Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2005
07/27/2005EP1557880A1 Resin composition for encapsulating semiconductor
07/27/2005EP1557879A2 Method of forming connection hole
07/27/2005EP1556948A1 Frequency-independent voltage divider
07/27/2005EP1556899A1 Electronic component with an integrated passive electronic component and method for production thereof
07/27/2005EP1556898A2 Conformal heat spreader
07/27/2005EP1556897A2 Thermal-conductive substrate package
07/27/2005EP1556896A2 Anti-reflective compositions comprising triazine compounds
07/27/2005EP1556895A2 Semiconductor stacked multi-package module having inverted second package
07/27/2005EP1556894A2 Thermal enhanced package for block mold assembly
07/27/2005EP1366328A4 Improved efficiency thermoelectrics utilizing thermal isolation
07/27/2005EP1114807B1 Semiconductor device or heat dissipating substrate therefor using a composite material
07/27/2005CN2713645Y Electrostatic resistant protection circuit for luminous tube
07/27/2005CN2713644Y Compactification wafer packaging structure
07/27/2005CN2713643Y Heat sink
07/27/2005CN2713642Y 热管散热器 Heat pipe radiator
07/27/2005CN2713641Y Heat sink
07/27/2005CN2713640Y Metal radiator with micro sand grip
07/27/2005CN2713639Y Heat conducting structure for heat radiating module
07/27/2005CN2713638Y Fixing device of chip heat sink
07/27/2005CN2713637Y 散热器 Heat sink
07/27/2005CN2713636Y Locking device for radiator
07/27/2005CN2713635Y 散热器 Heat sink
07/27/2005CN2713634Y Radiator fixing device
07/27/2005CN2713633Y Heat pipe radiator assembly
07/27/2005CN2713632Y Heat sink
07/27/2005CN1647598A Method of manufacturing an electronic device
07/27/2005CN1647596A Circuit board and method for manufacturing the same
07/27/2005CN1647595A Electrically insulating body, and electronic device
07/27/2005CN1647282A Thin film transistor array panel
07/27/2005CN1647276A Method for coating metal surfaces and substrate having a coated metal surface as protection for copying process and elements concerned
07/27/2005CN1647275A Electronic device and method of manufacturing same
07/27/2005CN1647274A Semiconductor component comprising an integrated latticed capacitance structure
07/27/2005CN1647271A Semiconductor device and method of manufacturing same
07/27/2005CN1647270A Method of manufacturing an electronic device, and electronic device
07/27/2005CN1647269A Method of manufacturing an electronic device
07/27/2005CN1647268A Carrier, method of manufacturing a carrier and an electronic device
07/27/2005CN1647267A Circuit board, process for producing the same and power module
07/27/2005CN1647266A Semiconductor device and method for assembling the same
07/27/2005CN1647262A Mold release layer transferring film and laminate film
07/27/2005CN1647261A Method for connecting substrates and composite element
07/27/2005CN1647260A A common ball-limiting metallurgy for i/o sites+
07/27/2005CN1647258A Method for the production of structured layers on substrates
07/27/2005CN1647106A Method for encapsulation of a chipcard and module obtained thus
07/27/2005CN1647105A Module for a data carrier with improved bump counterparts
07/27/2005CN1646990A Method of treatment of porous dielectric films to reduce damage during cleaning
07/27/2005CN1646932A Method and arrangement for protecting a chip and checking its authenticity
07/27/2005CN1646722A Method for coating metal surfaces and substrate having a coated metal surface
07/27/2005CN1646721A Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby
07/27/2005CN1646679A Substrate and method for measuring the electrophysiological properties of cell membranes
07/27/2005CN1646625A Electroconductive resin composition
07/27/2005CN1646463A Multifunctional monomers and their use in making cross-linked polymers and porous films
07/27/2005CN1646418A Method for producing a product having a structured surface
07/27/2005CN1646417A Method of manufacturing an electronic device
07/27/2005CN1645999A Method for manufacturing plate stacks, particularly coolers or cooler elements made up of plate stacks
