Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2005
07/21/2005US20050158925 Thin film transistor array panel and manufacturing method thereof
07/21/2005US20050158919 Semiconductor fuses and semiconductor devices containing the same
07/21/2005US20050158918 Masking layer in substrate cavity
07/21/2005US20050158917 Manufacturing method for resin sealed semiconductor device
07/21/2005US20050158916 Thermal conductive board, method of manufacturing the same, and power module with the same incorporated therein
07/21/2005US20050158914 Process for manufacturing microelectronic, microoptoelectronic or micromechanical devices
07/21/2005US20050158911 Process for producing circuit board having built-in electronic part
07/21/2005US20050158910 Protective layer for use in packaging a semiconductor die and method for forming same
07/21/2005US20050158888 System and method for product yield prediction
07/21/2005US20050158849 Process of fabricating polymer sustained microelectrodes
07/21/2005US20050158664 Method of integrating post-etching cleaning process with deposition for semiconductor device
07/21/2005US20050158557 Resin composition for encapsulating semiconductor
07/21/2005US20050158527 Epoxy resins containing fine metal particle selected from platinum (Pt), palladium (Pd), copper (Cu), gold (Au), nickel (Ni), and silver (Ag).; rate of moisture absorption from 500 to 14500 ppm; electrostatic latent image is formed, by electrostatically attaching metal-containing resin particles
07/21/2005US20050158009 Structure and method for temporarily holding integrated circuit chips in accurate alignment
07/21/2005US20050157571 Power transistor cell and power transistor component with fusible link
07/21/2005US20050157527 Semiconductor memory device
07/21/2005US20050157478 Printed circuit board and method for manufacturing printed circuit board
07/21/2005US20050157477 Electronic device and production method thereof
07/21/2005US20050157471 Integrated heat spreader package for heat transfer and for bond line thickness control and process of making
07/21/2005US20050157469 Cooling arrangement for a printed circuit board with a heat-dissipating electronic element
07/21/2005US20050157468 Computer cooling system
07/21/2005US20050157466 Liquid cooling system and personal computer using the same
07/21/2005US20050157452 Cooling device, electronic apparatus, display unit, and method of producing cooling device
07/21/2005US20050157374 Microelectromechanical device packages with integral heaters
07/21/2005US20050157297 Periodic patterns and technique to control misalignment between two layers
07/21/2005US20050157244 Driver chip and display apparatus including the same
07/21/2005US20050156819 Substrate identification circuit and semiconductor device
07/21/2005US20050156700 Integrated spiral inductor
07/21/2005US20050156698 Embedded toroidal inductors
07/21/2005US20050156693 Quasi-coax transmission lines
07/21/2005US20050156692 Double density quasi-coax transmission lines
07/21/2005US20050156691 Microwave transmission line
07/21/2005US20050156605 Circuits for transistor testing
07/21/2005US20050156499 Polymer sustained microelectrodes
07/21/2005US20050156335 Marks and method for multi-layer alignment
07/21/2005US20050156334 Alignment mark system and method to improve wafer alignment search range
07/21/2005US20050156333 Fits into a standard USB socket
07/21/2005US20050156332 Damascene interconnection and semiconductor device
07/21/2005US20050156331 Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same
07/21/2005US20050156330 Through-wafer contact to bonding pad
07/21/2005US20050156329 Semiconductor device by embedded package
07/21/2005US20050156328 Semiconductor device structures including protective layers formed from healable materials
07/21/2005US20050156327 Colored conductive wires for a semiconductor package
07/21/2005US20050156326 Board for mounting BGA semiconductor chip thereon, semiconductor device, and methods of fabricating such board and semiconductor device
07/21/2005US20050156324 Method for manufacturing connection construction
07/21/2005US20050156323 Semiconductor apparatus
07/21/2005US20050156322 Thin semiconductor package including stacked dies
07/21/2005US20050156319 Structure of stacked vias in multiple layer electronic device carriers
07/21/2005US20050156318 Security marking and security mark
07/21/2005US20050156315 Titanium alloy sputtering targets are reactively sputtered in nitrogen-comprising sputtering gas atmosphere to from titanium alloy nitride film; noncolumnar grain structure, low electrical resistivity, high chemical stability, and barrier layer properties comparable or exceeding those of tantalum nitride
