Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/2005
08/04/2005US20050167814 Method of making microelectronic packages including electrically and/or thermally conductive element
08/04/2005US20050167812 Semiconductor device, three-dimensional semiconductor device, and method of manufacturing semiconductor device
08/04/2005US20050167811 Module power distribution network
08/04/2005US20050167810 Stacked semiconductor device
08/04/2005US20050167809 Storage apparatus, card type string apparatus, and electronic apparatus
08/04/2005US20050167808 Semiconductor device, its fabrication method and electronic device
08/04/2005US20050167807 Enhanced adhesion strength between mold resin and polyimide
08/04/2005US20050167806 Method and apparatus for providing an integrated circuit cover
08/04/2005US20050167805 Semiconductor device and manufacturing method thereof
08/04/2005US20050167804 Substrate for packaging IC device and method for manufacturing the same
08/04/2005US20050167803 Film substrate, fabrication method thereof, and image display substrate
08/04/2005US20050167802 Semiconductor device
08/04/2005US20050167801 Structure and method for improved heat conduction for semiconductor devices
08/04/2005US20050167800 Semiconductor device and method of manufacturing same
08/04/2005US20050167799 Method of fabricating wafer-level packaging with sidewall passivation and related apparatus
08/04/2005US20050167798 Die-wafer package and method of fabricating same
08/04/2005US20050167797 Structure package
08/04/2005US20050167796 Miniaturised surface mount optoelectronic component
08/04/2005US20050167795 Electronic devices and its production methods
08/04/2005US20050167794 Semiconductor device and method of manufacturing same
08/04/2005US20050167793 Assembly and method for modified bus bar with Kapton™ tape or insulative material on LOC packaged part
08/04/2005US20050167792 Integral ceramic circuit board and method for producing the same
08/04/2005US20050167791 Lead frame, semiconductor chip package using the lead frame, and method of manufacturing the semiconductor chip package
08/04/2005US20050167790 Integrated circuit package with transparent encapsulant and method for making thereof
08/04/2005US20050167789 Surface mountable hermetically sealed package
08/04/2005US20050167788 Semiconductor device and method of manufacturing same
08/04/2005US20050167783 Wafer collective reliability evaluation device and wafer collective reliability evaluation method
08/04/2005US20050167782 Semiconductor device having an aligned transistor and capacitive element
08/04/2005US20050167780 High Q factor integrated circuit inductor
08/04/2005US20050167776 Vertical-type power metal oxide semiconductor device with excess current protective function
08/04/2005US20050167742 Power semiconductor devices and methods of manufacture
08/04/2005US20050167728 Single-poly 2-transistor based fuse element
08/04/2005US20050167720 Semiconductor device and its manufacturing method
08/04/2005US20050167718 Semiconductor device, DRAM integrated circuit device, and method of producing the same
08/04/2005US20050167717 Semiconductor memory device and method for manufacturing the same
08/04/2005US20050167714 Wiring layer structure for ferroelectric capacitor
08/04/2005US20050167702 Cross-fill pattern for metal fill levels, power supply filtering, and analog cirucit shielding
08/04/2005US20050167701 Method for fabrication of semiconductor device
08/04/2005US20050167688 Luminescent card device
08/04/2005US20050167679 Submount and semiconductor device
08/04/2005US20050167668 Nonvolatile semiconductor memory and manufacturing method for the same
08/04/2005US20050167661 Lithography evaluating method, semiconductor device manufacturing method and program medium
08/04/2005US20050167647 Thermal interface material and method for manufacturing same
08/04/2005US20050167492 Smart tag holder and cover housing
08/04/2005US20050167154 Printed wiring board
08/04/2005US20050167137 Electronic part and method of manufacturing the same
08/04/2005US20050167086 Brazed wick for a heat transfer device and method of making same
08/04/2005US20050167085 Graphite-based heat sinks and method and apparatus for the manufacture thereof
08/04/2005US20050167084 Graphite-based heat sinks and method and apparatus for the manufacture thereof
08/04/2005US20050167083 Heat sink including redundant fan sinks
08/04/2005US20050167082 Heat sink-type cooling device for an integrated circuit
08/04/2005US20050166834 Rare earth-oxides, rare earth-nitrides, rare earth-phosphides and ternary alloys with silicon
08/04/2005DE4408020B4 Verfahren zur Herstellung von Siliziumchips mit Prüfstrukturen Process for the preparation of silicon chips with test structures
08/04/2005DE4313980B4 Integrierte Hybridschaltung und Verfahren zu deren Herstellung A hybrid integrated circuit, and processes for their preparation
08/04/2005DE19733412B4 Verfahren zur automatischen Nachbeschriftung von Wafern. A method for automatically Nachbeschriftung of wafers.