07/27/2005CN1645991A 多层印刷电路板 The multilayer printed circuit board
07/27/2005CN1645725A Commutating crystal brake tube power-phase module of integrated gate pole
07/27/2005CN1645724A Commutating crystal brake tube power-phase module of impacted integrated gate pole
07/27/2005CN1645669A Double density quasi-coax transmission lines
07/27/2005CN1645668A Quasi-coax transmission lines
07/27/2005CN1645633A Nitride semiconductor light emitting device and method of manufacturing the same
07/27/2005CN1645627A Ic device and transistor device and micro-electronic device and their manufacture
07/27/2005CN1645618A Semiconductor memory device and making method thereof
07/27/2005CN1645613A Integrated circuit device
07/27/2005CN1645610A Stacked layered type semiconductor memory device
07/27/2005CN1645608A Low k and ultra low k SiCOH dielectric films and methods to form the same
07/27/2005CN1645607A Semiconductor device and method for fabricating the same
07/27/2005CN1645606A Active area bonding compatible high current structures
07/27/2005CN1645604A Semiconductor device and method for manufacturing the same
07/27/2005CN1645603A Circuit and chip for inter-changing chip pin function
07/27/2005CN1645602A Semiconductor device, semiconductor chip, method for manufacturing semiconductor device, and electronic apparatus
07/27/2005CN1645601A Electronic chip radiator of louver window fin structure
07/27/2005CN1645600A 混合集成电路装置及其制造方法 Hybrid integrated circuit device and manufacturing method thereof
07/27/2005CN1645599A Package assembly for electronic device and method of making same
07/27/2005CN1645598A Semiconductor device, module for optical devices, and manufacturing method of semiconductor device
07/27/2005CN1645597A Semiconductor device and method of manufacturing same
07/27/2005CN1645592A Semiconductor device and forming method for interconnecting structure and copper wiring processing method
07/27/2005CN1645583A Semiconductor integrated circuit having connection pads over active elements
07/27/2005CN1645582A Method of forming a semiconductor package and leadframe therefor
07/27/2005CN1645580A Manufacture of semiconductor device and heat resistant adhesive tape used therefor
07/27/2005CN1645579A Method of manufacturing hybrid integrated circuit device
07/27/2005CN1645565A 半导体装置及其制造方法 Semiconductor device and manufacturing method
07/27/2005CN1645562A Alignment method, method for manufacturing a semiconductor device, substrate for a semiconductor device, electronic equipment
07/27/2005CN1645561A Apparatus and method for alignment of a bonding tool
07/27/2005CN1645560A A suspension for filling via holes in silicon and method for making the same
07/27/2005CN1645515A Nonvolatile semiconductor memory
07/27/2005CN1645511A Stacked layered type semiconductor memory device
07/27/2005CN1645221A Method for sealing electroluminescence display devices and its sealing areas and sealing patterns
07/27/2005CN1645193A Electro-optical device, method of manufacturing the same, and electronic apparatus
07/27/2005CN1645079A Pressure sensor contained in casing
07/27/2005CN1645059A Production of local vacuum sealing protective structure of silicon based sensor flexible piece
07/27/2005CN1644753A Method of forming low dielectric constant interlayer dielectric film
07/27/2005CN1212755C Patterning process of circuit base board
07/27/2005CN1212690C High frequency line inverter, parts, assembly and communication apparatus
07/27/2005CN1212663C Metal washer structure no semiconductor substrate
07/27/2005CN1212662C Package structure of display element
07/27/2005CN1212661C Pattern combination structure of releasing stress force
07/27/2005CN1212659C Method for lowering anomaly discharges happened on interconnected wires in plasma procedure
07/27/2005CN1212657C Adhesive for electronic element device
07/27/2005CN1212656C Method and device for fleed out control in solder bonding
07/27/2005CN1212655C Process for preparing zero-shinkage low-temp, co-fired ceramic multi-layer baseplate
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