07/21/2005US20050156314 Support ring for use with a contact pad and semiconductor device components including the same
07/21/2005US20050156313 Inspection device and method for manufacturing the same, method for manufacturing electro-optic device and method for manufacturing semiconductor device
07/21/2005US20050156312 Electronic component package
07/21/2005US20050156311 Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
07/21/2005US20050156308 Connecting elements on semiconductor chips for semiconductor components and methods for producing the same
07/21/2005US20050156307 Multilayer printed circuit board
07/21/2005US20050156305 Semiconductor integrated circuit device
07/21/2005US20050156304 LSI package provided with interface module
07/21/2005US20050156303 Structure of gold fingers
07/21/2005US20050156302 System for manufacturing microelectronic, microoptoelectronic or micromechanical devices
07/21/2005US20050156301 Method of packaging an optical sensor
07/21/2005US20050156300 Microelectronic component assemblies and microelectronic component lead frame structures
07/21/2005US20050156299 Partially populated ball grid design to accommodate landing pads close to the die
07/21/2005US20050156298 Semiconductor device including semiconductor elements mounted on base plate
07/21/2005US20050156297 Semiconductor package including flex circuit, interconnects and dense array external contacts
07/21/2005US20050156296 Quad flat flip chip package and leadframe thereof
07/21/2005US20050156295 Routing element for use in semiconductor device assemblies
07/21/2005US20050156294 Microelectronic component assemblies and microelectronic component lead frame structures
07/21/2005US20050156293 Routing element for use in multi-chip modules, multi-chip modules including the routing element and methods
07/21/2005US20050156292 Reduced size semiconductor package with stacked dies
07/21/2005US20050156291 Flipchip QFN package and method therefor
07/21/2005US20050156290 Concealable chip leadframe unit structure
07/21/2005US20050156289 Semiconductor chip leadframe module
07/21/2005US20050156285 Low k and ultra low k SiCOH dielectric films and methods to form the same
07/21/2005US20050156284 Semiconductor component having a pn junction and a passivation layer applied on a surface
07/21/2005US20050156281 HIGH TOLERANCE TCR BALANCED HIGH CURRENT RESISTOR FOR RF CMOS AND RF SiGe BiCMOS APPLICATIONS AND CADENCED BASED HIERARCHICAL PARAMETERIZED CELL DESIGN KIT WITH TUNABLE TCR AND ESD RESISTOR BALLASTING FEATURE
07/21/2005US20050156280 Integrated circuit packages with sandwiched capacitors
07/21/2005US20050156279 Capacitor and semiconductor device and method for fabricating the semiconductor device
07/21/2005US20050156277 Semiconductor device
07/21/2005US20050156276 Semiconductor device and manufacturing method thereof
07/21/2005US20050156275 Protection circuit located under fuse window
07/21/2005US20050156273 Memory devices
07/21/2005US20050156267 Semiconductor device provided with temperature detection function
07/21/2005US20050156266 Die package having an adhesive flow restriction area
07/21/2005US20050156265 Lithography device for semiconductor circuit pattern generation
07/21/2005US20050156258 Method of forming silicide film having excellent thermal stability, semiconductor device and semiconductor memory device comprising silicide film formed of the same, and methods of manufacturing the semiconductor device and the semiconductor memory device
07/21/2005US20050156250 Semiconductor device with smoothed pad portion
07/21/2005US20050156221 Semiconductor device and method of manufacturing same
07/21/2005US20050156211 Semiconductor device and method for producing the same
07/21/2005US20050156207 Examination apparatus for biological sample and chemical sample
07/21/2005US20050156196 Local interconnect for integrated circuit
07/21/2005US20050156188 Nitride semiconductor light emitting device and method of manufacturing the same
07/21/2005US20050156187 Semiconductor device using semiconductor chip
07/21/2005US20050156186 Light-emitting diode with prevention of electrostatic damage
07/21/2005US20050156170 Electro-optical device, method of manufacturing the same, and electronic apparatus
07/21/2005US20050156166 Jig device for transporting and testing integrated circuit chip
07/21/2005US20050156165 Test assembly including a test die for testing a semiconductor product die
07/21/2005US20050156157 Hierarchical assembly of interconnects for molecular electronics
07/21/2005US20050156155 Electronics, opto-electronic, magneto-electronics and magneto-optics devices, single crystal, integrated circuits
07/21/2005US20050156013 Method of making high performance heat sinks
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