
07/14/2005WO2004112128A3 Low profile stacking system and method
07/14/2005WO2004019379A3 Compact, high-efficiency thermoelectric systems
07/14/2005US20050155004 Simulation model for design of semiconductor device, thermal drain noise analysis method, simulation method, and simulation apparatus
07/14/2005US20050154152 Mixing an epoxy resin, a phenol resin, and a hardening accelerator, under a reduced pressure and under a heating condition and then mixing
07/14/2005US20050153677 System and method for on-chip filter tuning
07/14/2005US20050153574 Very low dielectric constant plasma-enhanced CVD films
07/14/2005US20050153553 Etching method
07/14/2005US20050153549 Method of forming metal wiring for high voltage element
07/14/2005US20050153546 Method for fabrication of a contact structure
07/14/2005US20050153545 Methods of forming copper interconnections using electrochemical plating processes
07/14/2005US20050153544 Method of fabricating semiconductor device by forming diffusion barrier layer selectively and semiconductor device fabricated thereby
07/14/2005US20050153542 Method for forming dual damascene pattern
07/14/2005US20050153541 Method of forming metal wiring in a semiconductor device
07/14/2005US20050153537 Novel nitride barrier layer to prevent metal (Cu) leakage issue in a dual damascene structure
07/14/2005US20050153536 Method for manufacturing semiconductor device
07/14/2005US20050153533 Semiconductor manufacturing method and semiconductor manufacturing apparatus
07/14/2005US20050153532 Methods and apparatus to reduce growth formations on plated conductive leads
07/14/2005US20050153523 Method for compensating for CTE mismatch using phase change lead-free super plastic solders
07/14/2005US20050153505 Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner
07/14/2005US20050153483 Carrier, method of manufacturing a carrier and an electronic device
07/14/2005US20050153482 Leadframe and method of manufacturing the same
07/14/2005US20050153480 Semiconductor device and method for making the same
07/14/2005US20050153479 Method of manufacturing a semiconductor device
07/14/2005US20050153466 Photoresist pattern, method of fabricating the same, and method of assuring the quality thereof
07/14/2005US20050153196 Press-fit sealed electronic component and method for producing the same
07/14/2005US20050153116 Method for fabricating semiconductor device
07/14/2005US20050153101 Porous adhesive sheet, semiconductor wafer with porous adhesive sheet and method of manufacture thereof
07/14/2005US20050153061 formed at relatively low temperatures; have a relatively high capability to withstand expansion and contraction caused by heating and cooling of components; dipping dielectric material in solution of catalytic metal particles with slight electrostatic dipole
07/14/2005US20050153060 Structure and method of embedding components in multi-layer substrates
07/14/2005US20050152773 Liquid epoxy resin composition and semiconductor device
07/14/2005US20050152634 Optical device, method for fabricating optical device, cap component, and method for forming cap component
07/14/2005US20050152594 Method and system for monitoring IC process
07/14/2005US20050152186 Semiconductor integrated circuit device
07/14/2005US20050152184 Circuit substrate
07/14/2005US20050152169 Stacked IC device having functions for selecting and counting IC chips
07/14/2005US20050152119 Locking device for heat dissipating device
07/14/2005US20050152118 Device to cool integrated circuit element and disk drive having the same
07/14/2005US20050152117 Stack up assembly
07/14/2005US20050152115 Thermal module
07/14/2005US20050152113 Motherboard testing mount
07/14/2005US20050151613 Inductive device and method for producing the same
07/14/2005US20050151599 Module for radio-frequency applications
07/14/2005US20050151554 Cooling devices and methods of using them
07/14/2005US20050151273 integrated circuit chip, a chip contact pad, a stud, a substrate, and a support member
07/14/2005US20050151272 formed as a trench in a transparent element; comprised of a protuberance on a die
07/14/2005US20050151271 comprising: curing agent to generate free radicals with heating; a radically polymerizable substance; and film-forming polymer, wherein a temporary fixing power to a flexible substrate having the circuit electrode is 40-180 N/m
07/14/2005US20050151270 Materials for electronic devices