08/04/2005DE10361714A1 Structural semiconductor element with entry/exit regions (S) and a control region useful for transistors with local excess temperature protection
08/04/2005DE10361696A1 Integrated semiconductor circuit has at least two modules or chips in a common housing that are galvanically separated by an integrated microprocessed structure
08/04/2005DE10303933B4 Halbleiterbauelement mit verringerter anschlussbedingter parasitärer Induktivität und/oder Kapazität Semiconductor device with reduced parasitic inductance connection-related and / or capacity
08/04/2005DE10248224B4 Verfahren zur Justage und zur Belichtung eines Halbleiterwafers A method for adjustment and for exposure of a semiconductor wafer
08/04/2005DE102005001856A1 Packungsleiterplatte, Herstellungs- und Spannungsbereitstellungsverfahren Pack PCB, manufacturing and voltage provisioning procedures
08/04/2005DE102004063143A1 Dummy-Schicht bei einem Halbleiter-Bauelement und Herstellungsverfahren dafür Dummy layer in a semiconductor device and manufacturing method thereof
08/04/2005DE102004062835A1 Fabrication of dual damascene pattern involves forming via hole and trench up to respective predetermined depth, extending the via hole, and etching protective film exposed through the via hole to expose lower conductive pattern
08/04/2005DE102004062392A1 Verfahren zum Bilden einer Metallverdrahtung einer Halbleitervorrichtung A method of forming a metal wiring of a semiconductor device
08/04/2005DE102004062214A1 Halbleitervorrichtung mit Temperaturerfassungsfunktion A semiconductor device comprising temperature detection function
08/04/2005DE102004060935A1 Leistungshalbleitervorrichtung Power semiconductor device
08/04/2005DE102004057526A1 Stapelkühler Stack Cool
08/04/2005DE102004031518A1 Verfahren zum Bilden einer Metallverdrahtung in Halbleiterbauelementen A method of forming a metal wiring in semiconductor devices
08/04/2005DE102004023819A1 Kühlkörper und Durchgänge davon mit mehrfachen Richtungen Heat sink and passages of which have multiple directions
08/04/2005DE102004019724A1 Memory module with bracing element for reducing bending stress, with circuit board carrying semiconductor memory component
08/04/2005DE102004019428A1 Semiconductor component with hollow space housing as for sensor chips has plastic housing and carrier for wiring plate
08/04/2005DE102004002743A1 Cooling body for power electronics especially in automotive field has a thick coating of ceramic or hard material applied by thermal spraying or vapor deposition
08/04/2005DE102004002165A1 Sensor module especially a pressure sensor has chip on metal lead frame with stress sensitive measuring structure and holes in housing to chip and lead frame
08/04/2005DE102004002163A1 Gas sensor module, used for detecting individual gases, e.g. in vehicle air conditioning plant for measuring ambient air or detecting carbon dioxide leakage, has stack of thermopile and cap chips and bonded filter in molded housing
08/04/2005DE102004001108A1 Product production process for chips and actuators places foil and component on a substrate with a gap between them that is closed by foil wrinkling
08/04/2005DE10033977B4 Zwischenverbindungsstruktur zum Einsatz von Halbleiterchips auf Schichtträgern Interconnect structure for the use of the semiconductor chip on film carriers
08/04/2005CA2552080A1 Thermally conductive thermoplastic resin compositions
08/03/2005EP1560271A2 Optical device
08/03/2005EP1560270A2 Optical device
08/03/2005EP1560267A1 Integrated multi-chip chip scale package
08/03/2005EP1560266A2 Hermetic surface mounted power package
08/03/2005EP1560264A1 Interconnection structure and method of forming same
08/03/2005EP1560257A2 Metallic photonic box, its fabrication method and light source therewith
08/03/2005EP1560030A1 Method and apparatus for testing integrated circuits for susceptibility to latch-up
08/03/2005EP1559982A2 Modular capillary pumped loop cooling system
08/03/2005EP1559801A1 Metallic material for electronic part, electronic part, electronic equipment, method of working metallic material, process for producing electronic part and electronic optical part
08/03/2005EP1559738A1 Polyimide film and process for producing the same
08/03/2005EP1559131A2 Semiconductor arrangement
08/03/2005EP1558869A2 Vacuum heat insulator and its manufacturing method
08/03/2005EP1558679A1 Heat conductive silicone composition
08/03/2005EP1558678A1 Toughened epoxy / polyanhydride no- flow underfill encapsulant composition
08/03/2005EP1558403A1 Thermally conductive emi shield
08/03/2005EP1470583A4 Chip and wafer integration process using vertical connections
08/03/2005CN2715348Y LED with heat radiation function
08/03/2005CN2715347Y Combined type radiator
08/03/2005CN2715346Y 散热器 Heat sink
08/03/2005CN2715345Y 散热器 Heat sink
08/03/2005CN2715344Y Freezing radiator
08/03/2005CN2715343Y 散热器 Heat sink
08/03/2005CN2715342Y A CPU heat sink
08/03/2005CN1650680A Circuit board with at least one electronic component
1 ... 1333 1334 1335 1336 1337 1338 1339 1340 1341 1342 1343 1344 1345 1346 1347 1348 1349 1350 1351 1352 1353 ... 2262