| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/21/2005 | US20050155957 Method of forming an opening or cavity in a substrate for receiving an electronic component |
| 07/21/2005 | US20050155791 Multilayer wiring board including stacked via structure |
| 07/21/2005 | US20050155790 Mounting board and electronic device using same |
| 07/21/2005 | US20050155755 Liquid cooling device and electronic equipment provided with the same |
| 07/21/2005 | US20050155752 Thermal interface and method of making the same |
| 07/21/2005 | US20050155751 Heat-dissipating member and joined structure |
| 07/21/2005 | US20050155746 Heat-pipe type heat-sink structure and its sealing method |
| 07/21/2005 | US20050155744 Pump-free water-cooling system |
| 07/21/2005 | US20050155743 Composite heat sink with metal base and graphite fins |
| 07/21/2005 | US20050155742 Heat sink combining assembly |
| 07/21/2005 | US20050155712 Apparatus and method for alignment of a bonding tool |
| 07/21/2005 | US20050155432 Pressure sensor contained in casing |
| 07/21/2005 | US20050155354 Heat radiator |
| 07/21/2005 | US20050155223 Methods of making microelectronic assemblies |
| 07/21/2005 | DE19717611B4 Struktur zum Anbringen von elektronischen Komponenten Structure for mounting of electronic components |
| 07/21/2005 | DE10392992T5 Versorgungs-/Erdungskonfiguration für impedanzarme integrierte Schaltung Supply / ground configuration for low-impedance integrated circuit |
| 07/21/2005 | DE10360203A1 Premold-Gehäuse Premold housing |
| 07/21/2005 | DE10359260A1 Electronic equipment is adhesively fixed to a base plate and has bond wire connections to components |
| 07/21/2005 | DE10359157A1 Wärmeleitende Einlegematte für elektrische und elektronische Geräte und Verfahren zur Herstellung derartiger Einlegematten Thermally conductive inlay mat for electrical and electronic equipment and methods for producing such Liner mats |
| 07/21/2005 | DE10359088A1 Electrical apparatus consists of at least two electronic components, at least one connection for the components, and a cover layer |
| 07/21/2005 | DE10358357A1 Temperature load detector for integrated semiconductor chip during soldering, has chip containing temperature sensor measuring magnitude |
| 07/21/2005 | DE10346723B3 Cooling air guide element for computer housing has casing at least partly provided with high thermal conductivity material on its inner surface facing heat-generating electronic component |
| 07/21/2005 | DE10344609B3 Hochfrequenzdiode High-frequency diode |
| 07/21/2005 | DE102004060854A1 Simulationsmodell für einen Entwurf einer Halbleitervorrichtung, Analyseverfahren für thermisches Drain-Rauschen, Simulationsverfahren und Simulationsvorrichtung Simulation model for a design of a semiconductor device, method of analysis for thermal drain noise simulation method and device simulation |
| 07/21/2005 | DE102004051384A1 Verfahren, Vorrichtung und Herstellungsartikel zum Herstellen von symmetrischen Hochfrequenzschaltungen A method, apparatus and article of manufacture for the production of balanced high-frequency circuits |
| 07/21/2005 | DE10161593B4 Flacher Halbleiterstapel Flat semiconductor stack |
| 07/21/2005 | CA2552592A1 Heat sink |
| 07/20/2005 | EP1555862A2 Process for producing circuit board having built-in electronic part |
| 07/20/2005 | EP1555692A2 Fixing device for electronic components |
| 07/20/2005 | EP1555691A1 Non-contact id card and the like and method for manufacturing same |
| 07/20/2005 | EP1555687A1 Semiconductor device and process for producing the same |
| 07/20/2005 | EP1555079A2 Process for manufacturing cooling elements made of plate piling, with soldering material on the inner surfaces of passages or openings of the plates |
| 07/20/2005 | EP1554754A2 Method of manufacturing a data carrier |
| 07/20/2005 | EP1554753A1 Method for producing a stepped edge profile comprised of a layered construction. |
| 07/20/2005 | EP1554752A2 Device |
| 07/20/2005 | EP1554218A2 Micromechanical component and corresponding production method |
| 07/20/2005 | EP1470580A4 Bilayer hdp cvd / pe cvd cap in advanced beol interconnect structures and method thereof |
| 07/20/2005 | EP1468433B1 Coil on a semiconductor substrate and method for production thereof |
| 07/20/2005 | EP1425799B1 Pressure-contactable power semiconductor module |
| 07/20/2005 | EP1328982B1 Device enclosures and devices with integrated battery |
| 07/20/2005 | EP1286803B1 Method for producing a structural member from plates stacked on top of each other and soldered together |
| 07/20/2005 | EP1284015A4 Semiconductor device having a low dielectric film and fabrication process thereof |
| 07/20/2005 | EP1230679B1 Method for producing a support element for an integrated circuit (ic) component |
