Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2005
08/02/2005US6924496 Fingerprint sensor and interconnect
08/02/2005US6924429 Electronic device and production method therefor
08/02/2005US6924335 Immersing, infusing a polyurethane liquid into carbon nanotubes , curing to form polymer matrix, peeling the polymer matrix from the substrate; thermoconductive
08/02/2005US6924240 Low dielectric constant material, insulating film comprising the low dielectric constant material, and semiconductor device
08/02/2005US6924232 Semiconductor process and composition for forming a barrier material overlying copper
08/02/2005US6924224 Method of forming filled blind vias
08/02/2005US6924222 Formation of interconnect structures by removing sacrificial material with supercritical carbon dioxide
08/02/2005US6924211 Semiconductor chip carrying adhesive tape/sheet, semiconductor chip carrier, semiconductor chip mounting method and semiconductor chip packaging body
08/02/2005US6924207 Method of fabricating a metal-insulator-metal capacitor
08/02/2005US6924206 Method of manufacturing a semiconductor capacitive element in a semiconductor device
08/02/2005US6924192 Semiconductor device manufacturing method and semiconductor device
08/02/2005US6924185 Fuse structure and method to form the same
08/02/2005US6924184 Semiconductor device and method for forming a semiconductor device using post gate stack planarization
08/02/2005US6924183 Manufacturing method for SOI semiconductor device, and SOI semiconductor device
08/02/2005US6924179 Array substrate for a liquid crystal display and method for fabricating thereof
08/02/2005US6924176 Method of manufacturing semiconductor device
08/02/2005US6924175 Clip-type lead frame for source mounted die
08/02/2005US6924173 Semiconductor device and method for the fabrication thereof
08/02/2005US6924172 Method of forming a bond pad
08/02/2005US6924171 Bilayer wafer-level underfill
08/02/2005US6924170 Diamond-silicon hybrid integrated heat spreader
08/02/2005US6924168 Method of forming a structure for supporting an integrated circuit chip
08/02/2005US6924164 Method of continuous processing of thin-film batteries and like devices
08/02/2005US6923702 Method of making encapsulated display devices
08/02/2005US6923658 Support for an integrated circuit package having a column grid array interconnect
08/02/2005US6923651 Sheet material having metal points and method for the production thereof
08/02/2005US6923524 Inkjet device encapsulated at the wafer scale
07/2005
07/28/2005WO2005069381A1 Semiconductor device module structure
07/28/2005WO2005069378A2 Power semiconductor device and method therefor
07/28/2005WO2005069375A1 Electronic package of photo-image sensors in cellular phone camera modules, and the fabrication and assembly thereof
07/28/2005WO2005069370A1 Method and apparatus for providing a solder area on a leadframe
07/28/2005WO2005069369A1 Integrated structural element
07/28/2005WO2005069313A1 Insulation film and method of forming insulation film
07/28/2005WO2005069210A1 Protection for an integrated circuit chip containing confidential data
07/28/2005WO2005069205A1 Method of for manufacturing electronic device
07/28/2005WO2005069204A1 Semiconductor device
07/28/2005WO2005069024A1 Rewiring substrate strip comprising several semiconductor component positions
07/28/2005WO2005067684A2 Insulating substrate for ic packages having integral esd protection
07/28/2005WO2005067657A2 Method of packaging an optical sensor
07/28/2005WO2005067598A2 Compliant passivated edge seal for low-k interconnect structures
07/28/2005WO2005067539A2 Multilayer ceramic substrate with single via anchored pad and method of forming
07/28/2005WO2005067526A2 Flipchip qfn package and method therefore
07/28/2005WO2005067398A2 Driver chip and display apparatus
07/28/2005WO2005055311A3 Device having a compliant electrical interconnects and compliant sealing element
07/28/2005WO2005050751A3 Encapsulation assembly for electronic devices
07/28/2005WO2005048346A3 A cooling system for an electronic component
07/28/2005WO2005048304A3 Structure and programming of laser fuse
07/28/2005WO2005041121A3 Rfid device and method of making
07/28/2005WO2005031867A3 Conductor track connection structure and associated production method
07/28/2005WO2005024902A3 Method of forming a bond pad
07/28/2005WO2005013353A3 Method for producing reduced-thickness electronic components
07/28/2005WO2005006361A3 Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same
