Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2005
08/03/2005CN1650500A Cooling body and rectifier module for an electrical machine
08/03/2005CN1650428A Method of calibrating marking in laser marking system
08/03/2005CN1650427A Integrated circuit with connecting layer and methods for making same
08/03/2005CN1650426A Seconductor device and stacked semiconductor device
08/03/2005CN1650425A Semiconductor device and electronic device
08/03/2005CN1650424A Bond pad structure comprising tungsten or tungsten compound layer on top of metallization level
08/03/2005CN1650423A Heat dissipation device
08/03/2005CN1650422A Thermoelectric spot coolers for RF and microwave communication integrated circuits
08/03/2005CN1650420A Method and wafer for maintaining ultra clean bonding pads on a wafer
08/03/2005CN1650413A 半导体器件 Semiconductor devices
08/03/2005CN1650412A Underfill encapsulant for wafer packaging and method for its application
08/03/2005CN1650411A Submount and semiconductor device
08/03/2005CN1650410A Partially patterned lead frames and methods of making and using the same in semiconductor packaging
08/03/2005CN1650408A Semiconductor device having multilevel wiring structure and method for fabricating the same
08/03/2005CN1650406A Ordered two-phase dielectric film, and semiconductor device containing the same
08/03/2005CN1650296A Back end of line clone test vehicle
08/03/2005CN1649472A Surface-mount base for electronic element
08/03/2005CN1649470A Flexible board, connection method thereof, and connection structure thereof
08/03/2005CN1649264A Temperature compensating type crystal oscillator
08/03/2005CN1649263A Piezoelectric oscillator
08/03/2005CN1649262A Package for electronic component, electronic component and method of manufacturing piezoelectric device
08/03/2005CN1649227A Static discharging protective circuit with two or multiple voltage supply electronic circuit
08/03/2005CN1649204A Structure package
08/03/2005CN1649175A Packaging device
08/03/2005CN1649170A Metal contact structure and method of manufacture
08/03/2005CN1649154A Semiconductor wafer and its producing method
08/03/2005CN1649153A Semiconductor chip with separated power ring, method for manufacturing the same, and method for controlling the same
08/03/2005CN1649149A Three-dimensional semiconductor package, and spacer chip used therein
08/03/2005CN1649148A Chip and multi-chip semiconductor device using thereof and method for manufacturing same
08/03/2005CN1649147A Back-to-back packaging integrated circuit and its producing method
08/03/2005CN1649146A Semiconductor device
08/03/2005CN1649145A Module with a built-in component, and electronic device with the same
08/03/2005CN1649144A Multi-chip assembly and method for driving the same
08/03/2005CN1649143A Electro-static discharge protection circuit and method for making the same
08/03/2005CN1649142A Static discharging protectire circuit and static discharging protective method
08/03/2005CN1649141A Integrated circuit with plane type connection
08/03/2005CN1649140A Hybrid integrated circuit device and method of manufacturing the same
08/03/2005CN1649139A Semiconductor device and method of fabricating the same
08/03/2005CN1649138A Optimized electronic package
08/03/2005CN1649137A Liquid cooling type power transducer
08/03/2005CN1649136A Heat radiator and its heat dispenser
08/03/2005CN1649135A Control method and device for cooling radiation object using coolant
08/03/2005CN1649134A Composition for heat conductive siloxanes heat release and its using method
08/03/2005CN1649133A Packaging structure and method for reducing photosensitive module to be polluted by microparticles
08/03/2005CN1649126A Method for forming interconnection line in semiconductor device and interconnection line structure
08/03/2005CN1649125A Manufacturing method of semiconductor device
08/03/2005CN1649124A Method for fabricating semiconductor device
08/03/2005CN1649119A Semiconductor device
08/03/2005CN1649118A Semiconductor device having conducting portion of upper and lower conductive layers, and method of fabricating the same
08/03/2005CN1649117A Device package and methods for the fabrication and testing thereof
08/03/2005CN1649114A Method for producing wiring base board
08/03/2005CN1649108A Protective layer for inhibiting antimonite sulfur invactivation failure and its forming method
08/03/2005CN1649107A Device and methodology for reducing effective dielectric constant in semiconductor devices