| 07/20/2005 | EP0970480A4 Vertically interconnected electronic assemblies and compositions useful therefor |
| 07/20/2005 | EP0913866B1 Semiconductor Device and Circuit Board Having the Same Mounted Thereon |
| 07/20/2005 | EP0818132B1 A method to prevent intrusions into electronic circuitry |
| 07/20/2005 | CN2711910Y Circuit board structure of LED |
| 07/20/2005 | CN2711906Y Multi-chip IC package structure |
| 07/20/2005 | CN2711905Y Fuse with covered layer |
| 07/20/2005 | CN2711904Y Water cooling type computer CPU heat sink |
| 07/20/2005 | CN2711903Y Radiation fin |
| 07/20/2005 | CN2711902Y Radiation device |
| 07/20/2005 | CN2711901Y Radiation cooling device |
| 07/20/2005 | CN2711900Y Pin grid array electric package unit and carrying board thereof |
| 07/20/2005 | CN2711899Y Electronic package unit with passive component |
| 07/20/2005 | CN1643700A Detector arrangement, method for the detection of electrical charge carriers and use of an ONO field effect transistor of r detection of an electrical charge |
| 07/20/2005 | CN1643691A Semiconductor die package with semiconductor die having side electrical connection |
| 07/20/2005 | CN1643686A Active matrix electroluminescent display devices, and their manufacture |
| 07/20/2005 | CN1643685A Power amplifier device |
| 07/20/2005 | CN1643684A Semiconductor device having a bond pad and manufacturing method therefor |
| 07/20/2005 | CN1643683A Thin films, structures having thin films, and methods of forming thin films |
| 07/20/2005 | CN1643682A No-flow underfill encapsulant |
| 07/20/2005 | CN1643681A Semiconductor device with a protective security coating and method of manufacturing the same |
| 07/20/2005 | CN1643677A Method and resulting structure for manufacturing semiconductor substrates |
| 07/20/2005 | CN1643675A Bonding wire and an integrated circuit device using the same |
| 07/20/2005 | CN1643674A Low temperature dielectric deposition using aminosilane and ozone |
| 07/20/2005 | CN1643670A Organic compositions |
| 07/20/2005 | CN1643655A Method for making integrated circuit using memory wordline hard mask extension |
| 07/20/2005 | CN1643626A Coil on a semiconductor substrate and method for its production |
| 07/20/2005 | CN1643444A Electrochromic rearview mirror assembly incorporating a display/signal light |
| 07/20/2005 | CN1643045A Method of making a nanoporous film |
| 07/20/2005 | CN1643023A No flow underfill composition |
| 07/20/2005 | CN1642680A Copper flake powder, method for producing copper flake powder, and conductive paste using copper flake powder |
| 07/20/2005 | CN1642406A Electronic device and intermediate product of electronic device |
| 07/20/2005 | CN1642393A Electronic devices and methods of forming electronic devices |
| 07/20/2005 | CN1642385A Method for manufacturing stacked circuit board using adhesive |
| 07/20/2005 | CN1641886A Isolated high-voltage LDMOS transistor having a split well structure |
| 07/20/2005 | CN1641876A Mounting structure in integrated circuit module |
| 07/20/2005 | CN1641875A Multi-chip packaging body |
| 07/20/2005 | CN1641874A 多芯片封装 Multi-chip package |
| 07/20/2005 | CN1641873A Multi-chip package, semiconductor used therefore and mfg. method |
| 07/20/2005 | CN1641872A High voltage assembly structure with high static discharge protective tolerance capacity |
| 07/20/2005 | CN1641871A Integrated circuit assembly and mfg. method and 3-D integrated circuit assembly |
| 07/20/2005 | CN1641870A Semiconductor device with aluminium distribution line |
| 07/20/2005 | CN1641869A Wire bonding packaging body |
| 07/20/2005 | CN1641868A Heat-tube radiator for heating electronic element |
| 07/20/2005 | CN1641867A Combined multi-flow-direction radiator |
| 07/20/2005 | CN1641866A Shielding module and its electronic device |
| 07/20/2005 | CN1641865A Flip chip packaging body |
| 07/20/2005 | CN1641864A Radiating assembly of integrated circuit for portable computer |
| 07/20/2005 | CN1641863A Radiator fastening structure |
| 07/20/2005 | CN1641862A 芯片封装结构 Chip package |
| 07/20/2005 | CN1641856A Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner |
| 07/20/2005 | CN1641853A Inspection device and method for manufacturing the same, method for manufacturing electro-optic device and method for manufacturing semiconductor device |
| 07/20/2005 | CN1641852A Method for marking test result for electronic package |
| 07/20/2005 | CN1641851A 半导体装置 Semiconductor device |
| 07/20/2005 | CN1641849A Method for manufacturing carrying-plate for packaging flat plastic-sealed ball grid array and its carrying plate |
| 07/20/2005 | CN1641832A Semiconductor device and manufacturing method for the same |
| 07/20/2005 | CN1641483A Method for forming metal pattern with low resistivity |
| 07/20/2005 | CN1211892C Socket for spheric grid array package |