07/14/2005US20050151269 UBM for fine pitch solder balland flip-chip packaging method using the same
07/14/2005US20050151268 Wafer-level assembly method for chip-size devices having flipped chips
07/14/2005US20050151267 Semiconductor device and manufacturing method for the same
07/14/2005US20050151266 Semiconductor device and method of manufacturing the same
07/14/2005US20050151265 Efficient use of wafer area with device under the pad approach
07/14/2005US20050151264 Fabrication process for a semiconductor integrated circuit device
07/14/2005US20050151262 Semiconductor integrated circuit device
07/14/2005US20050151260 forming a plurality of lower patterns each comprising a first lower metal pattern and a capping pattern; sequentially stacked; photolithography
07/14/2005US20050151259 Semiconductor device and manufacturing method thereof
07/14/2005US20050151258 Method for reducing wiring congestion in a VLSI chip design
07/14/2005US20050151257 Semiconductor device and method of manufacturing the same
07/14/2005US20050151256 Freestanding multilayer IC wiring structure
07/14/2005US20050151254 Semiconductor device
07/14/2005US20050151253 Bonding wire and an integrated circuit device using the same
07/14/2005US20050151252 Semiconductor device having capacitors for reducing power source noise
07/14/2005US20050151251 Mounting substrate and electronic component using the same
07/14/2005US20050151250 Semiconductor device and manufacturing method thereof
07/14/2005US20050151249 Chip-size package with an integrated passive component
07/14/2005US20050151248 Inter-dice signal transfer methods for integrated circuits
07/14/2005US20050151247 Electronic device and intermediate product of electronic device
07/14/2005US20050151246 Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier
07/14/2005US20050151244 Integrated micro channels and manifold/plenum using separate silicon or low-cost polycrystalline silicon
07/14/2005US20050151243 Semiconductor chip heat transfer
07/14/2005US20050151242 Semiconductor device
07/14/2005US20050151241 Multilayer ceramic substrate with single via anchored pad and method of forming
07/14/2005US20050151240 Radio frequency module
07/14/2005US20050151239 Integrated circuit devices, edge seals therefor
07/14/2005US20050151238 Three-level leadframe for no-lead packages
07/14/2005US20050151237 Multi-chip assembly and method for driving the same
07/14/2005US20050151236 Low profile package having multiple die
07/14/2005US20050151235 Semiconductor device and manufacturing method for the same
07/14/2005US20050151234 Semiconductor device and supporting plate
07/14/2005US20050151233 Conductive material compositions, apparatus, systems, and methods
07/14/2005US20050151231 Surface mount type semiconductor device and lead frame structure thereof
07/14/2005US20050151229 Electronic device having wiring substrate and lead frame
07/14/2005US20050151228 Semiconductor chip and manufacturing method for the same, and semiconductor device
07/14/2005US20050151227 Novel EBR shape of spin-on low-k material providing good film stacking
07/14/2005US20050151224 Semiconductor device and manufacturing method thereof
07/14/2005US20050151217 Integrated circuit device packaging structure and packaging method
07/14/2005US20050151216 Integrated circuit device packaging structure and packaging method
07/14/2005US20050151213 Method and structure for integrating thermistor
07/14/2005US20050151200 Electrostatic discharge protection circuit with a diode string
07/14/2005US20050151194 Method of forming thin-film transistor devices with electro-static discharge protection
07/14/2005US20050151166 Metal contact structure and method of manufacture
07/14/2005US20050151161 Electronic assembly
07/14/2005US20050151140 Semiconductor light emitting device and plant cultivating system
07/14/2005US20050151136 Light emitting diode having conductive substrate and transparent emitting surface
07/14/2005US20050151130 Electronic devices containing organic semiconductor materials
07/14/2005US20050151127 Variable resistance functional body, manufacturing method therefor and storage device
07/14/2005US20050150935 Method for manufacturing plate stacks, particularly coolers or cooler elements made up of plate stacks
07/14/2005US20050150933 System and method for increasing the strength of a bond made by a small diameter wire in ball bonding
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