08/03/2005CN1649098A Semiconductor device
08/03/2005CN1649097A Method of manufacturing a semiconductor device including electrodes on main and reverse sides of a semiconductor chip
08/03/2005CN1649087A Method for forming inductor and semiconductor structure
08/03/2005CN1649043A Electronic component
08/03/2005CN1648757A Active matrix substrate and display device
08/03/2005CN1648707A Module for optical devices, and manufacturing method of module for optical devices
08/03/2005CN1647880A Heat radiator and its producing method
08/03/2005CN1213644C Metal support frame and its producing method
08/03/2005CN1213640C Structure of reducing mutual inductance between adjacent wires on substrate
08/03/2005CN1213487C Semiconductor module and its making process
08/03/2005CN1213479C Electronic packaged component with high density interconnection layer
08/03/2005CN1213478C Plate-type thermotube and its mfg. method
08/03/2005CN1213477C Aluminium-copper alloy workpiece and manufacture thereof and radiator therewith
08/03/2005CN1213476C Electronic device having fibrous interface
08/03/2005CN1213475C Semiconductor with metallic base
08/03/2005CN1213470C Semiconductor device and checkup apparatus thereof
08/02/2005US6925615 Semiconductor device having embedded array
08/02/2005US6925411 Method and apparatus for aligning semiconductor chips using an actively driven vernier
08/02/2005US6924987 Wiring board and process for producing the same
08/02/2005US6924984 Heat sink clip with pivoting locking portions
08/02/2005US6924983 Heat sink fan
08/02/2005US6924982 Heat dissipation assembly including heat sink and fan
08/02/2005US6924980 Vibration isolation of computing device heat sink fans from attached fan shrouds and heat sinks
08/02/2005US6924974 Hermetically sealed micro-device package using cold-gas dynamic spray material deposition
08/02/2005US6924971 High dielectric constant composite material and multilayer wiring board using the same
08/02/2005US6924868 Liquid crystal display device, method for fabricating the same, and portable telephone using the same
08/02/2005US6924725 Coil on a semiconductor substrate and method for its production
08/02/2005US6924562 Semiconductor integrated circuit having at least one of a power supply plane and ground plane divided into parts insulated from one another
08/02/2005US6924559 Electronic device with heat conductive encasing device
08/02/2005US6924558 Semiconductor device and method of fabricating the same, circuit board, and electronic instrument
08/02/2005US6924557 Semiconductor package
08/02/2005US6924556 Stack package and manufacturing method thereof
08/02/2005US6924555 Specially shaped contact via and integrated circuit therewith
08/02/2005US6924554 includes copper pad formed on interior surface of microelectronic die, with conductive layer (with bond wire) in contact with copper pad; improved corrosion resistance
08/02/2005US6924553 Semiconductor chip and wiring board with bumps formed on pads/land and on passivation/insulation film and manufacturing method of the same
08/02/2005US6924552 Multilayered integrated circuit with extraneous conductive traces
08/02/2005US6924551 Through silicon via, folded flex microelectronic package
08/02/2005US6924550 comprises die and an interposer substrate which includes depositing solder ball onto a ball-pad on the interposer substrate and molding to form casing; integrated circuits
08/02/2005US6924549 Semiconductor device and a method of manufacturing the same
08/02/2005US6924548 Semiconductor device and its manufacturing method with leads that have an inverted trapezoid-like section
08/02/2005US6924547 Memory card
08/02/2005US6924545 Low-dielectric-constant interlayer insulating film composed of borazine-silicon-based polymer and semiconductor device
08/02/2005US6924540 Integrated circuit device installed structure and installation method
08/02/2005US6924537 Semiconductor device including a potential drawing portion formed at a corner
08/02/2005US6924533 Semiconductor integrated circuit device incorporating overvoltage protection circuit
08/02/2005US6924505 Semiconductor device having a measuring pattern and a method of measuring the semiconductor device using the measuring pattern
08/02/2005US6924497 Systems for measuring stresses in line features formed on substrates
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