07/28/2005WO2005005903A3 Brazed wick for a heat transfer device and method of making same
07/28/2005WO2004096513A3 Metal-plastic composite component and methods for the production thereof
07/28/2005WO2004071139A3 Remedies to prevent cracking in a liquid system
07/28/2005WO2004061908A3 Cooling apparatus having low profile extrusion and method of manufacture therefore
07/28/2005WO2004038769A3 Flip-chip system and method of making same
07/28/2005WO2003029731A3 Electroosmotic microchannel cooling system
07/28/2005US20050165195 Solid silane coupling agent composition, process for producing the same, and resin composition containing the same
07/28/2005US20050164534 Interconnection device and system
07/28/2005US20050164532 Universal-Serial-Bus (USB) Flash-Memory Device with Metal Wrap Formed over Plastic Housing
07/28/2005US20050164529 High-power LGA socket
07/28/2005US20050164527 Method and system for batch forming spring elements in three dimensions
07/28/2005US20050164526 High performance interposer for a chip package using deformable button contacts
07/28/2005US20050164520 Method for manufacturing semiconductor device
07/28/2005US20050164505 Land grid array membrane
07/28/2005US20050164500 Selective passivation of exposed silicon
07/28/2005US20050164493 Shared contact for high-density memory cell design
07/28/2005US20050164490 Methods of forming backside connections on a wafer stack
07/28/2005US20050164489 Creating air gap in multi-level metal interconnects using electron beam to remove sacrificial material
07/28/2005US20050164486 Semiconductor substrates including I/O redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same
07/28/2005US20050164484 Method of fabricating a pad over active circuit I.C. with meshed support structure
07/28/2005US20050164483 Method of forming solder bump with reduced surface defects
07/28/2005US20050164482 Silicon Carbide on Diamond Substrates and Related Devices and Methods
07/28/2005US20050164481 Method and structure for reducing contact aspect ratios
07/28/2005US20050164432 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors and fabricating such devices
07/28/2005US20050164430 Semiconductor device having a fuse
07/28/2005US20050164428 Flip chip packaging process employing improved probe tip design
07/28/2005US20050164416 Method for processing an integrated circuit
07/28/2005US20050163982 Circuit substrate for packaging semiconductor device, method for producing the same, and method for producing semiconductor device package structure using the same
07/28/2005US20050163981 Method for bonding ceramic to copper, without creating a bow in the copper
07/28/2005US20050163692 Rare earth-oxides, rare earth -nitrides, rare earth -phosphides and ternary alloys with silicon
07/28/2005US20050163615 Redundant fan system in a turbo cooler assembly
07/28/2005US20050163016 Module for optical devices, and manufacturing method of module for optical devices
07/28/2005US20050162950 Stacked layered type semiconductor memory device
07/28/2005US20050162946 Stacked layered type semiconductor memory device
07/28/2005US20050162880 Semiconductor device and manufacturing method of them
07/28/2005US20050162833 Transpiration cooled heat sink and a self contained coolant supply for same
07/28/2005US20050162827 Heat-dissipating device
07/28/2005US20050162826 Cooling body
07/28/2005US20050162808 Surface-mount base for electronic element
07/28/2005US20050162599 Active matrix substrate and display device
07/28/2005US20050162577 Driver chip and display apparatus having the same
07/28/2005US20050162236 Lange coupler system and method
07/28/2005US20050162160 Concept of compensating for piezo influences on integrated circuitry
07/28/2005US20050161837 Chip and multi-chip semiconductor device using thereof and method for manufacturing same
07/28/2005US20050161836 Alignment method, method for manufacturing a semiconductor device, substrate for a semiconductor device, electronic equipment
07/28/2005US20050161835 Semiconductor integrated circuit having connection pads over active elements
07/28/2005US20050161834 Integrated circuit chip having a surface polymer-coatings and a plurality of electrical coupling members, polymeric underfill material filling the gap between coupling members, polymer coatings and substrate; flip-chip assembly
07/28/2005US20050161833 Semiconductor device and method of manufacturing the same
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