| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 07/28/2005 | US20050161832 Circuit substrate, electro-optic device and electronic equipment |
| 07/28/2005 | US20050161831 Method of manufacturing semiconductor device having through hole with adhesion layer thereon |
| 07/28/2005 | US20050161829 Method and structure to reduce risk of gold embritlement in solder joints |
| 07/28/2005 | US20050161828 made by depositing a second material on a conductive path formed of a first material such as copper, then causing diffusion of the second material which can be silver or palladium |
| 07/28/2005 | US20050161827 Concentration graded carbon doped oxide |
| 07/28/2005 | US20050161825 Semiconductor device |
| 07/28/2005 | US20050161824 Semiconductor device and method for fabricating the same |
| 07/28/2005 | US20050161823 Semiconductor device |
| 07/28/2005 | US20050161822 Integrated circuit device |
| 07/28/2005 | US20050161821 Method for forming interconnection line in semiconductor device and interconnection line structure |
| 07/28/2005 | US20050161820 Integrated circuit with conductive grid for power distribution |
| 07/28/2005 | US20050161819 Method of treating microelectronic substrates |
| 07/28/2005 | US20050161818 Semiconductor manufacturing apparatus for modifying in-film stress of thin films, and product formed thereby |
| 07/28/2005 | US20050161817 Technique for forming embedded metal lines having increased resistance against stress-induced material transport |
| 07/28/2005 | US20050161816 Semiconductor device |
| 07/28/2005 | US20050161815 Package of a semiconductor device with a flexible wiring substrate and method for the same |
| 07/28/2005 | US20050161814 Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus |
| 07/28/2005 | US20050161813 Radiation-emitting semiconductor component and method for fixing a semiconductor chip on a leadframe |
| 07/28/2005 | US20050161812 Wafer-level package structure |
| 07/28/2005 | US20050161811 Conductive sintered compact for fixing electrodes in electronic device envelope |
| 07/28/2005 | US20050161810 Semiconductor device |
| 07/28/2005 | US20050161808 Wafer, intermediate wafer assembly and associated method for fabricating a silicon on insulator wafer having an improved edge profile |
| 07/28/2005 | US20050161807 I/C package/thermal-solution retention mechanism with spring effect |
| 07/28/2005 | US20050161806 Area array packages with overmolded pin-fin heat sinks |
| 07/28/2005 | US20050161805 Semiconductor device, module for optical devices, and manufacturing method of semiconductor device |
| 07/28/2005 | US20050161803 Semiconductor device and method of fabricating the same |
| 07/28/2005 | US20050161802 Semiconductor device |
| 07/28/2005 | US20050161799 Semiconductor device having conducting portion of upper and lower conductive layers, and method of fabricating the same |
| 07/28/2005 | US20050161798 Semiconductor device |
| 07/28/2005 | US20050161797 Multiple die interconnect system |
| 07/28/2005 | US20050161796 Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice |
| 07/28/2005 | US20050161794 Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate |
| 07/28/2005 | US20050161793 Semiconductor device and stacked semiconductor device that can increase flexibility in designing a stacked semiconductor device |
| 07/28/2005 | US20050161792 Junction member and multichip package using same |
| 07/28/2005 | US20050161791 Multiple die-spacer for an integrated circuit |
| 07/28/2005 | US20050161790 Stacked IC |
| 07/28/2005 | US20050161789 Package substrate pattern to accommodate optical waveguide |
| 07/28/2005 | US20050161788 Semiconductor device |
| 07/28/2005 | US20050161787 Integrated circuit arrangement |
| 07/28/2005 | US20050161786 Hermetic surface mounted power package |
| 07/28/2005 | US20050161785 Semiconductor device |
| 07/28/2005 | US20050161783 Method for manufacturing circuit board, circuit board, and electronic equipment |
| 07/28/2005 | US20050161782 Hybrid integrated circuit device and manufacturing method of the same |
| 07/28/2005 | US20050161781 Hybrid integrated circuit device and manufacturing method thereof |
| 07/28/2005 | US20050161780 Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods therefor |
| 07/28/2005 | US20050161779 Flip chip assemblies and lamps of high power GaN LEDs, wafer level flip chip package process, and method of fabricating the same |
| 07/28/2005 | US20050161777 Method of making wireless semiconductor device, and leadframe used therefor |
| 07/28/2005 | US20050161776 Flexible board, connection method thereof, and connection structure thereof |
| 07/28/2005 | US20050161775 Wiring circuit board and production method thereof |
| 07/28/2005 | US20050161773 Rare earth-oxides, rare earth nitrides, rare earth phosphides and ternary alloys with silicon |
| 07/28/2005 | US20050161766 Semiconductor device and method for fabricating the same |
| 07/28/2005 | US20050161765 High-density metal capacitor using dual-damascene copper interconnect |
| 07/28/2005 | US20050161762 Buried power buss utilized as a ground strap for high current, high power semiconductor devices and a method for providing the same |
| 07/28/2005 | US20050161757 Wafer level hermetic sealing method |
| 07/28/2005 | US20050161756 Package of a semiconductor device with a flexible wiring substrate and method for the same |
| 07/28/2005 | US20050161748 Integrated circuit with reverse engineering protection |
| 07/28/2005 | US20050161725 Semiconductor component comprising an integrated latticed capacitance structure |
| 07/28/2005 | US20050161721 Word lines for memory cells |
| 07/28/2005 | US20050161706 Interconnect structure for power transistors |
| 07/28/2005 | US20050161663 Rare earth-oxides, rare earth -nitrides, rare earth -phosphides and ternary alloys with silicon |
| 07/28/2005 | US20050161662 Methods of fabricating nanostructures and nanowires and devices fabricated therefrom |
| 07/28/2005 | US20050161632 easy to handle and apply, for transferring heat to a heat sink from electronics, comprising a paraffin wax, optional resin and electroconductive filler |
| 07/28/2005 | US20050161251 Hybrid integrated circuit device and method of manufacturing the same |
| 07/28/2005 | US20050161219 Filter cake removal fluid |
| 07/28/2005 | US20050161210 Organic matrices containing nanomaterials to enhance bulk thermal conductivity |
| 07/28/2005 | US20050161201 Heat dissipation device |
| 07/28/2005 | US20050161199 Heat-dissipating device |
| 07/28/2005 | US20050161198 Heat transport device and electronic device |
| 07/28/2005 | US20050161197 Portable augmented silent cooling docking station |
| 07/28/2005 | US20050161196 Heat radiator for a CPU |
| 07/28/2005 | US20050161195 System for reliably removing heat from a semiconductor junction |
| 07/28/2005 | US20050161149 Method of forming polymide coating containing dielectric filler on surface of metallic material process for producing copper clad laminate for formation of capacitor layer for printed wiring board and copper clad laminate obtained by the process |
| 07/28/2005 | US20050160972 Method and resulting structure for manufacturing semiconductor substrates |
| 07/28/2005 | US20050160752 Apparatus and methodology for cooling of high power density devices by electrically conducting fluids |
| 07/28/2005 | US20050160592 Mounting system for high-mass heatsinks |
| 07/28/2005 | US20050160575 Integration of high performance copper inductors with bond pads |
| 07/28/2005 | US20050160568 Support clip |
| 07/28/2005 | DE4133183B4 Gehäusekonstruktion für Chip-TAB-Bauelemente, Verwendung derselben und Verfahren zu deren Montage A case assembly for TAB-chip devices, use thereof and process for their mounting |
| 07/28/2005 | DE10360933A1 Verfahren zum Herstellen einer Kapazität in einer Schicht aus Low-k-Material A method of manufacturing a capacitance in a layer of low-k material |
| 07/28/2005 | DE10360708A1 Halbleitermodul mit einem Halbleiterstapel und Verfahren zur Herstellung desselben The same semiconductor module with a semiconductor stack and processes for preparing |
| 07/28/2005 | DE10360573A1 Power semiconductor module for electric motor control comprises at least two pairs of semiconductor elements and heat store combinations that are separate from one another |
| 07/28/2005 | DE10360513A1 Integrierter Halbleiterschaltungschip mit verbesserter Hochstrom- und Wärmeleitungsfähigkeit The semiconductor integrated circuit chip with improved high-current and thermal conductivity |
| 07/28/2005 | DE10360236A1 Electronic components external energy-free cooling e.g. for microprocessors in computers, has closed double-wall pipe system with base plate |
| 07/28/2005 | DE10359424A1 Flexible Umverdrahtungsplatte für Halbleiterbauteile und Verfahren zur Herstellung derselben Flexible rewiring for semiconductor devices and method of manufacturing the same |
| 07/28/2005 | DE10357673A1 Montage- und Klebeschicht für Halbleiterbauelement Assembly and an adhesive layer for semiconductor device |
| 07/28/2005 | DE10339689B4 Schaltungsanordnung mit einem Lasttransistor und einer Spannungsbegrenzungsschaltung und Verfahren zur Ansteuerung eines Lasttransistors Circuit arrangement having a load transistor and a voltage limiting circuit and method for driving a load transistor |
| 07/28/2005 | DE10310716B4 Verfahren zur Herstellung von Justiermarken auf Halbleiterscheiben Process for the preparation of alignment marks on semiconductor wafers |
| 07/28/2005 | DE10245451B4 Elektronisches Bauteil mit einem Halbleiterchip, der flexible Chipkontakte aufweist, und Verfahren zur Herstellung desselben, sowie Halbleiterwafer Electronic component having a semiconductor chip having flexible chip contacts, and processes for producing the same, as well as semiconductor wafers |
| 07/28/2005 | DE102004062451A1 Line layout for semiconductor memory device e.g. dynamic RAM, has conductive line arranged in the same direction as word lines in twisted area of set of twisted bit line pairs in memory device |
| 07/28/2005 | DE102004061311A1 Temperaturkompensierte Verzögerungssignale Temperature compensated delay signals |
| 07/28/2005 | DE102004060378A1 Halbleitervorrichtung Semiconductor device |
| 07/28/2005 | DE102004055908A1 Semiconductor device such as an Insulating Gate Bipolar Transistor has pair of heat dissipating plates and heat dissipating block placed close to the device |
| 07/28/2005 | DE102004022755A1 Mehrschichtige Substratanordnung zur Reduzierung der Layout-Fläche The multi-layer substrate assembly to reduce layout area |
| 07/28/2005 | DE102004017313A1 Semiconductor component with surface mounted external contacts has chip with surface function blocks and short electrical contact rails between blocks and contact surfaces |
| 07/28/2005 | DE102004012810A1 Gedruckte Leiterplatte und Aufbau mit schrägen Durchkontakten Printed circuit board and structure with sloping vias |
| 07/28/2005 | DE10123514B4 Halbleiter-Speicherbaustein Semiconductor memory device |
| 07/27/2005 | EP1557901A1 Microwave transmission line |
| 07/27/2005 | EP1557884A2 Examination apparatus for biological sample and chemical sample |
| 07/27/2005 | EP1557882A2 Alignment method, method for manufacturing a semiconductor device, substrate for a semiconductor device, electronic equipment |
| 07/27/2005 | EP1557881A1 A lead-frame for electronic devices with extruded pads |